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公开(公告)号：US20230156979A1
公开(公告)日：2023-05-18
申请号：US17916923
申请日：2021-04-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Jae Hoo JUNG , Geun Ho KIM
CPC classification number: H05K7/20927 , H02M3/003 , H05K7/2039
Abstract: A converter module according to an embodiment of the present invention comprises: a heat dissipation member of a plate shape, having a flow path therein; a first module arranged on one surface of the heat dissipation member; and a second module arranged on the other surface of the heat dissipation member, wherein the heat dissipation member is formed integrally with the flow path inserted therein.
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公开(公告)号：US20220247305A1
公开(公告)日：2022-08-04
申请号：US17575992
申请日：2022-01-14
Applicant: LG INNOTEK CO., LTD.
Inventor： Ji Hoon KIM , Geun Ho KIM , Hyun Min NA , Jae Hoo JUNG , Seok BAE , Jai Hoon YEOM
Abstract: The present embodiment relates to a DC-DC converter including: a housing; a plurality of electronic components disposed inside the housing; and a flow path disposed on a lower plate of the housing. The flow path includes an expanding portion. The horizontal width of the expanding portion is greater than the horizontal width of a flow path on the front end of the expanding portion, and the vertical width of the expanding portion is less than the vertical width of the flow path on the front end of the expanding portion. The differential between the part wherein the surface area of the vertical cross section of the flow path is the biggest and the part wherein the surface area of the vertical cross section of the flow path is the smallest is 10% or less.
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公开(公告)号：US20210136953A1
公开(公告)日：2021-05-06
申请号：US17146927
申请日：2021-01-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Geun Ho KIM , Ji Hyeon BAIK , Jae Hoo JUNG
IPC: H05K7/20
Abstract: A converter comprises: a housing; a plurality of heat generating elements arranged at one surface of the housing; and a fluid channel arranged at the other surface of the housing, wherein the fluid channel includes an inlet and an outlet which connect and pass through an outside and an inside of the housing, is formed by a single line from the inlet to the outlet, has a constant cross-sectional area, and is arranged at a position where the fluid channel overlaps the plurality of heat generating elements in a vertical direction.
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Patent Agency Ranking
公开(公告)号：US20190252971A1
公开(公告)日：2019-08-15
申请号：US16343963
申请日：2017-11-17
Applicant: LG INNOTEK CO., LTD.
Inventor： Ji Hoon KIM , Geun Ho KIM , Hyun Min NA , Jae Hoo JUNG , Seok BAE , Jai Hoon YEOM
CPC classification number: H02M1/32 , H02M3/33576 , H02M2001/327
Abstract: The present embodiment relates to a DC-DC converter comprising: a housing; a plurality of electronic components disposed inside the housing; and a flow path disposed on a lower plate of the housing. The flow path comprises an expanding portion. The horizontal width of the expanding portion is greater than the horizontal width of a flow path on the front end of the expanding portion, and the vertical width of the expanding portion is less than the vertical width of the flow path on the front end of the expanding portion. The differential between the part wherein the surface area of the vertical cross section of the flow path is the biggest and the part wherein the surface area of the vertical cross section of the flow path is the smallest is 10% or less.
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公开(公告)号：US20200053912A1
公开(公告)日：2020-02-13
申请号：US16490392
申请日：2018-03-19
Applicant: LG INNOTEK CO., LTD.
Inventor： Geun Ho KIM , Ji Hyeon BAIK , Jae Hoo JUNG
IPC: H05K7/20
Abstract: A converter comprises: a housing; a plurality of heat generating elements arranged at one surface of the housing; and a fluid channel arranged at the other surface of the housing, wherein the fluid channel includes an inlet and an outlet which connect and pass through an outside and an inside of the housing, is formed by a single line from the inlet to the outlet, has a constant cross-sectional area, and is arranged at a position where the fluid channel overlaps the plurality of heat generating elements in a vertical direction.
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公开(公告)号：US20170256617A1
公开(公告)日：2017-09-07
申请号：US15598820
申请日：2017-05-18
Applicant: LG Electronics Inc. , LG Innotek Co., Ltd.
Inventor： Jun Ho JANG , Geun Ho KIM
IPC: H01L29/167 , H01L33/62 , H01L33/00 , H01L33/58 , H01L29/866 , H01L33/20 , H01L33/48 , H01L33/40 , H01L33/60 , H01L33/44 , H01L33/38 , H01L25/16 , H01L33/32
CPC classification number: H01L29/167 , H01L25/167 , H01L29/866 , H01L33/0079 , H01L33/0095 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/405 , H01L33/44 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2933/0033 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device package can include a sub-mount having a first surface, a second surface, a bottom surface and a cavity; a first layer on the first surface; a second layer on the second surface; a third layer on the bottom surface; a light emitting device on the first layer and including a supporting layer including an anti-diffusion layer, a first electrode on the supporting layer, a semiconductor light emitting structure electrically connected to the first electrode, and a second electrode electrically connected to the semiconductor light emitting structure, in which the first and second electrodes electrically connect to the first layer and the second layer, respectively, and the semiconductor light emitting structure includes a light extraction structure; an ESD property improving diode on the second surface, electrically connected to the second layer and arranged a distance apart from the light emitting device, and a lens on the sub-mount.
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公开(公告)号：US20160190258A1
公开(公告)日：2016-06-30
申请号：US15059881
申请日：2016-03-03
Applicant: LG ELECTRONICS INC. , LG INNOTEK CO., LTD.
Inventor： Jun Ho JANG , Geun Ho KIM
IPC: H01L29/167 , H01L33/62 , H01L33/58 , H01L33/20 , H01L33/44 , H01L33/38 , H01L33/40 , H01L29/866 , H01L33/48
CPC classification number: H01L29/167 , H01L25/167 , H01L29/866 , H01L33/0079 , H01L33/0095 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/405 , H01L33/44 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2933/0033 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device having a vertical structure and a package thereof, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity. The device and package include a sub-mount, a first-type electrode, a second-type electrode, a light emitting device, a zener diode, and a lens on the sub-mount.
Abstract translation: 一种具有垂直结构和封装的发光器件，其能够抑制在衬底分离过程中产生的冲击，并且实现批量生产率的提高。 该装置和封装包括副安装座，第一型电极，第二类型电极，发光装置，齐纳二极管和子安装座上的透镜。
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公开(公告)号：US20140217452A1
公开(公告)日：2014-08-07
申请号：US14248179
申请日：2014-04-08
Applicant: LG ELECTRONICS INC. , LG INNOTEK CO., LTD.
Inventor： Jun Ho JANG , Geun Ho KIM
CPC classification number: H01L29/167 , H01L25/167 , H01L29/866 , H01L33/0079 , H01L33/0095 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/405 , H01L33/44 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2933/0033 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device having a vertical structure and a package thereof, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity. The device and package include a sub-mount, a first-type electrode, a second-type electrode, a light emitting device, a zener diode, and a lens on the sub-mount.
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