公开(公告)号：US20140340890A1

公开(公告)日：2014-11-20

申请号：US14344379

申请日：2012-08-09

申请人： Toshio Hata ,  Shinji Osaki ,  Toyonori Uemura ,  Shinya Ishizaki ,  Makoto Matsuda

发明人： Toshio Hata ,  Shinji Osaki ,  Toyonori Uemura ,  Shinya Ishizaki ,  Makoto Matsuda

IPC分类号： H01L33/50 ,  H01L25/075 ,  H01L25/00 ,  F21K99/00 ,  F21V29/00

CPC分类号： H01L33/50 ,  A01G7/045 ,  F21K9/60 ,  F21V29/74 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2924/3025 ,  Y02P60/149 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting apparatus of the present invention is configured such that first and second light emitting sections are provided on a substrate (101) so as to be adjacent to each other, the first light emitting section being made up of (i) at least one blue LED chip (102) and (ii) a resin layer which covers the at least one blue LED chip (102) and in which a red phosphor is dispersed that emits red light upon receipt of excitation light from the at least one blue LED chip (102), the second light emitting section being made up of at least one LED chip (102). This makes it possible to easily adjust, with a simple and compact configuration, a ratio between a quantity of blue light and a quantity of red light.

摘要翻译： 本发明的发光装置被配置为使得第一和第二发光部分设置在彼此相邻的基板（101）上，第一发光部分由（i）至少一个 蓝色LED芯片（102）和（ii）覆盖所述至少一个蓝色LED芯片（102）的树脂层，并且其中分散有红色荧光体的红色荧光体在从所述至少一个蓝色LED芯片接收到激发光时发出红光 （102），所述第二发光部分由至少一个LED芯片（102）构成。 这使得可以通过简单且紧凑的配置容易地调整蓝光量与红光量之间的比率。

公开(公告)号：US08206999B2

公开(公告)日：2012-06-26

申请号：US13162295

申请日：2011-06-16

申请人： Makoto Matsuda ,  Toshio Hata

发明人： Makoto Matsuda ,  Toshio Hata

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin.

摘要翻译： 在根据本发明的实施例的芯片型LED中，在绝缘基板中形成用于安装LED芯片的第一凹部孔和用于连接细金属丝的第二凹部孔，用作第一布线 在包括第一凹槽的部分形成图案，在包括第二凹槽的部分形成用作第二布线图案的金属片，在第一凹槽内的金属片上安装LED芯片， LED芯片通过细金属线电连接到第二凹槽内的金属片，包括第一凹部孔和包括第二凹部孔的细金属线的LED芯片封装在包含荧光材料的第一透明树脂中 包含第一透明树脂的绝缘基板的表面被封装在第二透明树脂中。

公开(公告)号：US20110299268A1

公开(公告)日：2011-12-08

申请号：US13152587

申请日：2011-06-03

申请人： Shinya Ishizaki ,  Tomokazu Nada ,  Makoto Agatani ,  Makoto Matsuda ,  Shinji Osaki ,  Tatsuya Morioka ,  Hitoshi Matsushita ,  Toyonori Uemura ,  Toshio Hata

发明人： Shinya Ishizaki ,  Tomokazu Nada ,  Makoto Agatani ,  Makoto Matsuda ,  Shinji Osaki ,  Tatsuya Morioka ,  Hitoshi Matsushita ,  Toyonori Uemura ,  Toshio Hata

IPC分类号： F21V9/16 ,  F21V7/00

CPC分类号： H05B33/22 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48137 ,  H01L2224/48139

摘要： The light-emitting device includes: a substrate which has a single layer structure in which a conductive member is partially provided on a surface of the substrate; a plurality of light-emitting elements which are directly provided on the surface of the substrate so as to be electrically connected with the conductive member; a first light reflection resin layer; a second light reflection resin layer which is provided in a looped shape on the surface of the substrate so as to surround an area in which the plurality of light-emitting elements are provided; and a sealing resin which covers the plurality of light-emitting elements. In the area in which the plurality of light-emitting elements are provided, the conductive member is covered with the first light reflection resin layer, the conductive member, which is provided under the second light reflection resin layer, is covered with the second light reflection resin layer directly, and a printed resistor, which is provided under the second light reflection resin layer, is covered with the second light reflection resin layer via the first light reflection resin layer. This makes it possible to provide the light-emitting device which (i) reduces absorption of light so as to achieve excellent light extraction efficiency, and (ii) is highly reliable.

摘要翻译： 发光装置包括：具有单层结构的基板，其中导电构件部分地设置在基板的表面上; 多个发光元件，其直接设置在所述基板的表面上以与所述导电构件电连接; 第一光反射树脂层; 第二光反射树脂层，其以环状设置在所述基板的表面上，以围绕设置有所述多个发光元件的区域; 以及覆盖多个发光元件的密封树脂。 在设置有多个发光元件的区域中，导电部件被第一光反射树脂层覆盖，设置在第二光反射树脂层下方的导电部件被第二光反射覆盖 树脂层和设置在第二光反射树脂层下方的印刷电阻器经由第一光反射树脂层被第二光反射树脂层覆盖。 这使得可以提供（i）减少光的吸收以获得优异的光提取效率的发光装置，（ii）高可靠性。

公开(公告)号：US20110001156A1

公开(公告)日：2011-01-06

申请号：US12827319

申请日：2010-06-30

申请人： Makoto Matsuda ,  Toyonori Uemura ,  Toshio Hata

发明人： Makoto Matsuda ,  Toyonori Uemura ,  Toshio Hata

IPC分类号： H01L33/44 ,  H01L21/00

CPC分类号： H01L25/167 ,  H01L33/508 ,  H01L33/60 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting device includes: a substrate; an LED chip provided on a main surface of the substrate; and a printed resistor element connected in parallel with the LED chip, the printed resistor element being provided in at least one of regions (i) on the main surface of the substrate, (ii) on a back surface of the substrate, and (iii) inside the substrate. According to the arrangement, it is possible to provide: a light emitting device which can emit light having preferable luminance without a reduction in optical output by suppressing light shielding and light absorption of light emitted from the LED toward the outside; and a method for manufacturing the light emitting device.

摘要翻译： 发光装置包括：基板; 设置在所述基板的主表面上的LED芯片; 和与LED芯片并联连接的印刷电阻元件，所述印刷电阻元件设置在所述基板主表面上的至少一个区域（i）中，（ii）在所述基板的背面上，和（iii ）。 根据该结构，可以提供：通过抑制从LED发出的光向外部的光的遮蔽和光吸收，能够发射具有优选亮度而不降低光输出的光的发光装置; 以及制造发光器件的方法。

公开(公告)号：US20090108282A1

公开(公告)日：2009-04-30

申请号：US12260742

申请日：2008-10-29

申请人： Makoto MATSUDA ,  Toshio Hata

发明人： Makoto MATSUDA ,  Toshio Hata

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin.

摘要翻译： 在根据本发明的实施例的芯片型LED中，在绝缘基板中形成用于安装LED芯片的第一凹部孔和用于连接细金属丝的第二凹部孔，用作第一布线 在包括第一凹槽的部分形成图案，在包括第二凹槽的部分形成用作第二布线图案的金属片，在第一凹槽内的金属片上安装LED芯片， LED芯片通过细金属线电连接到第二凹槽内的金属片，包括第一凹部孔和包括第二凹部孔的细金属线的LED芯片封装在包含荧光材料的第一透明树脂中 包含第一透明树脂的绝缘基板的表面被封装在第二透明树脂中。

公开(公告)号：US07985980B2

公开(公告)日：2011-07-26

申请号：US12260742

申请日：2008-10-29

申请人： Makoto Matsuda ,  Toshio Hata

发明人： Makoto Matsuda ,  Toshio Hata

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin.

摘要翻译： 在根据本发明的实施例的芯片型LED中，在绝缘基板中形成用于安装LED芯片的第一凹部孔和用于连接细金属丝的第二凹部孔，用作第一布线 在包括第一凹槽的部分形成图案，在包括第二凹槽的部分形成用作第二布线图案的金属片，在第一凹槽内的金属片上安装LED芯片， LED芯片通过细金属线电连接到第二凹槽内的金属片，包括第一凹部孔和包括第二凹部孔的细金属线的LED芯片封装在包含荧光材料的第一透明树脂中 包含第一透明树脂的绝缘基板的表面被封装在第二透明树脂中。

公开(公告)号：US20130264934A1

公开(公告)日：2013-10-10

申请号：US13988405

申请日：2011-11-15

申请人： Shinji Osaki ,  Toyonori Uemura ,  Toshio Hata ,  Tomokazu Nada ,  Tatsuya Morioka ,  Makoto Matsuda ,  Shinya Ishizaki ,  Makoto Agatani ,  Hitoshi Matsushita

发明人： Shinji Osaki ,  Toyonori Uemura ,  Toshio Hata ,  Tomokazu Nada ,  Tatsuya Morioka ,  Makoto Matsuda ,  Shinya Ishizaki ,  Makoto Agatani ,  Hitoshi Matsushita

IPC分类号： H01L33/50 ,  H05B33/12

CPC分类号： H01L33/504 ,  A01G7/045 ,  H01L25/0753 ,  H01L33/502 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H05B33/12 ,  Y02P60/149 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate-type LED light source (10) includes: at least one blue LED chip (2) which has an emission peak in a range from 400 nm to 480 nm so as to correspond to a blue light region absorption peak of chlorophyll; a red phosphor (7b) which emit, upon receiving excitation light from the at least one blue LED chip (2), light having a peak wavelength in a range from 620 nm to 700 nm so as to correspond to a red light region absorption peak of chlorophyll; and a resin layer (7) in which the red phosphor 7b is dispersed and which covers the at least one blue LED chip (2).

摘要翻译： 基板型LED光源（10）包括：至少一个蓝色LED芯片（2），其具有在400nm至480nm范围内的发射峰值，以对应于叶绿素的蓝光区域吸收峰; 在从至少一个蓝色LED芯片（2）接收到激发光的情况下，发射峰值波长在620nm〜700nm范围内的红色荧光体（7b），以对应于红色光区域吸收峰 的叶绿素; 以及其中分散有红色荧光体7b并覆盖至少一个蓝色LED芯片（2）的树脂层（7）。

公开(公告)号：US20110244606A1

公开(公告)日：2011-10-06

申请号：US13162295

申请日：2011-06-16

申请人： Makoto MATSUDA ,  Toshio Hata

发明人： Makoto MATSUDA ,  Toshio Hata

IPC分类号： H01L33/52

CPC分类号： H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin.

摘要翻译： 在根据本发明的实施例的芯片型LED中，在绝缘基板中形成用于安装LED芯片的第一凹部孔和用于连接细金属丝的第二凹部孔，用作第一布线 在包括第一凹槽的部分形成图案，在包括第二凹槽的部分形成用作第二布线图案的金属片，在第一凹槽内的金属片上安装LED芯片， LED芯片通过细金属线电连接到第二凹槽内的金属片，包括第一凹部孔和包括第二凹部孔的细金属线的LED芯片封装在包含荧光材料的第一透明树脂中 包含第一透明树脂的绝缘基板的表面被封装在第二透明树脂中。

公开(公告)号：US08985793B2

公开(公告)日：2015-03-24

申请号：US13813520

申请日：2011-06-27

申请人： Shinji Osaki ,  Toyonori Uemura ,  Toshio Hata ,  Junichi Somei ,  Yuji Kozuma ,  Kenji Hatazawa ,  Tomokazu Nada ,  Makoto Agatani ,  Shinya Ishizaki ,  Tatsuya Morioka ,  Makoto Matsuda

发明人： Shinji Osaki ,  Toyonori Uemura ,  Toshio Hata ,  Junichi Somei ,  Yuji Kozuma ,  Kenji Hatazawa ,  Tomokazu Nada ,  Makoto Agatani ,  Shinya Ishizaki ,  Tatsuya Morioka ,  Makoto Matsuda

IPC分类号： F21V14/08 ,  F21V14/00 ,  F21K99/00 ,  F21S10/02 ,  F21V3/02 ,  F21V9/10 ,  F21Y101/02 ,  F21Y105/00

CPC分类号： F21V14/08 ,  F21K9/232 ,  F21K9/64 ,  F21K9/65 ,  F21S10/02 ,  F21V3/02 ,  F21V9/40 ,  F21V14/006 ,  F21Y2105/10 ,  F21Y2115/10

摘要： An illumination device with a toning function in which possibility of moisture and dust intruding into the case is reduced with a simple mechanism is realized. The illumination device includes a light emitting element light source (17) mounted on a substrate inside the case unit (21), an external gear-shaped fluorescent-substance plate (41) having a configuration in which a light emitting color of an applied fluorescent substance differs according to position and being arranged above the light emitting element light source (17) inside the case unit (21), and an internal gear-shaped adjustment ring (43) arranged so as to mesh with the external teeth of the fluorescent-substance plate (41), wherein the adjustment ring (43) is arranged to be positioned on the outer periphery of the main body under a lens dome (11), and when the adjustment ring (43) is rotated, a relative positional relationship between a color distribution applied on the fluorescent-substance plate (41) and the light emitting element light source (17) is changed.

摘要翻译： 实现了具有调色功能的照明装置，其中通过简单的机构减少了侵入壳体的湿气和灰尘的可能性。 照明装置包括安装在壳体单元（21）内的基板上的发光元件光源（17），外部齿轮状荧光物质板（41），其具有施加荧光体的发光颜色 物质根据位置而不同，并且布置在壳体单元（21）内部的发光元件光源（17）的上方，并且内齿轮状调节环（43）被布置成与荧光屏的外齿啮合， 物质板（41），其中调节环（43）被布置成位于透镜圆顶（11）下方的主体的外周上，并且当调节环（43）旋转时，相对位置关系 改变施加在荧光物质板（41）和发光元件光源（17）上的颜色分布。

公开(公告)号：US08651696B2

公开(公告)日：2014-02-18

申请号：US13152587

申请日：2011-06-03

申请人： Shinya Ishizaki ,  Tomokazu Nada ,  Makoto Agatani ,  Makoto Matsuda ,  Shinji Osaki ,  Tatsuya Morioka ,  Hitoshi Matsushita ,  Toyonori Uemura ,  Toshio Hata

发明人： Shinya Ishizaki ,  Tomokazu Nada ,  Makoto Agatani ,  Makoto Matsuda ,  Shinji Osaki ,  Tatsuya Morioka ,  Hitoshi Matsushita ,  Toyonori Uemura ,  Toshio Hata

IPC分类号： H01L33/00

CPC分类号： H05B33/22 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48137 ,  H01L2224/48139

摘要： The light-emitting device includes: a substrate which has a single layer structure in which a conductive member is partially provided on a surface of the substrate; a plurality of light-emitting elements which are directly provided on the surface of the substrate so as to be electrically connected with the conductive member; a first light reflection resin layer; a second light reflection resin layer which is provided in a looped shape on the surface of the substrate so as to surround an area in which the plurality of light-emitting elements are provided; and a sealing resin which covers the plurality of light-emitting elements. In the area in which the plurality of light-emitting elements are provided, the conductive member is covered with the first light reflection resin layer, the conductive member, which is provided under the second light reflection resin layer, is covered with the second light reflection resin layer directly, and a printed resistor, which is provided under the second light reflection resin layer, is covered with the second light reflection resin layer via the first light reflection resin layer. This makes it possible to provide the light-emitting device which (i) reduces absorption of light so as to achieve excellent light extraction efficiency, and (ii) is highly reliable.

摘要翻译： 发光装置包括：具有单层结构的基板，其中导电构件部分地设置在基板的表面上; 多个发光元件，其直接设置在所述基板的表面上以与所述导电构件电连接; 第一光反射树脂层; 第二光反射树脂层，其以环状设置在所述基板的表面上，以围绕设置有所述多个发光元件的区域; 以及覆盖多个发光元件的密封树脂。 在设置有多个发光元件的区域中，导电部件被第一光反射树脂层覆盖，设置在第二光反射树脂层下方的导电部件被第二光反射覆盖 树脂层和设置在第二光反射树脂层下方的印刷电阻器经由第一光反射树脂层被第二光反射树脂层覆盖。 这使得可以提供（i）减少光的吸收以获得优异的光提取效率的发光装置，（ii）高可靠性。