公开(公告)号：US10434809B2

公开(公告)日：2019-10-08

申请号：US14913598

申请日：2014-10-16

申请人： LG CHEM, LTD.

发明人： Beom Mo Koo ,  Seung Heon Lee ,  Ji Young Hwang ,  Yong Goo Son ,  Jooyeon Kim ,  Jeseob Park ,  Kun Seok Lee

IPC分类号： B05C11/04 ,  B05C11/02 ,  B41N10/02 ,  B05D3/00

摘要： The present specification relates to an apparatus for manufacturing a blanket. The apparatus includes a surface plate on which a substrate film is supplied; a coating unit coating a blanket composition on the substrate film; and a comma blade horizontally moving on the surface plate coated with the blanket composition. Of the whole surface of the comma blade, the surface contacting the blanket composition is an angular surface. This application also relates to a method for manufacturing a blanket, a blanket manufactured using the same, a reverse offset printing roll provided with the blanket, and a reverse offset printing apparatus including the same.

公开(公告)号：US10212820B2

公开(公告)日：2019-02-19

申请号：US14402265

申请日：2013-05-31

申请人： LG CHEM, LTD.

发明人： Jiehyun Seong ,  Seung Heon Lee ,  Ji Young Hwang ,  Yong Goo Son

IPC分类号： H05K3/00 ,  B41F35/06 ,  B41F35/00 ,  B41F35/02 ,  B41F16/00 ,  H05K3/12

摘要： The present specification describes a reverse offset printing apparatus and a method.

公开(公告)号：US09764541B2

公开(公告)日：2017-09-19

申请号：US14402829

申请日：2013-05-31

申请人： LG CHEM, LTD.

发明人： Jiehyun Seong ,  Seung Heon Lee ,  Yong Goo Son ,  Ji Young Hwang

IPC分类号： B41N1/12 ,  B41N1/00 ,  B41C1/06 ,  B41C1/00 ,  G03F7/20

CPC分类号： B41C1/06 ,  B41C1/00 ,  G03F7/2002 ,  G03F7/201

摘要： The present specification describes a cliché, a method of manufacturing the cliché, and a printing method using the cliché.

公开(公告)号：US09750131B2

公开(公告)日：2017-08-29

申请号：US14774593

申请日：2014-07-30

申请人： LG CHEM, LTD.

发明人： Jiehyun Seong ,  Jinmi Jung ,  Yong Goo Son ,  Seung Heon Lee ,  Song Ho Jang ,  Bu Gon Shin ,  Ji Young Hwang

IPC分类号： H05K1/00 ,  H05K1/02 ,  H01L51/00 ,  H01L51/10 ,  H01L51/44 ,  H01L51/52 ,  H05K1/03 ,  H05K1/09 ,  H05K3/06

CPC分类号： H05K1/0274 ,  H01L51/0023 ,  H01L51/105 ,  H01L51/442 ,  H01L51/445 ,  H01L51/5212 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0108 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/09681 ,  Y02E10/549 ,  Y02P70/521

摘要： Provided are a transparent conductive laminate, a transparent electrode including the transparent conductive laminate, and a manufacturing method for the transparent conductive laminate.

公开(公告)号：US11812524B2

公开(公告)日：2023-11-07

申请号：US16650312

申请日：2018-12-05

申请人： LG CHEM, LTD.

发明人： Jiehyun Seong ,  Jung Il Yoon ,  Sang Hoon Son ,  Kiseok Lee ,  Yong Goo Son ,  Jooyeon Kim ,  Jong Sung Park ,  Seung Heon Lee

IPC分类号： H05B3/86 ,  B32B15/20 ,  B32B27/36 ,  B32B37/02 ,  B32B37/24 ,  B32B15/09 ,  B32B17/10 ,  H05B3/36

CPC分类号： H05B3/86 ,  B32B15/09 ,  B32B15/20 ,  B32B17/10036 ,  B32B17/10385 ,  B32B17/10761 ,  B32B27/36 ,  B32B37/02 ,  B32B37/24 ,  H05B3/36 ,  B32B2037/243 ,  B32B2250/40 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2311/12 ,  B32B2329/06 ,  B32B2367/00 ,  B32B2605/006 ,  H05B2203/002

摘要： The heating film including: a transparent substrate; a coating layer provided on the transparent substrate and having a refractive index of 1.450 to 1.485; and a metal foil pattern provided on the coating layer, in which a ten-point average roughness (Rz) of a surface of the metal foil pattern is more than 0.9 μm.

公开(公告)号：US11223001B2

公开(公告)日：2022-01-11

申请号：US16971933

申请日：2019-08-20

申请人： LG CHEM, LTD.

发明人： Kun Seok Lee ,  Yong Goo Son ,  Kiseok Lee ,  Seung Heon Lee

IPC分类号： H01L33/62 ,  H01L25/075

摘要： An electrode substrate for a transparent light emitting device display according to an embodiment of the this application comprises: a transparent substrate; (M rows×N columns) light emitting device pad portions provided on the transparent substrate as a matrix; and a first common electrode wiring portion, a second common electrode wiring portion, and a signal electrode wiring portion which are provided on the transparent substrate and connected to the light emitting device pad portions, respectively, in which each of the first common electrode wiring portion, the second common electrode wiring portion, and the signal electrode wiring portion comprises a metal mesh pattern, and line resistance of the first common electrode wiring portion or the second common electrode wiring portion connected to the light emitting device pad portions constituting one row among the light emitting device pad portions satisfies Equation 1 above.

公开(公告)号：US11171259B2

公开(公告)日：2021-11-09

申请号：US16619034

申请日：2018-09-14

申请人： LG CHEM, LTD.

发明人： Yong Goo Son ,  Jooyeon Kim ,  Kun Seok Lee ,  Seung Heon Lee

IPC分类号： H01L33/38 ,  H01L25/075 ,  H01L33/00 ,  H01L33/42

摘要： An electrode substrate for a transparent light emitting device display containing a transparent substrate; a wire electrode unit, which is provided on the transparent substrate and comprises a metal mesh pattern; and at least one light emitting device mounting unit provided on the transparent substrate, in which both an upper surface and a lateral surface of the metal mesh pattern of the wire electrode unit comprise a darkening layer pattern, and both an upper surface and a lateral surface of the light emitting device mounting unit do not comprise a darkening layer pattern.

公开(公告)号：US10606175B2

公开(公告)日：2020-03-31

申请号：US15741993

申请日：2017-01-04

申请人： LG CHEM, LTD.

发明人： Yong Goo Son ,  Seung Heon Lee ,  Han Min Seo ,  Chang Yoon Lim ,  Ji Eun Myung ,  Kiseok Lee

IPC分类号： G03F7/20 ,  H05K1/02 ,  H05K1/09 ,  H01L51/52 ,  G03F7/038 ,  G03F7/16 ,  G03F7/32 ,  H05K3/00 ,  H05K3/12

摘要： The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.

公开(公告)号：US09258889B2

公开(公告)日：2016-02-09

申请号：US14560862

申请日：2014-12-04

申请人： LG Chem, Ltd.

发明人： Ji Young Hwang ,  Min Choon Park ,  Yong Goo Son ,  Beom Mo Koo

IPC分类号： H05K1/02 ,  H05K3/10 ,  G06F3/041 ,  H05K1/09 ,  H05K3/00 ,  H05K3/06 ,  H05K7/02

CPC分类号： H05K1/0274 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/09 ,  H05K3/002 ,  H05K3/06 ,  H05K3/10 ,  H05K3/285 ,  H05K7/02 ,  H05K2201/2054 ,  Y10T29/49155

摘要： Provided are a conductive structure including a) a base, b) a conductive pattern provided on at least one side of the base, and c) a darkening layer provided on the upper surface and lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern area, and a touch panel including the same and a manufacturing method thereof.

摘要翻译： 提供一种导电结构，其包括：a）基底，b）设置在基底的至少一侧上的导电图案，以及c）设置在导电图案的上表面和下表面上的变暗层，设置在至少一个 并且设置在与导电图案区域相对应的区域中，以及包括该导电图案区域的触摸面板及其制造方法。

公开(公告)号：US20150129290A1

公开(公告)日：2015-05-14

申请号：US14383812

申请日：2013-04-22

申请人： LG CHEM, LTD.

发明人： Jiehyun Seong ,  Seung Heon Lee ,  Young Chang Byun ,  Jung Hyun Seo ,  Jooyeon Kim ,  In-Seok Hwang ,  Yong Goo Son ,  Beom Mo Koo

IPC分类号： H05K1/09 ,  H05K3/10

CPC分类号： H05K1/092 ,  C09J7/10 ,  C09J2201/28 ,  C09J2201/602 ,  C09J2203/326 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/09 ,  H05K3/046 ,  H05K3/105 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2203/0522 ,  Y10T156/10

摘要： The present invention relates to an adhesive substrate for forming a conductive pattern, which includes an adhesive substrate, and a precursor pattern of a conductive pattern, or a conductive pattern, provided on one side of the adhesive substrate, a method for preparing a conductive pattern using the adhesive substrate, a conductive pattern prepared using the adhesive substrate, and an electronic device including the conductive pattern.

摘要翻译： 本发明涉及一种用于形成导电图案的粘合剂基底，其包括粘合剂基底和设置在粘合剂基底的一侧上的导电图案或导电图案的前体图案，制备导电图案的方法 使用粘合剂基材，使用粘合剂基材制备的导电图案和包括导电图案的电子装置。