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公开(公告)号:US11859110B2
公开(公告)日:2024-01-02
申请号:US16607898
申请日:2018-04-24
Applicant: Mitsui Chemicals, Inc.
Inventor: Jun Kamada , Kazuo Kohmura , Yasuhisa Kayaba
IPC: C09J183/04 , B32B7/12 , C09J179/02 , H01L23/00 , B32B15/20 , B32B27/34 , B32B27/28
CPC classification number: C09J183/04 , B32B7/12 , B32B15/20 , B32B27/28 , B32B27/34 , C09J179/02 , H01L24/00 , H01L24/32 , B32B2250/03 , B32B2255/26 , B32B2457/14 , H01L2224/32145 , H01L2224/8385 , H01L2924/12041 , H01L2924/146 , H01L2924/1434 , H01L2924/1461
Abstract: A body, comprising stacked substrates, wherein: a first substrate, an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a defined weight average molecular weight, and a crosslinking agent (B), which has three or more —C(═O)OX groups in a molecule, in which from one to six of the three or more —C(═O)OX groups are —C(═O)OH groups and which has a weight average molecular weight of from 200 to 600, X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and a second substrate, are layered in this order, and the compound (A) comprises at least one selected from the group consisting of a defined aliphatic amine and a defined compound having a siloxane bond and an amino group.
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公开(公告)号:US11421135B2
公开(公告)日:2022-08-23
申请号:US16093439
申请日:2017-05-18
Applicant: MITSUI CHEMICALS, INC.
Inventor: Kazuyuki Fukuda , Jun Kamada , Takashi Uchida , Hideaki Otsuka , Shinji Tachibana
IPC: C09J175/04 , C08G18/75 , H01L31/04 , C09J11/04 , C08G18/80 , C09D127/12 , B05D7/24 , B05D7/04 , B32B27/30 , B32B27/40 , C09D7/40 , C09J127/12 , C08G18/38 , C08G18/50 , H01L31/049 , C08G18/62 , C08G18/28 , C09D175/04 , H01L31/048
Abstract: A curable composition includes a blocked isocyanate in which an NCO group of an isocyanate compound having a H6XDI skeleton is blocked by a blocking agent having an O═C—CH—C═O skeleton, a curable functional group-containing fluorine polymer, and an alkoxysilane having a functional group including at least one element of a group 15 element to a group 16 element of the periodic table (excluding oxygen). In the curable composition allowing a titanium oxide to be contained, the molar ratio of the curable functional group to the NCO group is 0.5 to 10; the content ratio of the alkoxysilane with respect to 100 pans by mass of the total amount of the blocked isocyanate and the fluorine polymer is 0.2 to 8 parts by mass; and the content ratio of the titanium oxide with respect to 100 parts by mass of the fluorine polymer is 0 to 200 parts by mass.
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公开(公告)号:US12261143B2
公开(公告)日:2025-03-25
申请号:US17284833
申请日:2019-10-17
Applicant: MITSUI CHEMICALS, INC.
Inventor: Yasuhisa Kayaba , Jun Kamada , Yuzo Nakamura
IPC: H01L23/00
Abstract: A method of manufacturing a substrate layered body includes: a step of applying a bonding material to the surface of at least one of a first substrate or a second substrate; a step of curing the bonding material applied on the surface to form a bonding layer having a reduced modulus at 23° C. of 10 GPa or less; and a step of bonding the first substrate and the second substrate via the bonding layer formed.
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公开(公告)号:US11332643B2
公开(公告)日:2022-05-17
申请号:US16629719
申请日:2018-07-10
Applicant: MITSUI CHEMICALS, INC.
Inventor: Jun Kamada , Tomoya Matayoshi , Michio Eriguchi , Kaichiro Haruta , Kenichi Fujii , Takashi Unezaki , Kazuo Kohmura
Abstract: Provided is an adhesive member including: a base material having an uneven shape on at least one surface; and a surface layer covering at least a portion of the surface having the uneven shape on the base material.
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公开(公告)号:US11072678B2
公开(公告)日:2021-07-27
申请号:US16456967
申请日:2019-06-28
Applicant: MITSUI CHEMICALS, INC.
Inventor: Kazuyuki Fukuda , Jun Kamada , Takashi Uchida , Masakazu Masui , Shinji Tachibana , Hirokazu Mizuma , Kenichi Fujii
IPC: C08G18/80 , C08G18/28 , C08G18/32 , C08G18/62 , C08G18/79 , C09D175/04 , C09J175/04
Abstract: The blocked isocyanate is a blocked isocyanate containing a latent isocyanate group, which is an isocyanate group blocked with a blocking agent, wherein the blocked isocyanate includes a first latent isocyanate group that is an isocyanate group blocked with a first blocking agent and a second latent isocyanate group that is an isocyanate group blocked with a second blocking agent; and the first blocking agent is represented by general formula (1) below, and has a higher catalysis activity that activates the isocyanate group than that of the second blocking agent. (where R1 to R3 represent a hydrocarbon group having 1 to 12 carbon atoms or a hydrogen atom, and at least one of R1 to R3 represents a hydrogen atom, and R1 and R3 may be bonded to each other to form a heterocycle. R4 represents a hydrocarbon group having 1 to 12 carbon atoms, a hydrogen atom, or an atomic group represented by —NR5R6 (R5 and R6 represent a hydrocarbon group having 1 to 12 carbon atoms, and R5 and R1 may be bonded to each other to form a heterocycle and R6 and R3 may be bonded to each other to form a heterocycle).
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公开(公告)号:US11058660B2
公开(公告)日:2021-07-13
申请号:US16236752
申请日:2018-12-31
Applicant: Mitsui Chemicals, Inc.
Inventor: Naosuke Kunimoto , Kenichi Suzuki , Kouya Kojima , Akira Hasegawa , Yasufumi Tsuchiya , Jun Kamada , Satoshi Yamasaki , Goro Kuwamura , Daisuke Hasegawa
Abstract: A method of healing an external wound involves applying an external wound-healing agent to an external wound, or bringing the external wound-healing agent applied to a substrate into contact with an external wound, wherein the external wound-healing agent includes, as an active ingredient, at least one compound of a glycerol alkyl ester represented by defined Formula (I) or a diglycerol alkyl ester represented by defined Formula (II). In a further embodiment, the method involves bringing a fiber aggregate or a film into contact with an external wound, wherein the fiber aggregate or the film each includes a thermoplastic resin and at least one compound of the glycerol alkyl ester or the diglycerol alkyl ester.
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公开(公告)号:US11581197B2
公开(公告)日:2023-02-14
申请号:US16611653
申请日:2018-05-10
Applicant: Mitsui Chemicals, Inc.
Inventor: Jun Kamada , Kaichiro Haruta , Yasuhisa Kayaba , Kazuo Kohmura , Yoichi Kodama
Abstract: This method for producing a semiconductor device comprises: a first step wherein a plurality of semiconductor chips are affixed onto a supporting substrate such that circuit surfaces of the semiconductor chips face the supporting substrate; a second step wherein a plurality of sealed layers are formed at intervals by applying the sealing resin onto the semiconductor chips by three-dimensional modeling method, each sealed layer containing one or more semiconductor chips embedded in a sealing resin; a third step wherein the sealed layers are cured or solidified; and a fourth step wherein sealed bodies are obtained by separating the cured or solidified sealed layers from the supporting substrate.
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公开(公告)号:US20170209406A1
公开(公告)日:2017-07-27
申请号:US15326150
申请日:2015-07-15
Applicant: Mitsui Chemicals, Inc.
Inventor: Naosuke Kunimoto , Kenichi Suzuki , Kouya Kojima , Akira Hasegawa , Yasufumi Tsuchiya , Jun Kamada , Satoshi Yamasaki , Goro Kuwamura , Daisuke Hasegawa
CPC classification number: A61K31/23 , A61K9/0092 , A61K9/7007 , A61K47/32 , A61L15/44 , A61L2300/412 , A61P17/02
Abstract: An external wound-healing agent includes, as an active ingredient, at least one compound of a glycerol alkyl ester represented by Formula (I) or a diglycerol alkyl ester represented by Formula (II).
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公开(公告)号:US10988647B2
公开(公告)日:2021-04-27
申请号:US16606789
申请日:2018-04-19
Applicant: Mitsui Chemicals, Inc.
Inventor: Jun Kamada , Kaichiro Haruta , Takashi Unezaki , Kiyomi Imagawa , Kenichi Fujii , Yasuhisa Kayaba , Kazuo Kohmura
IPC: C09J179/08 , C09J5/00 , H01L21/304 , H01L21/56
Abstract: The purpose of the present invention is to provide a semiconductor substrate manufacturing method, which prevents detachment of a semiconductor wafer being ground, and which prevents cracking or chipping in a semiconductor substrate obtained. In order to solve the problem, the semiconductor substrate manufacturing method comprises: a polyimide layer forming step of forming a polyimide layer on a support material; a wafer attaching step of affixing the support material and a semiconductor wafer to each other with the polyimide layer disposed therebetween; a wafer grinding step of grinding the semiconductor wafer; a support material peeling step of peeling the support material from the polyimide layer; and a polyimide layer peeling step of peeling the polyimide layer from the semiconductor wafer. The polyimide layer includes polyimide which includes a benzophenone skeleton and an aliphatic structure, wherein an amine equivalent weight is 4000 to 20000.
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公开(公告)号:US10385157B2
公开(公告)日:2019-08-20
申请号:US14913231
申请日:2014-08-12
Applicant: MITSUI CHEMICALS, INC.
Inventor: Kazuyuki Fukuda , Jun Kamada , Takashi Uchida , Masakazu Masui , Shinji Tachibana , Hirokazu Mizuma , Kenichi Fujii
IPC: C08G18/28 , C08G18/32 , C08G18/62 , C08G18/79 , C08G18/80 , C09D175/04 , C09J175/04
Abstract: The blocked isocyanate is a blocked isocyanate containing a latent isocyanate group, which is an isocyanate group blocked with a blocking agent, wherein the blocked isocyanate includes a first latent isocyanate group that is an isocyanate group blocked with a first blocking agent and a second latent isocyanate group that is an isocyanate group blocked with a second blocking agent; and the first blocking agent is represented by general formula (1) below, and has a higher catalysis activity that activates the isocyanate group than that of the second blocking agent. (where R1 to R3 represent a hydrocarbon group having 1 to 12 carbon atoms or a hydrogen atom, and at least one of R1 to R3 represents a hydrogen atom, and R1 and R3 may be bonded to each other to form a heterocycle. R4 represents a hydrocarbon group having 1 to 12 carbon atoms, a hydrogen atom, or an atomic group represented by —NR5R6 (R5 and R6 represent a hydrocarbon group having 1 to 12 carbon atoms, and R5 and R1 may be bonded to each other to form a heterocycle and R6 and R3 may be bonded to each other to form a heterocycle).
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