ADAPTIVE MEMORY SYSTEM FOR ENHANCING THE PERFORMANCE OF AN EXTERNAL COMPUTING DEVICE
    1.
    发明申请
    ADAPTIVE MEMORY SYSTEM FOR ENHANCING THE PERFORMANCE OF AN EXTERNAL COMPUTING DEVICE 有权
    用于增强外部计算设备性能的自适应存储器系统

    公开(公告)号:US20140013039A1

    公开(公告)日:2014-01-09

    申请号:US13934137

    申请日:2013-07-02

    IPC分类号: G06F12/02 G06F12/08

    摘要: An adaptive memory system is provided for improving the performance of an external computing device. The adaptive memory system includes a single controller, a first memory type (e.g., Static Random Access Memory or SRAM), a second memory type (e.g., Dynamic Random Access Memory or DRAM), a third memory type (e.g., Flash), an internal bus system, and an external bus interface. The single controller is configured to: (i) communicate with all three memory types using the internal bus system; (ii) communicate with the external computing device using the external bus interface; and (iii) allocate cache-data storage assignment to a storage space within the first memory type, and after the storage space within the first memory type is determined to be full, allocate cache-data storage assignment to a storage space within the second memory type.

    摘要翻译: 提供了一种用于改善外部计算设备的性能的自适应存储器系统。 自适应存储器系统包括单个控制器,第一存储器类型(例如,静态随机存取存储器或SRAM),第二存储器类型(例如,动态随机存取存储器或DRAM),第三存储器类型(例如,闪存), 内部总线系统和外部总线接口。 单个控制器被配置为:(i)使用内部总线系统与所有三种存储器类型通信; (ii)使用外部总线接口与外部计算设备进行通信; 以及(iii)将缓存数据存储分配分配给所述第一存储器类型内的存储空间,并且在所述第一存储器类型中的所述存储空间被确定为满之后,将高速缓存数据存储分配分配给所述第二存储器内的存储空间 类型。

    Adaptive memory system for enhancing the performance of an external computing device
    3.
    发明授权
    Adaptive memory system for enhancing the performance of an external computing device 有权
    用于增强外部计算设备性能的自适应存储器系统

    公开(公告)号:US08918618B2

    公开(公告)日:2014-12-23

    申请号:US13934137

    申请日:2013-07-02

    摘要: An adaptive memory system is provided for improving the performance of an external computing device. The adaptive memory system includes a single controller, a first memory type (e.g., Static Random Access Memory or SRAM), a second memory type (e.g., Dynamic Random Access Memory or DRAM), a third memory type (e.g., Flash), an internal bus system, and an external bus interface. The single controller is configured to: (i) communicate with all three memory types using the internal bus system; (ii) communicate with the external computing device using the external bus interface; and (iii) allocate cache-data storage assignment to a storage space within the first memory type, and after the storage space within the first memory type is determined to be full, allocate cache-data storage assignment to a storage space within the second memory type.

    摘要翻译: 提供了一种用于改善外部计算设备的性能的自适应存储器系统。 自适应存储器系统包括单个控制器,第一存储器类型(例如,静态随机存取存储器或SRAM),第二存储器类型(例如,动态随机存取存储器或DRAM),第三存储器类型(例如,闪存), 内部总线系统和外部总线接口。 单个控制器被配置为:(i)使用内部总线系统与所有三种存储器类型通信; (ii)使用外部总线接口与外部计算设备进行通信; 以及(iii)将缓存数据存储分配分配给所述第一存储器类型内的存储空间,并且在所述第一存储器类型中的所述存储空间被确定为满之后,将高速缓存数据存储分配分配给所述第二存储器内的存储空间 类型。

    Adaptive memory system for enhancing the performance of an external computing device
    4.
    发明授权
    Adaptive memory system for enhancing the performance of an external computing device 有权
    用于增强外部计算设备性能的自适应存储器系统

    公开(公告)号:US08135933B2

    公开(公告)日:2012-03-13

    申请号:US11972537

    申请日:2008-01-10

    IPC分类号: G06F12/00 G06F13/00

    摘要: An adaptive memory system is provided for improving the performance of an external computing device. The adaptive memory system includes a single controller, a first memory type (e.g., Static Random Access Memory or SRAM), a second memory type (e.g., Dynamic Random Access Memory or DRAM), a third memory type (e.g., Flash), an internal bus system, and an external bus interface. The single controller is configured to: (i) communicate with all three memory types using the internal bus system; (ii) communicate with the external computing device using the external bus interface; and (iii) allocate cache-data storage assignment to a storage space within the first memory type, and after the storage space within the first memory type is determined to be full, allocate cache-data storage assignment to a storage space within the second memory type.

    摘要翻译: 提供了一种用于改善外部计算设备的性能的自适应存储器系统。 自适应存储器系统包括单个控制器,第一存储器类型(例如,静态随机存取存储器或SRAM),第二存储器类型(例如,动态随机存取存储器或DRAM),第三存储器类型(例如,闪存), 内部总线系统和外部总线接口。 单个控制器被配置为:(i)使用内部总线系统与所有三种存储器类型通信; (ii)使用外部总线接口与外部计算设备进行通信; 以及(iii)将缓存数据存储分配分配给所述第一存储器类型内的存储空间,并且在所述第一存储器类型中的所述存储空间被确定为满之后,将高速缓存数据存储分配分配给所述第二存储器内的存储空间 类型。

    Adaptive memory system for enhancing the performance of an external computing device
    6.
    发明授权
    Adaptive memory system for enhancing the performance of an external computing device 有权
    用于增强外部计算设备性能的自适应存储器系统

    公开(公告)号:US08504793B2

    公开(公告)日:2013-08-06

    申请号:US13363151

    申请日:2012-01-31

    IPC分类号: G06F12/00 G06F13/00

    摘要: An adaptive memory system is provided for improving the performance of an external computing device. The adaptive memory system includes a single controller, a first memory type (e.g., Static Random Access Memory or SRAM), a second memory type (e.g., Dynamic Random Access Memory or DRAM), a third memory type (e.g., Flash), an internal bus system, and an external bus interface. The single controller is configured to: (i) communicate with all three memory types using the internal bus system; (ii) communicate with the external computing device using the external bus interface; and (iii) allocate cache-data storage assignment to a storage space within the first memory type, and after the storage space within the first memory type is determined to be full, allocate cache-data storage assignment to a storage space within the second memory type.

    摘要翻译: 提供了一种用于改善外部计算设备的性能的自适应存储器系统。 自适应存储器系统包括单个控制器,第一存储器类型(例如,静态随机存取存储器或SRAM),第二存储器类型(例如,动态随机存取存储器或DRAM),第三存储器类型(例如,闪存), 内部总线系统和外部总线接口。 单个控制器被配置为:(i)使用内部总线系统与所有三种存储器类型通信; (ii)使用外部总线接口与外部计算设备进行通信; 以及(iii)将缓存数据存储分配分配给所述第一存储器类型内的存储空间,并且在所述第一存储器类型中的所述存储空间被确定为满之后,将高速缓存数据存储分配分配给所述第二存储器内的存储空间 类型。

    Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
    7.
    发明授权
    Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses 失效
    用于保持与电子设备和其他设备接触的散热器和其他结构的组件

    公开(公告)号:US07177156B2

    公开(公告)日:2007-02-13

    申请号:US10886911

    申请日:2004-07-08

    IPC分类号: H05K7/20

    摘要: Structures and methods for positioning heat sinks in contact with electronic devices are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device in accordance with one aspect of the invention includes an electronic device holding portion and a heat sink holding portion. The electronic device holding portion is configured to support the electronic device. The heat sink holding portion is configured to position the heat sink in contact with the electronic device. The structure further includes a spring holding portion configured to support a coil spring in transverse compression. When transversely compressed, the coil spring presses the heat sink against the electronic device with a uniform, or at least approximately uniform, pressure that enables the heat sink to efficiently conduct heat away from the electronic device without damaging the device.

    摘要翻译: 本文描述了用于定位与电子设备接触的散热器的结构和方法。 在一个实施例中,根据本发明的一个方面的用于保持与电子设备接触的散热器的结构包括电子设备保持部分和散热器保持部分。 电子设备保持部被配置为支撑电子设备。 散热器保持部构造成将散热器定位成与电子设备接触。 该结构还包括弹簧保持部分,其构造成在螺旋弹簧中横向压缩。 当横向压缩时,螺旋弹簧以均匀的或至少近似均匀的压力将散热器压在电子设备上,使得散热器能够有效地将热量从电子设备传导而不损坏设备。

    Alignment mark for placement of guide hole
    8.
    发明授权
    Alignment mark for placement of guide hole 失效
    导向孔放置对准标记

    公开(公告)号:US06700070B1

    公开(公告)日:2004-03-02

    申请号:US09705369

    申请日:2000-11-03

    IPC分类号: H05K100

    摘要: The field of the manufacture of electronic components, specifically to manufacturing flexible conductive strips having contact pads thereon, wherein a first set of alignment marks are provided on a substrate. Using the first set of alignment marks, several electronic components are formed in selected positions on the substrate. The electronic components may be formed in various groups, with a first group being formed using a first mask then, subsequent groups being formed using subsequent masks. Each of the respective masks are aligned with the first set of alignment marks in order to position the electronic components formed using the masks at the desired locations on the substrate. A second set of alignment marks are produced using the same mask as a set of electronic components that are located on the substrate. Subsequently, when a different set of features is produced, it is positioned using the second set of alignment marks located on the individual parts. Thus, tolerances can be achieved that would normally be possible only in the manufacture of individual parts, while still obtaining the advantages of the economies of scale possible by making many parts on a large sheet.

    摘要翻译: 电子部件的制造领域,特别是制造其上具有接触焊盘的柔性导电条,其中第一组对准标记设置在基板上。 使用第一组对准标记,在基板上的选定位置形成几个电子部件。 电子部件可以形成为各种组,第一组使用第一掩模形成,然后使用后续掩模形成随后的组。 各个掩模中的每一个对准第一组对准标记,以便将使用掩模形成的电子部件定位在基板上的所需位置。第二组对准标记使用与一组电子装置相同的掩模 位于基板上的部件。 随后,当产生不同的特征集合时,使用位于各个部件上的第二组对准标记进行定位。 因此,可以实现通常仅在制造单个零件时可以实现的公差,同时通过在许多部件上制作大尺寸片而获得规模经济的优点。

    Flexible connector for high density circuit applications
    9.
    发明授权
    Flexible connector for high density circuit applications 有权
    用于高密度电路应用的柔性连接器

    公开(公告)号:US06641406B1

    公开(公告)日:2003-11-04

    申请号:US09705368

    申请日:2000-11-03

    IPC分类号: H01R1200

    摘要: The flexible connector for high density circuit applications comprises a multilayer flexible substrate upon which are formed a plurality of contact pads, in a density required by a particular application. This density may exceed two hundred contact pads per square inch. Contact pads of similar size and configuration are formed on the surface of another device, i.e., circuit board, and provision made to align the contact pads of the connector with those of the circuit board. Micro-pads are formed on the surface of the contact pads on the connector such, that when the connector is brought into contact with the circuit board, and sufficient pressure is applied, the micro-pads make actual electrical contact with the pads of the circuit board. Since the total surface area in contact, namely the sum of the surface areas of the micro-pads, is a small fraction of the total area of the connector, a large pressure is provided at the electrical contact interface even when low pressure is provided to the connector as a whole.

    摘要翻译: 用于高密度电路应用的柔性连接器包括多层柔性基板,其上形成有特定应用所需的密度的多个接触焊盘。 该密度可能超过每平方英寸200个接触垫。 具有相似尺寸和构造的接触垫形成在另一装置即电路板的表面上,并且使连接器的接触垫与电路板的接触垫对齐。 微焊盘形成在连接器上的接触焊盘的表面上,即当连接器与电路板接触并施加足够的压力时,微焊盘与电路板的实际电接触 板。 由于接触的总表面积,即微焊盘的表面积的总和,是连接器总面积的一小部分,所以即使在提供低压时也在电接触界面处提供大的压力 连接器作为一个整体。