公开(公告)号：US20160338190A1

公开(公告)日：2016-11-17

申请号：US15134922

申请日：2016-04-21

Applicant: MediaTek Inc.

Inventor： PoHao CHANG ,  Chun-Wei CHANG

IPC: H05K1/02 ,  H05K1/09

CPC classification number: H05K1/0213 ,  H05K1/0246 ,  H05K1/0248 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/09254 ,  H05K2201/10159

Abstract: An electronic apparatus is provided. The electronic apparatus includes a printed circuit board (PCB) with a first signal path and a second signal path therein, a first finger disposed on the first signal path, a second finger disposed on the second signal path, a controller disposed on the PCB and coupled to a first memory via the first finger and to a second memory via the second finger, and a damping device disposed on the second signal path. The first and second signal paths share a common segment between the controller and a branch point on the PCB. The damping device is disposed between the second finger and the branch point. The distance between the first finger and the branch point within the first signal path is smaller than the distance between the second finger and the branch point within the second signal path.

Abstract translation: 提供电子设备。 电子设备包括：具有第一信号路径和第二信号路径的印刷电路板（PCB），设置在第一信号路径上的第一手指，设置在第二信号路径上的第二手指，布置在PCB上的控制器 经由第一手指耦合到第一存储器，经由第二手指耦合到第二存储器，以及设置在第二信号路径上的阻​​尼装置。 第一和第二信号路径共享控制器和PCB上的分支点之间的公共段。 阻尼装置设置在第二手指和分支点之间。 第一手指与第一信号路径内的分支点之间的距离小于第二手指与第二信号路径内的分支点之间的距离。

公开(公告)号：US20140319668A1

公开(公告)日：2014-10-30

申请号：US14326695

申请日：2014-07-09

Applicant: MediaTek Inc.

Inventor： Tai-Yu CHEN ,  Chun-Wei CHANG ,  Chung-Hwa WU

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/522 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/49816 ,  H01L23/5226 ,  H01L24/14 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package on package (PoP) structure is disclosed. The PoP structure comprises a top package and a bottom package disposed thereunder. The top package comprises a first substrate and a first die mounted onto the first substrate. At least one electrically floating pad is disposed on a lower surface of the first substrate. The bottom package comprises a second substrate and a second die mounted onto the second substrate. An upper surface of the second die is in thermal contact with the electrically floating pad.

Abstract translation: 公开了一种封装（PoP）封装。 PoP结构包括顶部封装和底部封装。 顶部封装包括第一基板和安装在第一基板上的第一管芯。 至少一个电浮置焊盘设置在第一基板的下表面上。 底部包装包括第二基板和安装在第二基板上的第二管芯。 第二管芯的上表面与电浮置焊盘热接触。

公开(公告)号：US20170111032A1

公开(公告)日：2017-04-20

申请号：US15274473

申请日：2016-09-23

Applicant: MediaTek Inc.

Inventor： Chun-Neng LIAO ,  Meng-Hsin CHIANG ,  Chun-Wei CHANG ,  Chee-Kong UNG ,  Ching-Chih LI

IPC: H04B3/28 ,  H01P1/24

Abstract: A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper.

公开(公告)号：US20170125363A1

公开(公告)日：2017-05-04

申请号：US15408683

申请日：2017-01-18

Applicant: MEDIATEK INC.

Inventor： Chun-Wei CHANG ,  Shang-Pin CHEN

IPC: H01L23/66 ,  H01L25/065 ,  G06F13/40 ,  H01L23/538 ,  H01L23/552 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L23/66 ,  G06F13/4072 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/16 ,  H01L25/0655 ,  H01L27/12 ,  H01L2223/6688 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/3025 ,  H04B3/32 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/181 ,  H05K3/46 ,  H05K2201/09972 ,  H05K2201/10159 ,  H05K2201/10318 ,  H05K2201/10522

Abstract: An integrated circuit is provided. The integrated circuit includes a control circuitry, a plurality of pins coupled to a plurality of conductive traces of a printed circuit board (PCB), and a plurality of driving units coupled to the pins. The control circuitry provides a plurality of control signals according to data to be transmitted. The driving units are divided into a plurality of first driving units and second driving units. According to the control signals, the first driving units provide the data to a memory device of the PCB via the corresponding pins and the corresponding conductive traces of PCB, and the second driving units provide a constant voltage to the corresponding conductive traces of PCB via the corresponding pins. The conductive traces corresponding to the second driving units are separated by the conductive traces corresponding to the first driving units on the PCB.

公开(公告)号：US20160233174A1

公开(公告)日：2016-08-11

申请号：US14997048

申请日：2016-01-15

Applicant: MediaTek Inc.

Inventor： PoHao CHANG ,  Chun-Wei CHANG ,  Ching-Chih LI

IPC: H01L23/552 ,  H01L23/528 ,  H05K1/02 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/49838 ,  H01L23/5286 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L27/12 ,  H01L2223/6688 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/3025 ,  H04B3/32 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/46

Abstract: An integrated circuit is provided. The integrated circuit includes a control circuitry, a plurality of pins, and a plurality of driving units coupled to the pins. The control circuitry provides a plurality of control signals according to data to be transmitted. The pins are coupled to a device via a plurality of conductive traces of a printed circuit board (PCB). The control signals control each of the driving units to selectively provide the data or one specific shielding pattern via the corresponding pin and the corresponding conductive trace of PCB to the device.

Abstract translation: 提供集成电路。 集成电路包括控制电路，多个引脚和耦合到引脚的多个驱动单元。 控制电路根据要发送的数据提供多个控制信号。 引脚经由印刷电路板（PCB）的多个导电迹线耦合到器件。 控制信号控制每个驱动单元，以选择性地将数据或一个特定的屏蔽图案经由相应的引脚和对应的PCB导电迹线提供给器件。