Light emitting device, light emitting device package, and lighting system
    2.
    发明授权
    Light emitting device, light emitting device package, and lighting system 有权
    发光装置,发光装置封装和照明系统

    公开(公告)号:US09076947B2

    公开(公告)日:2015-07-07

    申请号:US14230715

    申请日:2014-03-31

    CPC classification number: H01L33/62 H01L33/641 H01L2924/0002 H01L2924/00

    Abstract: Provided is a light emitting device. The light emitting device comprises: In one embodiment, a light emitting device includes: a light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; and a conductive support member under the light emitting structure. The conductive support member comprises a first conductive support member and a second conductive support member. The second conductive support member has a thermal conductivity higher than that of the first conductive support member.

    Abstract translation: 提供了一种发光装置。 发光器件包括:在一个实施例中,发光器件包括:发光结构,包括第一导电类型半导体层,第二导电类型半导体层和在第一导电类型半导体层和第二导电类型半导体层之间的有源层 型半导体层; 以及在发光结构下方的导电支撑构件。 导电支撑构件包括第一导电支撑构件和第二导电支撑构件。 第二导电支撑构件的导热率高于第一导电支撑构件的导热性。

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