公开(公告)号：US09847459B2

公开(公告)日：2017-12-19

申请号：US15356027

申请日：2016-11-18

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Kyoon Kim ,  Min Gyu Na ,  Myeong Soo Kim

IPC: H01L33/38 ,  H01L33/40 ,  H01L33/62 ,  H01L33/12 ,  H01L33/06 ,  H01L33/42 ,  H01L33/14 ,  H01L33/30 ,  H01L33/08

CPC classification number: H01L33/387 ,  H01L33/06 ,  H01L33/08 ,  H01L33/12 ,  H01L33/145 ,  H01L33/30 ,  H01L33/382 ,  H01L33/385 ,  H01L33/405 ,  H01L33/42 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Disclosed are a light emitting device, a method of manufacturing a light emitting device, a light emitting device package and a lighting system. The light emitting device includes a substrate; a first conductive semiconductor layer on the substrate; an active layer on the first conductive semiconductor layer; a second conductive semiconductor layer on the active layer; a contact layer on the second conductive semiconductor layer; an insulating layer on the contact layer; a first branch electrode electrically connected to the first conductive semiconductor layer; a plurality of first via electrodes connected to the first branch electrode and electrically connected to the first conductive semiconductor layer by passing through the insulating layer; a first pad electrode electrically connected to the first branch electrode; a second pad electrode contacts the contact layer by passing through the insulating layer; a second branch electrode connected to the second pad electrode and disposed on the insulating layer; and a plurality of second via electrodes provided through provided through the insulating layer to electrically connect the second branch electrode to the contact layer.

公开(公告)号：US09172015B2

公开(公告)日：2015-10-27

申请号：US14496490

申请日：2014-09-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Kyoon Kim ,  Woo Sik Lim ,  Myeong Soo Kim ,  Sung Ho Choo ,  Min Gyu Na

IPC: H01L33/38 ,  H01L33/58 ,  H01L33/00 ,  H01L33/20 ,  H01L33/40 ,  H01L33/42

CPC classification number: H01L33/58 ,  H01L33/007 ,  H01L33/20 ,  H01L33/382 ,  H01L33/387 ,  H01L33/405 ,  H01L33/42 ,  H01L2224/48091 ,  H01L2933/0016 ,  H01L2924/00014

Abstract: Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a light emitting structure layer, a second electrode, a first electrode, a contact portion, and a first electrode layer. The first electrode is disposed in the substrate from a lower part of the substrate to a lower part of a first conductive type semiconductor layer in a region under an active layer. The contact portion is wider than the first electrode and makes contact with the lower part of the first conductive type semiconductor layer. The first electrode layer is disposed under the substrate and connected to the first electrode.

Abstract translation: 提供了一种发光器件，发光器件封装和照明系统。 发光器件包括衬底，发光结构层，第二电极，第一电极，接触部分和第一电极层。 第一电极在有源层下方的区域中从基板的下部到第一导电型半导体层的下部设置在基板中。 接触部分比第一电极宽，并与第一导电型半导体层的下部接触。 第一电极层设置在基板下方并连接到第一电极。

公开(公告)号：US10217902B2

公开(公告)日：2019-02-26

申请号：US15555428

申请日：2016-02-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Kyoon Kim ,  Min Gyu Na

IPC: H01L33/36 ,  H01L33/50 ,  H01L33/62 ,  H01L23/00 ,  H01L33/08 ,  H01L25/075 ,  H01L33/38

Abstract: A light-emitting device includes a substrate, first and second electrode pads, first to M-th light-emitting cells arranged in a line in a first direction between the first and second electrode pads, and first to N-th connection wires for electrically connecting the first to M-th light-emitting cells, wherein each of the first to M-th light-emitting cells comprises a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, wherein the first electrode pad is connected to the second conductive semiconductor layer of the first light-emitting cell while the second electrode pad is connected to the first conductive semiconductor layer of the M-th light-emitting cell, and an n-th connection wire electrically connects the first conductive semiconductor layer of an n-th light-emitting cell to the second conductive semiconductor layer of an (n+1)-th light-emitting cell, which are adjacent to each other.

公开(公告)号：US09368691B2

公开(公告)日：2016-06-14

申请号：US14606499

申请日：2015-01-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Ji Hyung Moon ,  Sung Kyoon Kim ,  Min Gyu Na

IPC: H01L33/12 ,  H01L33/46 ,  H01L27/15 ,  H01L33/40 ,  H01L33/42 ,  H01L33/10

CPC classification number: H01L33/46 ,  H01L27/156 ,  H01L33/10 ,  H01L33/405 ,  H01L33/42 ,  H01L2224/16225

Abstract: Disclosed is a light emitting device including a plurality of light emitting cells disposed on a substrate, at least one connection electrode for connecting the light emitting cells, and a first insulating layer disposed between adjacent light emitting cells, wherein each of the light emitting cells includes a light emitting structure including first and second conductive type semiconductor layers and an active layer, and a reflective layer disposed on the second conductive type semiconductor layer, wherein the connection electrode connects the first conductive type semiconductor layer of a first one of the adjacent light emitting cells to the reflective layer of a second one at the adjacent light emitting cells, and wherein a first width of the second conductive type semiconductor layer is the same as or greater than a second width of the reflective layer, and the first direction differs from a thickness direction of the light emitting structure.

Abstract translation: 公开了一种发光器件，其包括设置在衬底上的多个发光单元，用于连接发光单元的至少一个连接电极和设置在相邻发光单元之间的第一绝缘层，其中每个发光单元包括 包括第一和第二导电类型半导体层和有源层的发光结构和设置在第二导电类型半导体层上的反射层，其中连接电极将相邻发光的第一导体类型的第一导体类型半导体层 在第二导电型半导体层的第一宽度与反射层的第二宽度相同或者大于第二宽度的第二宽度，并且第一方向与 发光结构的厚度方向。

公开(公告)号：US10128412B2

公开(公告)日：2018-11-13

申请号：US15134145

申请日：2016-04-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Gyu Na ,  Sung Ho Choo ,  Hyun Seoung Ju ,  Gi Seok Hong ,  Ji Hee No

IPC: H01L27/15 ,  H01L29/26 ,  H01L33/38 ,  H01L33/06

Abstract: A light emitting device is disclosed. The light emitting device includes a light emitting structure including a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer, a light-transmissive conductive layer disposed on the second conductive-type semiconductor layer and having a plurality of open regions through which the second conductive-type semiconductor layer is exposed, and a second electrode disposed on the light-transmissive conductive layer so as to extend beyond at least one of the open regions, wherein the second electrode contacts the second conductive-type semiconductor layer in the open regions and contacts the light-transmissive conductive layer in regions excluding the open regions.

公开(公告)号：US09525109B2

公开(公告)日：2016-12-20

申请号：US14930164

申请日：2015-11-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Kyoon Kim ,  Min Gyu Na ,  Myeong Soo Kim

IPC: H01L33/38 ,  H01L33/08 ,  H01L33/12 ,  H01L33/06 ,  H01L33/14 ,  H01L33/42 ,  H01L33/30

CPC classification number: H01L33/387 ,  H01L33/06 ,  H01L33/08 ,  H01L33/12 ,  H01L33/145 ,  H01L33/30 ,  H01L33/382 ,  H01L33/385 ,  H01L33/405 ,  H01L33/42 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Disclosed are a light emitting device, a method of manufacturing a light emitting device, a light emitting device package and a lighting system. The light emitting device includes a substrate; a first conductive semiconductor layer on the substrate; an active layer on the first conductive semiconductor layer; a second conductive semiconductor layer on the active layer; a contact layer on the second conductive semiconductor layer; an insulating layer on the contact layer; a first branch electrode electrically connected to the first conductive semiconductor layer; a plurality of first via electrodes connected to the first branch electrode and electrically connected to the first conductive semiconductor layer by passing through the insulating layer; a first pad electrode electrically connected to the first branch electrode; a second pad electrode contacts the contact layer by passing through the insulating layer; a second branch electrode connected to the second pad electrode and disposed on the insulating layer; and a plurality of second via electrodes provided through the insulating layer to electrically connect the second branch electrode to the contact layer.

Abstract translation: 公开了发光器件，制造发光器件的方法，发光器件封装和照明系统。 发光装置包括：基板; 在所述基板上的第一导电半导体层; 在第一导电半导体层上的有源层; 在所述有源层上的第二导电半导体层; 第二导电半导体层上的接触层; 接触层上的绝缘层; 电连接到第一导电半导体层的第一分支电极; 多个第一通孔电极，连接到第一分支电极，并通过绝缘层与第一导电半导体层电连接; 电连接到第一分支电极的第一焊盘电极; 第二焊盘电极通过绝缘层与接触层接触; 连接到所述第二焊盘电极并设置在所述绝缘层上的第二分支电极; 以及设置在所述绝缘层上的多个第二通孔电极，以将所述第二分支电极电连接到所述接触层。