公开(公告)号：US09883593B2

公开(公告)日：2018-01-30

申请号：US14714531

申请日：2015-05-18

申请人： KyongSoon Cho ,  Yungcheol Kong

发明人： KyongSoon Cho ,  Yungcheol Kong

IPC分类号： H05K1/00 ,  H05K1/18 ,  H01L25/16 ,  H01L25/065 ,  H01L25/10 ,  H05K1/02 ,  H01L23/13 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H05K3/46

CPC分类号： H05K1/189 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/06 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/028 ,  H05K1/181 ,  H05K3/4697 ,  H05K2201/09845 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2224/83 ,  H01L2224/81

摘要： Provided are semiconductor modules and semiconductor packages. The semiconductor module may include a module substrate and a semiconductor package mounted on the module substrate. The semiconductor package may include a substrate with a top surface and a bottom surface. Here, the top surface of the substrate may be flat and the bottom surface of the substrate may include a first region and a second region positioned at a lower level than the first region. The semiconductor package may further include connecting portions which are provided on the bottom surface of the substrate and electrically connected to the module substrate.