公开(公告)号：US20070224346A1

公开(公告)日：2007-09-27

申请号：US11386631

申请日：2006-03-22

申请人： Mark Wojtaszek ,  James Watkowski ,  Gary Larson ,  Peter Kukanskis

发明人： Mark Wojtaszek ,  James Watkowski ,  Gary Larson ,  Peter Kukanskis

IPC分类号： B05D3/02 ,  B05D3/04 ,  B05D3/10 ,  B05D1/18 ,  C23C14/02 ,  H05H1/00

CPC分类号： H05K3/181 ,  C08J7/12 ,  C08J7/123 ,  C08J2379/08 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  H05K1/0346 ,  H05K3/381 ,  H05K2201/0344 ,  H05K2203/0793 ,  H05K2203/095 ,  H05K2203/097

摘要： The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.

摘要翻译： 本发明涉及用于金属化聚合物基材例如聚酰亚胺的改进方法。 本发明包括以下步骤：用等离子体喷射或电晕放电表面处理对聚合物基材进行表面处理，用包含氢氧化物和离子钯的蚀刻溶液调节和蚀刻聚合物基材，用离子钯活化聚合物底物，还原钯 在聚合物基材上，将无电镍层电镀到制备的聚合物基材上，并在化学镀镍层上镀覆无电解铜层。 本发明的方法提供了一种改进的制备聚合物基质的方法，用于其后的电解电镀。

公开(公告)号：US07666471B2

公开(公告)日：2010-02-23

申请号：US11386631

申请日：2006-03-22

申请人： Mark Wojtaszek ,  James Watkowski ,  Gary B. Larson ,  Peter Kukanskis

发明人： Mark Wojtaszek ,  James Watkowski ,  Gary B. Larson ,  Peter Kukanskis

IPC分类号： B05D3/02 ,  B05D3/04 ,  C23C14/02 ,  H05H1/00

CPC分类号： H05K3/181 ,  C08J7/12 ,  C08J7/123 ,  C08J2379/08 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  H05K1/0346 ,  H05K3/381 ,  H05K2201/0344 ,  H05K2203/0793 ,  H05K2203/095 ,  H05K2203/097

摘要： The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.

摘要翻译： 本发明涉及用于金属化聚合物基材例如聚酰亚胺的改进方法。 本发明包括以下步骤：用等离子体喷射或电晕放电表面处理对聚合物基材进行表面处理，用包含氢氧化物和离子钯的蚀刻溶液调节和蚀刻聚合物基材，用离子钯活化聚合物底物，还原钯 在聚合物基材上，将无电镍层电镀到制备的聚合物基材上，并在化学镀镍层上镀覆无电解铜层。 本发明的方法提供了一种改进的制备聚合物基质的方法，用于其后的电解电镀。

公开(公告)号：USRE45842E1

公开(公告)日：2016-01-12

申请号：US13463087

申请日：2012-05-03

申请人： Ronald Redline ,  David Sawoska ,  Peter Kukanskis ,  Donald Ferrier ,  Eric Yakobson

发明人： Ronald Redline ,  David Sawoska ,  Peter Kukanskis ,  Donald Ferrier ,  Eric Yakobson

IPC分类号： B23K35/00 ,  C23C18/42 ,  C25D3/46 ,  H05K3/24 ,  C23C18/31 ,  C25D3/02 ,  C23C18/54

CPC分类号： H05K3/244 ,  B23K35/007 ,  C23C18/42 ,  C23C18/54 ,  H05K2203/073

摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

公开(公告)号：US06585904B2

公开(公告)日：2003-07-01

申请号：US09784242

申请日：2001-02-15

申请人： Peter Kukanskis ,  Dennis Fritz ,  Frank Durso ,  Steven Castaldi ,  David Sawoska

发明人： Peter Kukanskis ,  Dennis Fritz ,  Frank Durso ,  Steven Castaldi ,  David Sawoska

IPC分类号： H01B1300

CPC分类号： H01C17/24 ,  H01C17/242 ,  H05K1/167 ,  H05K3/027 ,  H05K3/064 ,  H05K3/184 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K2203/171

摘要： A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

公开(公告)号：US06474536B1

公开(公告)日：2002-11-05

申请号：US09672577

申请日：2000-09-28

申请人： Peter Kukanskis

发明人： Peter Kukanskis

IPC分类号： B23K35363

CPC分类号： B23K35/3615 ,  B23K35/3612 ,  B23K2101/36 ,  H05K3/3489

摘要： A new soldering flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards is disclosed. The new flux composition includes chemical reducing agents such as hydrazine, hydroxylamine, dimethylamine borane, and hydroquinone.

摘要翻译： 公开了一种新的焊剂组合物，以及用于将电子部件焊接到印刷电路板的相应方法。 新的助焊剂组合物包括化学还原剂如肼，羟胺，二甲胺硼烷和氢醌。

公开(公告)号：US5693364A

公开(公告)日：1997-12-02

申请号：US739949

申请日：1996-10-30

申请人： Peter Kukanskis

发明人： Peter Kukanskis

IPC分类号： H05K3/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/42 ,  B05D5/12

CPC分类号： H05K3/428 ,  H05K3/243 ,  H05K2203/0565 ,  H05K2203/0571 ,  H05K2203/072 ,  H05K3/28 ,  H05K3/282 ,  Y10T29/49165

摘要： The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce the circuit boards.

摘要翻译： 本发明涉及印刷电路板的制造方法。 该方法考虑了用于该制造过程的新颖的处理顺序，该方法在减少生产电路板当前所需的化学品的步骤数量和种类方面特别通用。

公开(公告)号：USRE45881E1

公开(公告)日：2016-02-09

申请号：US13463110

申请日：2012-05-03

申请人： Ronald Redline ,  David Sawoska ,  Peter Kukanskis ,  Donald Ferrier ,  Eric Yakobson

发明人： Ronald Redline ,  David Sawoska ,  Peter Kukanskis ,  Donald Ferrier ,  Eric Yakobson

IPC分类号： B23K35/00 ,  C25D3/02 ,  C25D3/46 ,  H05K3/24 ,  C23C18/42 ,  B05D5/12 ,  C23C18/54

CPC分类号： B23K35/007 ,  B05D5/12 ,  C23C18/42 ,  C23C18/54 ,  C25D3/46 ,  H05K3/244

摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant electromigration.

摘要翻译： 公开了一种用于增强金属表面的可焊性的方法，其中金属表面在焊接之前镀有浸银板，该浸渍银板用选自脂肪胺，脂肪酰胺，季铵盐 ，间苯二甲酸盐，树脂胺，树脂酰胺，脂肪酸，树脂酸，上述任何一种的乙氧基化衍生物，以及任何上述物质的混合物。 所产生的沉浸银沉积物是电阻迁移。

公开(公告)号：US07022464B2

公开(公告)日：2006-04-04

申请号：US10925589

申请日：2004-08-25

申请人： Peter Kukanskis ,  Steven Castaldi

发明人： Peter Kukanskis ,  Steven Castaldi

IPC分类号： G03F7/00 ,  C22C18/32

CPC分类号： H05K1/167 ,  H05K3/184 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/1453

摘要： An integral plated resistor having an improved range of resistance is produced by uniformly dispersing an effective amount of various particles in an electroless nickel phosphorus plating composition so that the particles are codeposited with the electroless nickel phosphorus plating composition. Preferred particles include, polytetrafluoroethylene, silicon carbide, tungsten carbide, and other particles that fully sinter at a temperature of less than about 170° C. The improved nickel phosphorus plated resistors of the invention demonstrate increased stability during manufacturing press cycles and a greater range of resistance values than have previously been achieved.

摘要翻译： 通过将有效量的各种颗粒均匀分散在无电镀镍磷电镀组合物中，使得颗粒与无电镀镍磷电镀组合物共沉积，从而产生具有改善的电阻范围的整体镀覆电阻。 优选的颗粒包括聚四氟乙烯，碳化硅，碳化钨和在小于约170℃的温度下完全烧结的其它颗粒。本发明的改进的镀镍电阻器在制造压制循环期间表现出增加的稳定性和更大范围的 电阻值比以前已经实现。

公开(公告)号：US20060046202A1

公开(公告)日：2006-03-02

申请号：US10925589

申请日：2004-08-25

申请人： Peter Kukanskis ,  Steven Castaldi

发明人： Peter Kukanskis ,  Steven Castaldi

IPC分类号： G03F7/00

CPC分类号： H05K1/167 ,  H05K3/184 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/1453

摘要： An integral plated resistor having an improved range of resistance is produced by uniformly dispersing an effective amount of various particles in an electroless nickel phosphorus plating composition so that the particles are codeposited with the electroless nickel phosphorus plating composition. Preferred particles include, polytetrafluoroethylene, silicon carbide, tungsten carbide, and other particles that fully sinter at a temperature of less than about 170° C. The improved nickel phosphorus plated resistors of the invention demonstrate increased stability during manufacturing press cycles and a greater range of resistance values than have previously been achieved.

摘要翻译： 通过将有效量的各种颗粒均匀分散在无电镀镍磷电镀组合物中，使得颗粒与无电镀镍磷电镀组合物共沉积，从而产生具有改善的电阻范围的整体电镀电阻。 优选的颗粒包括聚四氟乙烯，碳化硅，碳化钨和在小于约170℃的温度下完全烧结的其它颗粒。本发明的改进的镀镍电阻器在制造压制循环期间表现出增加的稳定性和更大范围的 电阻值比以前已经实现。

公开(公告)号：US5620612A

公开(公告)日：1997-04-15

申请号：US518025

申请日：1995-08-22

申请人： Peter Kukanskis ,  John J. Grunwald

发明人： Peter Kukanskis ,  John J. Grunwald

IPC分类号： H05K3/18 ,  H05K3/24 ,  H05K3/42 ,  B44C1/22

CPC分类号： H05K3/428 ,  H05K3/427 ,  H05K3/243 ,  H05K3/244

摘要： The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce the circuit boards.