摘要:
A semiconductor integrated circuit can variably set the driving power of all or part of internal input/output terminals and internal output terminals used within a multi-chip package. It can increase the driving power at an individual wafer test before packaging to sufficiently drive a load connected between a tester and the internal input/output terminals and internal output terminals, and can reduce the driving power after packaging. It can prevent noise and power consumption from being increased.
摘要:
An external clock signal is transmitted as a clock signal to a memory core through a first signal transmitting path. In response to activation of the clock signal CLK, memory core starts a read operation. Read data output from memory core is latched by a latch circuit. An external signal designating a latch timing is transmitted as a latch timing signal to the latch circuit through a second signal transmitting path. A delay circuit is provided in at least one of the first and second signal transmitting paths, so that the first and second signal transmitting paths come to have the same signal delay.
摘要:
A variable delay circuit for controlling delay time includes P channel transistors connected in parallel, with respective source electrodes connected to a power supply, respective drain electrodes connected to an output terminal for providing delayed signal, and respective gate electrodes connected to respective control signal input terminals for receiving control signals. The circuit further includes N channel transistors with respective source electrodes connected to ground, respective drain electrodes connected to the output terminal, and respective gate electrode connected to the respective control signal input terminals. Identical or mutually inverted data signals or control signals are supplied to the respective gate electrodes of the P channel transistors and the respective gate electrodes of the N channel transistors.
摘要:
A semiconductor device includes a first pad, a second pad, a first buffer and a second buffer. The first pad is connected to another semiconductor device in a multi-chip package, and the second pad makes a probing connection in a wafer test. The first buffer drives the another semiconductor device connected to the first pad. The second buffer, being driven by the first buffer, drives a load capacitance of a tester connected to the second pad with the driving power greater than the driving power of the first buffer, and has its active/inactive state controlled by a control signal. The semiconductor device can provide the driving power necessary for the wafer test, and drive the another semiconductor device with preventing generation of drive noise and suppressing current consumption in the normal operation of the multi-chip package.
摘要:
A method for testing a semiconductor memory device according to one embodiment comprises the steps of: checking data in all addresses of the semiconductor memory device for correctness in-units of m×n bits: ending if it is determined that data in all the semiconductor memory device; if there is a defective address, comparing each m-bit data constituting the (m×n)-bit data corresponding to the defective address with its expected value; and if the comparison result indicates that the m-bit data is erroneous, determining whether the defective semiconductor memory device can be repaired. Due to this step, man hours required for testing a semiconductor memory device having a wide data bus of an (m×n)-bit width can be considerably reduced.
摘要:
A line delay generator including a packetizing circuit, one port RAM and a RAM controller. The RAM controller provides the one port RAM with a write command to write packet data generated by the packetizing circuit, and with a read command to read any one or more packet data currently stored in the one port RAM, and output them as line delay data. The line delay generator can solve a problem involved in a conventional line delay generator in that because m (positive integer) two-port FIFOs must be connected in cascade to generate m line delay data, the FIFO memory becomes bulky.
摘要:
A test circuit includes a writing unit that outputs m-bit data captured upon receipt of a clock signal, branches the m-bit data n identical m-bit data signals, and stores the n m-bit data signals in a memory device. A function determining unit reads the n m-bit data signals from the memory, compares one of the n m-bit data signals to an m-bit expected value, and determines coincidence or non-coincidence between the n m-bit data signal and an expected value.
摘要:
A semiconductor integrated circuit device includes a logic circuit and a synchronous dynamic random access memory including a core unit, integrated on a single semiconductor chip. The semiconductor integrated circuit device includes a synchronous dynamic random access memory control circuit which receives external control signals for the synchronous dynamic random access memory from the logic circuit, and outputs internal control signals to the core unit of the synchronous dynamic random access memory. For testing of semiconductor integrated circuit device, external test signals are provided through external terminals. The external test signals are selected by a selector, and are provided to the core unit of the synchronous dynamic random access memory for testing.
摘要:
A synchronized clock generating apparatus includes a delayed clock generating circuit including a plurality of serially connected delaying elements for generating delayed clock signals delayed successively relative to an incoming basic clock signal. Storage means includes a plurality of storage elements storing therein a predetermined level in response to transitions occurring in associated ones of said basic and delayed clock signals after a trigger signal which is asynchronous with the basic clock signal is applied thereto. A clock selection logic circuit is controlled by the output signal of the storage means for detecting the clock signal transition occurring closest in time to the application of the asynchronous trigger signal, and for selecting a desired one of said clock signals, based on the result of the detection, as a synchronized clock signal output.
摘要:
An information device includes a main processing circuit for executing signal processing related to a main function in the information device, a main microcomputer for controlling the main processing circuit, a receiver circuit for interfacing with the outside of the information device, and an interface microcomputer for controlling the receiver circuit, the interface microcomputer being provided separately from the main microcomputer.