公开(公告)号：US20100015329A1

公开(公告)日：2010-01-21

申请号：US12174046

申请日：2008-07-16

申请人： Luu T. NGUYEN ,  Anindya PODDAR ,  Shaw W. LEE ,  Ashok S. PRABHU

发明人： Luu T. NGUYEN ,  Anindya PODDAR ,  Shaw W. LEE ,  Ashok S. PRABHU

IPC分类号： B05D5/12 ,  B05D3/06 ,  C23C18/16

CPC分类号： H05K3/048 ,  B05D1/327 ,  B05D2252/02 ,  H01L21/4821 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0393 ,  H05K3/027 ,  H05K3/16 ,  H05K3/388 ,  H05K2203/1545 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Methods and arrangements are described for forming an array of contacts for use in packaging one or more integrated circuit devices. In particular, various methods are described for forming contacts having thicknesses less than approximately 10 μm, and in particular embodiments, between 0.5 to 2 μm.

摘要翻译： 描述了形成用于封装一个或多个集成电路器件的触点阵列的方法和布置。 特别地，描述了用于形成厚度小于约10um，特别是在0.5至2μm之间的接触的各种方法。

公开(公告)号：US20100019339A1

公开(公告)日：2010-01-28

申请号：US12177677

申请日：2008-07-22

申请人： Randall L. WALBERG ,  Luu T. NGUYEN ,  Robert DAHLGREN ,  James B. WIESER ,  Kenneth PEDROTTI ,  Jacob A. WYSOCKI

发明人： Randall L. WALBERG ,  Luu T. NGUYEN ,  Robert DAHLGREN ,  James B. WIESER ,  Kenneth PEDROTTI ,  Jacob A. WYSOCKI

IPC分类号： H01L31/00 ,  H01L21/00

CPC分类号： G02B6/423 ,  G02B6/4206 ,  G02B6/4239 ,  G02B6/4249 ,  H01L24/97 ,  H01L31/0203 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Apparatuses and methods directed to an integrated circuit package having an optical component are disclosed. The package may include an integrated circuit die having at least one light sensitive region disposed on a first surface thereof. By way of example, the die may be a laser diode that emits light through the light sensitive region, or a photodetector that receives and detects light through the light sensitive region. An optical concentrator may be positioned adjacent the first surface of the first die. The optical concentrator includes a lens portion positioned adjacent the light sensitive region and adapted to focus light.

摘要翻译： 公开了涉及具有光学部件的集成电路封装的装置和方法。 封装可以包括具有设置在其第一表面上的至少一个光敏区域的集成电路管芯。 作为示例，芯片可以是通过光敏区域发射光的激光二极管，或者通过光敏区域接收和检测光的光电检测器。 光集中器可以位于第一管芯的第一表面附近。 光聚焦器包括位于光敏区域附近并适于聚焦光的透镜部分。

公开(公告)号：US20090152691A1

公开(公告)日：2009-06-18

申请号：US11959412

申请日：2007-12-18

申请人： Luu T. NGUYEN ,  Vijaylaxmi GUMASTE

发明人： Luu T. NGUYEN ,  Vijaylaxmi GUMASTE

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/27013 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83136 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/85385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： One aspect of the invention pertains to a semiconductor package having a die and a die attach pad with a plurality of spaced apart pedestals supported by a web. A die is mounted on the die attach pad such that the die is supported by at least a plurality of the pedestals. Selected edge regions of the die are arranged to overlie recessed regions of the die attach pad between adjacent pedestals. The die is electrically connected to at least some of the contact leads. An adhesive is arranged to secure the die to the die attach pad, with the thickness of the adhesive between the web of the die attach pad and the die being greater than the thickness of the adhesive between the die and the top surfaces of the pedestals that support the die. The die attach pad may have rounded peripheral corners between adjacent edge surfaces of the die attach pad. In another aspect of the invention, a method of packaging integrated circuits is described, wherein the resulting packages include at least some of the aforementioned leadframe structures.

摘要翻译： 本发明的一个方面涉及具有管芯和管芯附接垫的半导体封装，其具有由幅材支撑的多个间隔开的基座。 模具安装在管芯附接垫上，使得管芯由至少多个基座支撑。 芯片的选定边缘区域被布置成覆盖在相邻基座之间的管芯附接焊盘的凹陷区域。 模具电连接到至少一些接触引线。 粘合剂被布置成将管芯固定到管芯附接垫上，其中管芯附接垫和管芯之间的粘合剂的厚度大于管芯和基座顶表面之间的粘合剂的厚度， 支持死亡 管芯附接垫可以在管芯附接垫的相邻边缘表面之间具有圆形的周边拐角。 在本发明的另一方面，描述了封装集成电路的方法，其中所得到的封装包括至少一些上述引线框结构。