公开(公告)号：US06631551B1

公开(公告)日：2003-10-14

申请号：US09105611

申请日：1998-06-26

申请人： Philip Harbaugh Bowles ,  Washington Morris Mobley ,  Richard Dixon Parker ,  Marion Edmond Ellis

发明人： Philip Harbaugh Bowles ,  Washington Morris Mobley ,  Richard Dixon Parker ,  Marion Edmond Ellis

IPC分类号： H01C1706

CPC分类号： H05K1/162 ,  H01C7/003 ,  H01C7/005 ,  H01C17/065 ,  H01G4/33 ,  H05K1/092 ,  H05K1/095 ,  H05K1/167 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09672 ,  H05K2201/09763 ,  H05K2203/0338 ,  Y10T29/49099 ,  Y10T29/49155 ,  Y10T29/49158

摘要： A process for forming stable integrated resistors (14) and capacitors (28) on organic substrates (12). The resistors (14) and capacitors (28) are capable of a wide range of resistance and capacitance values, yet can be processed in a manner that does not detrimentally effect the organic substrate (12) or entail complicated processing. The method generally entails the use of thick-film materials usually of the types used to form resistors and capacitors on ceramic substrates. The thick-film materials are applied to an electrically-conductive foil (20) and then heated to bond the thick-film material to the foil (20) and form a solid resistive or capacitive mass (16/30). The foil (20) is then laminated to an organic substrate (12), such that the resistive/capacitive mass (16/30) is attached to and preferably embedded in the organic substrate (12). Finally, the foil (20) is etched to form at least one of two terminals that contact the resistive/capacitive mass (16/30) and thereby complete the passive electrical component (14/28). Resistors (14) can also be formed of polymer thick-film (PTF) inks, in which case the PTF ink is cured on the foil (20) for an extended period at a temperature sufficient to completely cure the ink prior to laminating the foil (20) to the organic substrate (12).

公开(公告)号：US06180164B2

公开(公告)日：2001-01-30

申请号：US09178758

申请日：1998-10-26

申请人： Marion Edmond Ellis ,  Philip Harbaugh Bowles ,  Washington Morris Mobley

发明人： Marion Edmond Ellis ,  Philip Harbaugh Bowles ,  Washington Morris Mobley

IPC分类号： B05D512

CPC分类号： H01C17/0654 ,  C23C18/08 ,  C23C18/1216 ,  C23C18/127 ,  C23C18/1275 ,  C23C18/1279 ,  Y10T29/49082 ,  Y10T29/49099

摘要： A method for forming a ruthenium-based thick-film resistor having copper terminations, in which the thick-film resistor is fired in a non-oxidizing atmosphere so as not to oxidize the copper terminations yet without reducing the thick-film resistor to metallic ruthenium. A ruthenium-based thick-film resistor ink having a matrix material and an organic vehicle is deposited on a copper layer that will form the terminations for the thick-film resistor formed by firing the ink. The organic vehicle of the ink is then burned out at a temperature of less than 350° C. in an oxidizing atmosphere, such as air. Thereafter, the ink is fired in a non-oxidizing atmosphere (e.g., nitrogen) at a temperature sufficient to sinter the matrix material and yield a ruthenium-based thick-film resistor with copper terminations formed by the copper layer.

摘要翻译： 一种用于形成具有铜端接的钌基厚膜电阻器的方法，其中在非氧化气氛中烧结厚膜电阻器，以便不将氧化铜端子而不将厚膜电阻器还原成金属钌 。 将具有基质材料和有机载体的钌基厚膜电阻墨水沉积在铜层上，该铜层将形成通过烧制墨形成的厚膜电阻器的端子。 然后在氧化气氛如空气中，在小于350℃的温度下将油墨的有机载体烧尽。 此后，在足以烧结基质材料的温度下，在非氧化性气氛（例如氮气）中烧制油墨，得到由铜层形成的铜终止物的钌基厚膜电阻器。

公开(公告)号：US06233817B1

公开(公告)日：2001-05-22

申请号：US09232951

申请日：1999-01-17

申请人： Marion Edmond Ellis ,  Frans Peter Lautzenhiser ,  Anthony John Stankavich ,  Dwadasi Hare Rama Sarma ,  Philip Harbaugh Bowles ,  Washington Morris Mobley

发明人： Marion Edmond Ellis ,  Frans Peter Lautzenhiser ,  Anthony John Stankavich ,  Dwadasi Hare Rama Sarma ,  Philip Harbaugh Bowles ,  Washington Morris Mobley

IPC分类号： H05K330

CPC分类号： H01L23/4334 ,  H01L23/142 ,  H01L23/3135 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/053 ,  H05K1/162 ,  H05K1/167 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/207 ,  H01L2224/45099

摘要： A hybrid circuit structure that includes a metal substrate, an inorganic electrical insulator layer and at least one inorganic thick-film passive circuit element, such as a thick-film resistor, capacitor or conductor. An interface layer is provided between the insulator layer and the circuit element to prevent the detrimental effects of interlayer diffusion. The composition of the interface layer is selected to prevent the diffusion of constituents from the inorganic insulator layer, and to have a CTE near that of the circuit element to reduce thermal fatigue. As a result, the passive circuit element can be formed of essentially any one of a number of conventional inorganic thick-film materials that are widely used on alumina substrates.

摘要翻译： 一种混合电路结构，其包括金属基板，无机电绝缘体层和至少一个无机厚膜无源电路元件，例如厚膜电阻器，电容器或导体。 在绝缘体层和电路元件之间提供界面层，以防止层间扩散的不利影响。 选择界面层的组成以防止组分从无机绝缘体层扩散，并且使CTE接近电路元件的CTE以减少热疲劳。 结果，被动电路元件可以由在氧化铝基板上广泛使用的多种常规无机厚膜材料中的任何一种形成。