Low temperature ALD SiO2
    8.
    发明授权
    Low temperature ALD SiO2 有权
    低温ALD SiO2

    公开(公告)号:US07897208B2

    公开(公告)日:2011-03-01

    申请号:US12788131

    申请日:2010-05-26

    IPC分类号: C23C16/00 H05H1/24

    CPC分类号: C23C16/402 C23C16/45534

    摘要: The present invention generally comprises a silicon dioxide atomic layer deposition method. By providing pyridine as a catalyst, water may be utilized as the oxidization source while depositing at a low temperature. Prior to exposing the substrate to the water, the substrate may be exposed to a pyridine soak process. Additionally, the water may be co-flowed to the chamber with the pyridine through separate conduits to reduce interaction prior to entering the chamber. Alternatively, the pyridine may be co-flowed with a silicon precursor that does not react with pyridine.

    摘要翻译: 本发明通常包括二氧化硅原子层沉积方法。 通过提供吡啶作为催化剂,可以在低温下沉积时使用水作为氧化源。 在将基底暴露于水之前,可以将底物暴露于吡啶浸泡过程。 此外,水可以通过单独的导管与吡啶共同流到室中,以减少进入室之前的相互作用。 或者,吡啶可以与不与吡啶反应的硅前体共流。

    Low temperature ALD SiO2
    9.
    发明授权
    Low temperature ALD SiO2 失效
    低温ALD SiO2

    公开(公告)号:US07749574B2

    公开(公告)日:2010-07-06

    申请号:US11559491

    申请日:2006-11-14

    IPC分类号: H05H1/24 C23C16/00

    CPC分类号: C23C16/402 C23C16/45534

    摘要: The present invention generally comprises a silicon dioxide atomic layer deposition method. By providing pyridine as a catalyst, water may be utilized as the oxidization source while depositing at a low temperature. Prior to exposing the substrate to the water, the substrate may be exposed to a pyridine soak process. Additionally, the water may be co-flowed to the chamber with the pyridine through separate conduits to reduce interaction prior to entering the chamber. Alternatively, the pyridine may be co-flowed with a silicon precursor that does not react with pyridine.

    摘要翻译: 本发明通常包括二氧化硅原子层沉积方法。 通过提供吡啶作为催化剂,可以在低温下沉积时使用水作为氧化源。 在将基底暴露于水之前,可以将底物暴露于吡啶浸泡过程。 此外,水可以通过单独的导管与吡啶共同流到室中,以减少进入室之前的相互作用。 或者,吡啶可以与不与吡啶反应的硅前体共流。

    LOW TEMPERATURE ALD SiO2
    10.
    发明申请
    LOW TEMPERATURE ALD SiO2 失效
    低温ALD SiO2

    公开(公告)号:US20080113097A1

    公开(公告)日:2008-05-15

    申请号:US11559491

    申请日:2006-11-14

    IPC分类号: C23C16/40

    CPC分类号: C23C16/402 C23C16/45534

    摘要: The present invention generally comprises a silicon dioxide atomic layer deposition method. By providing pyridine as a catalyst, water may be utilized as the oxidization source while depositing at a low temperature. Prior to exposing the substrate to the water, the substrate may be exposed to a pyridine soak process. Additionally, the water may be co-flowed to the chamber with the pyridine through separate conduits to reduce interaction prior to entering the chamber. Alternatively, the pyridine may be co-flowed with a silicon precursor that does not react with pyridine.

    摘要翻译: 本发明通常包括二氧化硅原子层沉积方法。 通过提供吡啶作为催化剂,可以在低温下沉积时使用水作为氧化源。 在将基底暴露于水之前,可以将底物暴露于吡啶浸泡过程。 此外,水可以通过单独的导管与吡啶共同流到室中,以减少进入室之前的相互作用。 或者,吡啶可以与不与吡啶反应的硅前体共流。