公开(公告)号：US09786627B2

公开(公告)日：2017-10-10

申请号：US14348356

申请日：2012-09-10

申请人： Martin Becker ,  Ronald Eisele ,  Frank Osterwald ,  Jacek Rudzki

发明人： Martin Becker ,  Ronald Eisele ,  Frank Osterwald ,  Jacek Rudzki

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L21/683

CPC分类号： H01L24/80 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L2221/68322 ,  H01L2221/68363 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/03003 ,  H01L2224/03013 ,  H01L2224/0311 ,  H01L2224/0312 ,  H01L2224/03438 ,  H01L2224/03505 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/29339 ,  H01L2224/29399 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48491 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/1033 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/35 ,  H01L2924/351 ,  Y10T156/10 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2224/03 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00015

摘要： The invention relates to a method for connecting a power semi-conductor chip having upper-sided potential surfaces to thick wires or strips, consisting of the following steps: Providing a metal molded body corresponding to the shape of the upper-sided potential surfaces, applying a connecting layer to the upper-sided potential surfaces or to the metal molded bodies, and applying the metal molded bodies and adding a material fit, electrically conductive compound to the potential surfaces prior to the joining of the thick wire bonds to the non-added upper side of the molded body.

公开(公告)号：US20140225247A1

公开(公告)日：2014-08-14

申请号：US14346458

申请日：2012-09-10

申请人： Martin Becker ,  Ronald Eisele ,  Frank Osterwald ,  Jacek Rudzki

发明人： Martin Becker ,  Ronald Eisele ,  Frank Osterwald ,  Jacek Rudzki

IPC分类号： H01L23/492

CPC分类号： H01L24/85 ,  H01L21/6835 ,  H01L23/4924 ,  H01L23/562 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68372 ,  H01L2224/03013 ,  H01L2224/0311 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/2908 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/786 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2224/8384 ,  H01L2224/85001 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/1203 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00011

摘要： The invention relates to a power semiconductor chip (10) having at least one upper-sided potential surface and contacting thick wires (50) or strips, comprising a connecting layer (I) on the potential surfaces, and at least one metal moulded body (24, 25) on the connecting layer(s), the lower flat side thereof facing the potential surface being provided with a coating to be applied to the connecting layer (I) according to a connection method, and the material composition thereof and the thickness of the related thick wires (50) or strips arranged on the upper side of the moulded body used according to the method for contacting are selected corresponding to the magnitude.

摘要翻译： 本发明涉及一种功率半导体芯片（10），其具有至少一个上侧电位表面，并且接触厚电线（50）或条带，包括在电位表面上的连接层（I）和至少一个金属模制体 24,25），其面向电位表面的下平面侧根据连接方法设置有施加到连接层（I）的涂层，其材料组成和厚度 根据接触方法使用的相关的粗线（50）或布置在模制体的上侧上的条对应于大小来选择。

公开(公告)号：US09318421B2

公开(公告)日：2016-04-19

申请号：US14346458

申请日：2012-09-10

申请人： Martin Becker ,  Ronald Eisele ,  Frank Osterwald ,  Jacek Rudzki

发明人： Martin Becker ,  Ronald Eisele ,  Frank Osterwald ,  Jacek Rudzki

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/492 ,  H01L23/00

CPC分类号： H01L24/85 ,  H01L21/6835 ,  H01L23/4924 ,  H01L23/562 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68372 ,  H01L2224/03013 ,  H01L2224/0311 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/2908 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/786 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2224/8384 ,  H01L2224/85001 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/1203 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00011

摘要： The invention relates to a power semiconductor chip (10) having at least one upper-sided potential surface and contacting thick wires (50) or strips, comprising a connecting layer (I) on the potential surfaces, and at least one metal molded body (24, 25) on the connecting layer(s), the lower flat side thereof facing the potential surface being provided with a coating to be applied to the connecting layer (I) according to a connection method, and the material composition thereof and the thickness of the related thick wires (50) or strips arranged on the upper side of the molded body used according to the method for contacting are selected corresponding to the magnitude.

摘要翻译： 本发明涉及一种功率半导体芯片（10），其具有至少一个上侧电位表面，并且接触厚电线（50）或条带，包括在电位表面上的连接层（I）和至少一个金属模制体 24,25），其面向电位表面的下平面侧根据连接方法设置有施加到连接层（I）的涂层，其材料组成和厚度 根据接触方法使用的相关的粗线（50）或布置在模制体的上侧上的条对应于大小来选择。

公开(公告)号：US20130032230A1

公开(公告)日：2013-02-07

申请号：US13640581

申请日：2011-04-08

申请人： Klaus Olesen ,  Lars Paulsen ,  Andre Daniel ,  Frank Osterwald

发明人： Klaus Olesen ,  Lars Paulsen ,  Andre Daniel ,  Frank Osterwald

IPC分类号： F16L41/00

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  Y10T137/85938 ,  H01L2924/00

摘要： A flow distributor for distributing a flow of fluid through a cooling body, the flow distributor comprising: an inlet manifold; an outlet manifold; and one or more flow cells, each being arranged to fluidly interconnect the inlet manifold and the outlet manifold, each flow cell comprising a cell inlet in fluid communication with the inlet manifold, a cell outlet in fluid communication with the outlet manifold, and a flow channel for guiding a flow of fluid from the cell inlet to the cell outlet, wherein the flow distributor is formed within a solid layer which is bonded directly to an insulating layer to be cooled.

摘要翻译： 一种用于分配流体流过冷却体的流量分配器，所述流量分配器包括：入口歧管; 出口歧管 以及一个或多个流动池，每个流动池被布置成流体地互连入口歧管和出口歧管，每个流动池包括与入口歧管流体连通的电池入口，与出口歧管流体连通的电池出口，以及流 用于引导流体从细胞入口到细胞出口的通道，其中流动分配器形成在直接结合到要冷却的绝缘层的固体层中。