公开(公告)号：US09947558B2

公开(公告)日：2018-04-17

申请号：US15235660

申请日：2016-08-12

Applicant: Lam Research Corporation

Inventor： Lin Xu ,  Hong Shih ,  Robin Koshy ,  John Daugherty ,  Satish Srinivasan

IPC: H01L21/31 ,  H01L21/67 ,  H01L21/3213 ,  H01L21/311 ,  H01L21/02

CPC classification number: H01L21/67069 ,  H01L21/02123 ,  H01L21/31116 ,  H01L21/31144 ,  H01L21/32137 ,  H01L21/67086 ,  H01L21/6831

Abstract: A method for conditioning and cleaning a silicon part is provided. The silicon part is heated to a temperature of at least 300° C. in the presence of oxygen to form an outer surface of the silicon part into silicon oxide. The silicon part is placed in a wet bath wherein the bath is a solution that selectively etches silicon oxide with respect to silicon.

公开(公告)号：US12249490B2

公开(公告)日：2025-03-11

申请号：US17770147

申请日：2020-10-21

Applicant: LAM RESEARCH CORPORATION

Inventor： Lin Xu ,  Douglas Detert ,  John Daugherty ,  Pankaj Hazarika ,  Satish Srinivasan ,  Nash W. Anderson ,  John Michael Kerns ,  Robin Koshy ,  David Joseph Wetzel ,  Lei Liu ,  Eric A. Pape

IPC: H01J37/32

Abstract: A component of a plasma processing chamber having at least one plasma facing surface of the component comprises single crystal metal oxide material. The component can be machined from a single crystal metal oxide ingot. Suitable single crystal metal oxides include spinel, yttrium oxide, and yttrium aluminum garnet (YAG). A single crystal metal oxide can be machined to form a gas injector of a plasma processing chamber.

公开(公告)号：US11087961B2

公开(公告)日：2021-08-10

申请号：US15910739

申请日：2018-03-02

Applicant: Lam Research Corporation

Inventor： Lin Xu ,  Robin Koshy ,  John E. Daugherty ,  Satish Srinivasan ,  David Wetzel

IPC: H01J37/32 ,  C23C16/40 ,  C23C16/56 ,  C23C16/455

Abstract: A quartz structure includes a protective layer comprising yttrium oxide. The quartz structure may be fabricated by: (a) receiving a quartz structure; and (b) coating the quartz structure with a protective layer comprising yttrium oxide to form a part to be used in the plasma reactor. The part has a size and shape adapted for forming a window or injector in a plasma reactor. The protective layer does not substantially change the size or shape of the quartz structure. The part may be installed in the plasma reactor at a location where, during operation, a plasma will contact or be proximate to the part.

公开(公告)号：US20210343510A1

公开(公告)日：2021-11-04

申请号：US17305883

申请日：2021-07-16

Applicant: Lam Research Corporation

Inventor： Lin Xu ,  Robin Koshy ,  John E. Daugherty ,  Satish Srinivasan ,  David Wetzel

IPC: H01J37/32 ,  C23C16/40 ,  C23C16/56 ,  C23C16/455

Abstract: A quartz structure includes a protective layer comprising yttrium oxide. The quartz structure may be fabricated by: (a) receiving a quartz structure; and (b) coating the quartz structure with a protective layer comprising yttrium oxide to form a part to be used in the plasma reactor. The part has a size and shape adapted for forming a window or injector in a plasma reactor. The protective layer does not substantially change the size or shape of the quartz structure. The part may be installed in the plasma reactor at a location where, during operation, a plasma will contact or be proximate to the part.

公开(公告)号：US20190272981A1

公开(公告)日：2019-09-05

申请号：US15910739

申请日：2018-03-02

Applicant: Lam Research Corporation

Inventor： Lin Xu ,  Robin Koshy ,  John E. Daugherty ,  Satish Srinivasan ,  David Wetzel

IPC: H01J37/32 ,  C23C16/40 ,  C23C16/56 ,  C23C16/455

Abstract: A quartz structure includes a protective layer comprising yttrium oxide. The quartz structure may be fabricated by: (a) receiving a quartz structure; and (b) coating the quartz structure with a protective layer comprising yttrium oxide to form a part to be used in the plasma reactor. The part has a size and shape adapted for forming a window or injector in a plasma reactor. The protective layer does not substantially change the size or shape of the quartz structure. The part may be installed in the plasma reactor at a location where, during operation, a plasma will contact or be proximate to the part.