Abstract:
A mechanism is provided for delivering power to an on-die component (such as a buffer circuit). This may include a package unit having a low frequency delivery path and a high frequency delivery path and a die having the on-die component and a capacitive device each coupled in parallel between a first node and a second node. The die may further include a low frequency reception path and a high frequency reception path. The low frequency reception path may couple to the low frequency delivery path on the package unit and to the first node. The high frequency reception path may couple to the high frequency delivery path on the package unit and to the first node. The high frequency reception path may include a damping resistor.
Abstract:
A circuit includes a capacitor formed with a dielectric including the dielectric encasing elements of the circuit. A detector detects changes in the capacitance of the capacitor.
Abstract:
Leakage current may be reduced in trench isolated semiconductor devices by providing a buffer between the trench isolation and an active area. For example, with a trench isolated photodiode, a buffer of opposite conductivity type may be provided between the trench and the diffusion that forms the p-n junction of the photodiode.
Abstract:
A circuit includes a first oscillator having transistors to produce a first signal with random variations resulting from device channel resistance of the transistors.
Abstract:
Leakage current may be reduced in trench isolated semiconductor devices by providing a buffer between the trench isolation and an active area. For example, with a trench isolated photodiode, a buffer of opposite conductivity type may be provided between the trench and the diffusion that forms the p-n junction of the photodiode.
Abstract:
A method and apparatus for employing a light shield to modulate pixel color responsivity. The improved pixel includes a substrate having a photodiode with a light receiving area. A color filter array material of a first color is disposed above the substrate. The pixel has a first relative responsivity. A light shield is disposed above the substrate to modulate the pixel color responsivity. The light shield forms an aperture whose area is substantially equal to the light receiving area adjusted by a reduction factor. The reduction factor is the result of an arithmetic operation between the first relative responsivity and a second relative responsivity, associated with a second pixel of a second color.
Abstract:
CMOS pixel sensors have been of interest as replacements for CCD's in imaging applications. Such devices promise lower power and simpler system level design through fewer power supply voltages and higher functional integration. It is difficult and cost ineffective to utilize images to test active pixel sensors. Here, a method and apparatus for electrical testing of CMOS pixel sensors is described which involves electrically writing a pattern into the CMOS pixel sensors for the detection of adjacent cell shorts or stuck at faults as well as verification of read-channel circuit functionality and performance. The invention provides for an electrical testing of CMOS pixel array that is simple, time efficient and cost effective for use in, for example, production.
Abstract:
A photodiode is provided. The photodiode includes an insulative region (IR) that permits passage of light therethrough. The photodiode also includes a substrate region of a first conductivity type and a well region of a second conductivity type. The well is formed within the substrate, beneath the IR. The well is demarcated from the substrate by a first surface. The photodiode further includes a heavily doped region (HDR) of the second conductivity type. The HDR is formed within the IR at a first position. The first surface meets the HDR at substantially the first position.
Abstract:
According to one embodiment a computer system is disclosed. The computer system includes a bus and a chipset coupled to the bus. The chipset detects the slew rate of a signal transmitted over the bus by the chipset. In addition the chipset adjusts the slew rate based upon the state of the signal.
Abstract:
A method for controlling a sensor to reduce reset noise is disclosed. The method including the steps of providing a reset command including a RESET signal and a first SAMPLE signal. The method also includes the steps of providing a read command including a first ADDRESS signal, a second SAMPLE signal, and a second ADDRESS signal. An apparatus including a system controller and a sensor controlled by the system controller is also disclosed. In one embodiment, the method and apparatus is provided for a sensor in a sensor array that is read-out in a pipelined fashion.