System and apparatus for photolithography
    1.
    发明授权
    System and apparatus for photolithography 失效
    用于光刻的系统和装置

    公开(公告)号:US07027125B2

    公开(公告)日:2006-04-11

    申请号:US10808740

    申请日:2004-03-25

    IPC分类号: G03B27/52 G03B27/42

    CPC分类号: G03F7/70808 G03F7/70341

    摘要: A photolithographic apparatus, system and method employing an improved refractive medium. The photolithographic apparatus may be used in an immersion lithography system for projecting light onto a workpiece such as a semiconductor wafer. In one embodiment, the photolithographic apparatus includes a container containing a transparent fluid. The fluid container is positioned between a lens element and the wafer. The container is further characterized as having a substantially flexible and transparent bottom membrane contacting an upper surface of the wafer and overlapping at least one side edge of the wafer such that a fluid filled skirt is formed extending beyond the edges of the wafer.

    摘要翻译: 一种使用改进的折射介质的光刻设备,系统和方法。 光刻设备可以用于浸入式光刻系统中,用于将光投射到诸如半导体晶片的工件上。 在一个实施例中,光刻设备包括容纳透明流体的容器。 流体容器位于透镜元件和晶片之间。 该容器的特征还在于具有与晶片的上表面接触并且与晶片的至少一个侧边缘重叠的基本柔性且透明的底膜,从而形成延伸超过晶片边缘的充满液体的裙部。

    Methods for forming a wrap-around gate field effect transistor
    2.
    发明授权
    Methods for forming a wrap-around gate field effect transistor 有权
    形成环绕栅场效应晶体管的方法

    公开(公告)号:US07435653B2

    公开(公告)日:2008-10-14

    申请号:US11735075

    申请日:2007-04-13

    IPC分类号: H01L21/336

    摘要: A field effect transistor is formed having wrap-around, vertically-aligned, dual gate electrodes. Starting with a silicon-on-insulator (SOI) structure having a buried silicon island, a vertical reference edge is defined, by creating a cavity within the SOI structure, and used during two etch-back steps that can be reliably performed. The first etch-back removes a portion of an oxide layer for a first distance over which a gate conductor material is then applied. The second etch-back removes a portion of the gate conductor material for a second distance. The difference between the first and second distances defines the gate length of the eventual device. After stripping away the oxide layers, a vertical gate electrode is revealed that surrounds the buried silicon island on all four side surfaces.

    摘要翻译: 形成具有环绕,垂直排列的双栅电极的场效应晶体管。 从具有掩埋硅岛的绝缘体上硅(SOI)结构开始,通过在SOI结构内产生空腔并在可以可靠地执行的两个回蚀步骤期间使用垂直参考边缘。 第一次回蚀将氧化物层的一部分去除第一距离,然后施加栅极导体材料。 第二次回蚀将栅极导体材料的一部分移除第二距离。 第一和第二距离之间的差异定义了最终设备的栅极长度。 剥离氧化物层后,显示出在所有四个侧表面上包围掩埋硅岛的垂直栅电极。

    Wrap-around gate field effect transistor
    3.
    发明授权
    Wrap-around gate field effect transistor 有权
    环绕栅场效应晶体管

    公开(公告)号:US07271444B2

    公开(公告)日:2007-09-18

    申请号:US10732958

    申请日:2003-12-11

    IPC分类号: H01L29/76

    摘要: A field effect transistor is formed having wrap-around, vertically-aligned, dual gate electrodes. Starting with an silicon-on-insulator (SOI) structure having a buried silicon island, a vertical reference edge is defined, by creating a cavity within the SOI structure, and used during two etch-back steps that can be reliably performed. The first etch-back removes a portion of an oxide layer for a first distance over which a gate conductor material is then applied. The second etch-back removes a portion of the gate conductor material for a second distance. The difference between the first and second distances defines the gate length of the eventual device. After stripping away the oxide layers, a vertical gate electrode is revealed that surrounds the buried silicon island on all four side surfaces.

    摘要翻译: 形成具有环绕,垂直排列的双栅电极的场效应晶体管。 从具有掩埋硅岛的绝缘体上硅(SOI)结构开始,通过在SOI结构内产生空腔并在可以可靠地执行的两个回蚀步骤期间使用垂直参考边。 第一次回蚀将氧化物层的一部分去除第一距离,然后施加栅极导体材料。 第二次回蚀将栅极导体材料的一部分移除第二距离。 第一和第二距离之间的差异定义了最终设备的栅极长度。 剥离氧化物层后,显示出在所有四个侧表面上包围掩埋硅岛的垂直栅电极。

    Method of forming a dual gated FinFET gain cell
    7.
    发明授权
    Method of forming a dual gated FinFET gain cell 有权
    形成双门控FinFET增益单元的方法

    公开(公告)号:US07566613B2

    公开(公告)日:2009-07-28

    申请号:US11221118

    申请日:2005-09-07

    IPC分类号: H01L21/8244

    摘要: A memory gain cell for a memory circuit, a memory circuit formed from multiple memory gain cells, and methods of fabricating such memory gain cells and memory circuits. The memory gain cell includes a storage device capable of holding a stored electrical charge, a write device, and a read device. The read device includes a fin of semiconducting material, electrically-isolated first and second gate electrodes flanking the fin, and a source and drain formed in the fin adjacent to the first and the second gate electrodes. The first gate electrode is electrically coupled with the storage device. The first and second gate electrodes are operative for gating a region of the fin defined between the source and the drain to thereby regulate a current flowing from the source to the drain. When gated, the magnitude of the current is dependent upon the electrical charge stored by the storage device.

    摘要翻译: 用于存储器电路的存储增益单元,由多个存储器增益单元形成的存储器电路,以及制造这种存储器增益单元和存储器电路的方法。 存储器增益单元包括能够保存存储的电荷的存储装置,写入装置和读取装置。 读取装置包括半导体材料的翅片,鳍片侧面的电隔离的第一和第二栅电极,以及形成在与第一和第二栅电极相邻的鳍片中的源极和漏极。 第一栅电极与存储装置电耦合。 第一和第二栅极电极用于选通限定在源极和漏极之间的鳍片的区域,从而调节从源极流到漏极的电流。 当门控时,电流的大小取决于存储设备存储的电量。

    Shallow trench isolation fill by liquid phase deposition of SiO2
    8.
    发明授权
    Shallow trench isolation fill by liquid phase deposition of SiO2 失效
    浅沟槽隔离填充SiO 2的液相沉积

    公开(公告)号:US07273794B2

    公开(公告)日:2007-09-25

    申请号:US10732953

    申请日:2003-12-11

    IPC分类号: H01L21/76

    摘要: To isolate two active regions formed on a silicon-on-insulator (SOI) substrate, a shallow trench isolation region is filled with liquid phase deposited silicon dioxide (LPD-SiO2) while avoiding covering the active areas with the oxide. By selectively depositing the oxide in this manner, the polishing needed to planarize the wafer is significantly reduced as compared to a chemical-vapor deposited oxide layer that covers the entire wafer surface. Additionally, the LPD-SiO2 does not include the growth seams that CVD silicon dioxide does. Accordingly, the etch rate of the LPD-SiO2 is uniform across its entire expanse thereby preventing cavities and other etching irregularities present in prior art shallow trench isolation regions in which the etch rate of growth seams exceeds that of the other oxide areas.

    摘要翻译: 为了隔离形成在绝缘体上硅(SOI)衬底上的两个有源区,浅沟槽隔离区填充有液相沉积二氧化硅(LPD-SiO 2),同时避免覆盖有源区 与氧化物。 通过以这种方式选择性地沉积氧化物,与覆盖整个晶片表面的化学气相沉积氧化物层相比,平坦化晶片所需的抛光显着降低。 此外,LPD-SiO 2不包括CVD二氧化硅的生长接缝。 因此,LPD-SiO 2的蚀刻速率在其整个宽度上是均匀的,从而防止存在于现有技术的浅沟槽隔离区域中的空穴和其它蚀刻不规则性,其中生长接缝的蚀刻速率超过 其他氧化物区域。

    Moving lens for immersion optical lithography
    10.
    发明授权
    Moving lens for immersion optical lithography 失效
    移动透镜用于浸没式光刻

    公开(公告)号:US07088422B2

    公开(公告)日:2006-08-08

    申请号:US10749638

    申请日:2003-12-31

    CPC分类号: G03F7/70341 G03F7/70258

    摘要: An apparatus for immersion optical lithography having a lens capable of relative movement in synchrony with a horizontal motion of a semiconductor wafer in a liquid environment where the synchronous motion of the lens apparatus and semiconductor wafer advantageously reduces the turbulence and air bubbles associated with a liquid environment. The relative motions of the lens and semiconductor wafer are substantially the same as the scanning process occurs resulting in optimal image resolution with minimal air bubbles, turbulence, and disruption of the liquid environment.

    摘要翻译: 一种用于浸没式光刻的装置,其具有能够在液晶环境中与半导体晶片的水平运动同步的透镜的透镜,其中透镜装置和半导体晶片的同步运动有利地减少了与液体环境相关的湍流和气泡 。 透镜和半导体晶片的相对运动基本上与扫描过程相同,导致最小的图像分辨率,最小的气泡,湍流和液体环境的破坏。