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1.发明授权公开(公告)号：US08212322B2
公开(公告)日：2012-07-03
申请号：US12720354
申请日：2010-03-09
IPC分类号： H01L21/8234 , H01L21/8244
CPC分类号： H01L27/1104 , H01L27/11 , H01L27/1108
摘要： Techniques for combining transistors having different threshold voltage requirements from one another are provided. In one aspect, a semiconductor device comprises a substrate having a first and a second nFET region, and a first and a second pFET region; a logic nFET on the substrate over the first nFET region; a logic pFET on the substrate over the first pFET region; a SRAM nFET on the substrate over the second nFET region; and a SRAM pFET on the substrate over the second pFET region, each comprising a gate stack having a metal layer over a high-K layer. The logic nFET gate stack further comprises a capping layer separating the metal layer from the high-K layer, wherein the capping layer is further configured to shift a threshold voltage of the logic nFET relative to a threshold voltage of one or more of the logic pFET, SRAM nFET and SRAM pFET.
摘要翻译： 提供了用于组合彼此具有不同阈值电压要求的晶体管的技术。 在一个方面，一种半导体器件包括具有第一和第二nFET区的衬底以及第一和第二pFET区; 在第一nFET区域上的衬底上的逻辑nFET; 在第一pFET区上的衬底上的逻辑pFET; 位于第二nFET区上的衬底上的SRAM nFET; 以及在第二pFET区上的衬底上的SRAM pFET，每个包括在高K层上具有金属层的栅极堆叠。 逻辑nFET栅极堆叠还包括将金属层与高K层分隔开的覆盖层，其中封盖层还被配置为相对于逻辑pFET中的一个或多个的阈值电压移动逻辑nFET的阈值电压 ，SRAM nFET和SRAM pFET。
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2.发明申请公开(公告)号：US20100164011A1
公开(公告)日：2010-07-01
申请号：US12720354
申请日：2010-03-09
IPC分类号： H01L29/78
CPC分类号： H01L27/1104 , H01L27/11 , H01L27/1108
摘要： Techniques for combining transistors having different threshold voltage requirements from one another are provided. In one aspect, a semiconductor device comprises a substrate having a first and a second nFET region, and a first and a second pFET region; a logic nFET on the substrate over the first nFET region; a logic pFET on the substrate over the first pFET region; a SRAM nFET on the substrate over the second nFET region; and a SRAM pFET on the substrate over the second pFET region, each comprising a gate stack having a metal layer over a high-K layer. The logic nFET gate stack further comprises a capping layer separating the metal layer from the high-K layer, wherein the capping layer is further configured to shift a threshold voltage of the logic nFET relative to a threshold voltage of one or more of the logic pFET, SRAM nFET and SRAM pFET.
摘要翻译： 提供了用于组合彼此具有不同阈值电压要求的晶体管的技术。 在一个方面，一种半导体器件包括具有第一和第二nFET区的衬底以及第一和第二pFET区; 在第一nFET区域上的衬底上的逻辑nFET; 在第一pFET区上的衬底上的逻辑pFET; 位于第二nFET区上的衬底上的SRAM nFET; 以及在第二pFET区上的衬底上的SRAM pFET，每个包括在高K层上具有金属层的栅极堆叠。 逻辑nFET栅极堆叠还包括将金属层与高K层分隔开的覆盖层，其中封盖层还被配置为相对于逻辑pFET中的一个或多个的阈值电压移动逻辑nFET的阈值电压 ，SRAM nFET和SRAM pFET。
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3.发明授权公开(公告)号：US08680623B2
公开(公告)日：2014-03-25
申请号：US13433815
申请日：2012-03-29
IPC分类号： H01L21/8244 , H01L21/70
CPC分类号： H01L27/1104 , H01L27/11 , H01L27/1108
摘要： Techniques for combining transistors having different threshold voltage requirements from one another are provided. In one aspect, a semiconductor device comprises a substrate having a first and a second nFET region, and a first and a second pFET region; a logic nFET on the substrate over the first nFET region; a logic pFET on the substrate over the first pFET region; a SRAM nFET on the substrate over the second nFET region; and a SRAM pFET on the substrate over the second pFET region, each comprising a gate stack having a metal layer over a high-K layer. The logic nFET gate stack further comprises a capping layer separating the metal layer from the high-K layer, wherein the capping layer is further configured to shift a threshold voltage of the logic nFET relative to a threshold voltage of one or more of the logic pFET, SRAM nFET and SRAM pFET.
摘要翻译： 提供了用于组合彼此具有不同阈值电压要求的晶体管的技术。 在一个方面，一种半导体器件包括具有第一和第二nFET区的衬底以及第一和第二pFET区; 在第一nFET区域上的衬底上的逻辑nFET; 在第一pFET区上的衬底上的逻辑pFET; 位于第二nFET区上的衬底上的SRAM nFET; 以及在第二pFET区上的衬底上的SRAM pFET，每个包括在高K层上具有金属层的栅极堆叠。 逻辑nFET栅极堆叠还包括将金属层与高K层分隔开的覆盖层，其中封盖层还被配置为相对于逻辑pFET中的一个或多个的阈值电压移动逻辑nFET的阈值电压 ，SRAM nFET和SRAM pFET。
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4.发明申请公开(公告)号：US20120181610A1
公开(公告)日：2012-07-19
申请号：US13433815
申请日：2012-03-29
IPC分类号： H01L27/092
CPC分类号： H01L27/1104 , H01L27/11 , H01L27/1108
摘要： Techniques for combining transistors having different threshold voltage requirements from one another are provided. In one aspect, a semiconductor device comprises a substrate having a first and a second nFET region, and a first and a second pFET region; a logic nFET on the substrate over the first nFET region; a logic pFET on the substrate over the first pFET region; a SRAM nFET on the substrate over the second nFET region; and a SRAM pFET on the substrate over the second pFET region, each comprising a gate stack having a metal layer over a high-K layer. The logic nFET gate stack further comprises a capping layer separating the metal layer from the high-K layer, wherein the capping layer is further configured to shift a threshold voltage of the logic nFET relative to a threshold voltage of one or more of the logic pFET, SRAM nFET and SRAM pFET.
摘要翻译： 提供了用于组合彼此具有不同阈值电压要求的晶体管的技术。 在一个方面，一种半导体器件包括具有第一和第二nFET区的衬底以及第一和第二pFET区; 在第一nFET区域上的衬底上的逻辑nFET; 在第一pFET区上的衬底上的逻辑pFET; 位于第二nFET区上的衬底上的SRAM nFET; 以及在第二pFET区上的衬底上的SRAM pFET，每个包括在高K层上具有金属层的栅极堆叠。 逻辑nFET栅极堆叠还包括将金属层与高K层分隔开的覆盖层，其中封盖层还被配置为相对于逻辑pFET中的一个或多个的阈值电压移动逻辑nFET的阈值电压 ，SRAM nFET和SRAM pFET。
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5.发明授权公开(公告)号：US07718496B2
公开(公告)日：2010-05-18
申请号：US11927964
申请日：2007-10-30
IPC分类号： H01L21/8234 , H01L21/8244
CPC分类号： H01L27/1104 , H01L27/11 , H01L27/1108
摘要： Techniques for combining transistors having different threshold voltage requirements from one another are provided. In one aspect, a semiconductor device comprises a substrate having a first and a second nFET region, and a first and a second pFET region; a logic nFET on the substrate over the first nFET region; a logic pFET on the substrate over the first pFET region; a SRAM nFET on the substrate over the second nFET region; and a SRAM pFET on the substrate over the second pFET region, each comprising a gate stack having a metal layer over a high-K layer. The logic nFET gate stack further comprises a capping layer separating the metal layer from the high-K layer, wherein the capping layer is further configured to shift a threshold voltage of the logic nFET relative to a threshold voltage of one or more of the logic pFET, SRAM nFET and SRAM pFET.
摘要翻译： 提供了用于组合彼此具有不同阈值电压要求的晶体管的技术。 在一个方面，一种半导体器件包括具有第一和第二nFET区的衬底以及第一和第二pFET区; 在第一nFET区域上的衬底上的逻辑nFET; 在第一pFET区上的衬底上的逻辑pFET; 位于第二nFET区上的衬底上的SRAM nFET; 以及在第二pFET区上的衬底上的SRAM pFET，每个包括在高K层上具有金属层的栅极堆叠。 逻辑nFET栅极堆叠还包括将金属层与高K层分隔开的覆盖层，其中封盖层还被配置为相对于逻辑pFET中的一个或多个的阈值电压移动逻辑nFET的阈值电压 ，SRAM nFET和SRAM pFET。
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6.发明申请公开(公告)号：US20090108373A1
公开(公告)日：2009-04-30
申请号：US11927964
申请日：2007-10-30
IPC分类号： H01L27/11 , H01L21/8244
CPC分类号： H01L27/1104 , H01L27/11 , H01L27/1108
摘要： Techniques for combining transistors having different threshold voltage requirements from one another are provided. In one aspect, a semiconductor device comprises a substrate having a first and a second nFET region, and a first and a second pFET region; a logic nFET on the substrate over the first nFET region; a logic pFET on the substrate over the first pFET region; a SRAM nFET on the substrate over the second nFET region; and a SRAM pFET on the substrate over the second pFET region, each comprising a gate stack having a metal layer over a high-K layer. The logic nFET gate stack further comprises a capping layer separating the metal layer from the high-K layer, wherein the capping layer is further configured to shift a threshold voltage of the logic nFET relative to a threshold voltage of one or more of the logic pFET, SRAM nFET and SRAM pFET.
摘要翻译： 提供了用于组合彼此具有不同阈值电压要求的晶体管的技术。 在一个方面，一种半导体器件包括具有第一和第二nFET区的衬底以及第一和第二pFET区; 在第一nFET区域上的衬底上的逻辑nFET; 在第一pFET区上的衬底上的逻辑pFET; 位于第二nFET区上的衬底上的SRAM nFET; 以及在第二pFET区上的衬底上的SRAM pFET，每个包括在高K层上具有金属层的栅极堆叠。 逻辑nFET栅极堆叠还包括将金属层与高K层分隔开的覆盖层，其中封盖层还被配置为相对于逻辑pFET中的一个或多个的阈值电压移动逻辑nFET的阈值电压 ，SRAM nFET和SRAM pFET。
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公开(公告)号：US20140239258A1
公开(公告)日：2014-08-28
申请号：US13571657
申请日：2012-08-10
CPC分类号： H01L29/0847 , B82Y10/00 , H01L29/0665 , H01L29/0669 , H01L29/0673 , H01L29/0895 , H01L29/402 , H01L29/42356 , H01L29/42392 , H01L29/66477 , H01L29/66977 , H01L29/7391 , H01L29/775 , H01L29/78 , H01L29/78618 , H01L29/78696 , Y10S977/723 , Y10S977/938
摘要： A tunnel field effect transistor (TFET) includes a source region, the source region comprising a first portion of a nanowire; a channel region, the channel region comprising a second portion of the nanowire; a drain region, the drain region comprising a portion of a silicon pad, the silicon pad being located adjacent to the channel region; and a gate configured such that the gate surrounds the channel region and at least a portion of the source region.
摘要翻译： 隧道场效应晶体管（TFET）包括源区，源区包括纳米线的第一部分; 沟道区，所述沟道区包括纳米线的第二部分; 漏极区域，所述漏极区域包括硅衬垫的一部分，所述硅衬垫位于所述沟道区域附近; 以及栅极，其被配置为使得所述栅极围绕所述沟道区域和所述源极区域的至少一部分。
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公开(公告)号：US08343815B2
公开(公告)日：2013-01-01
申请号：US12777881
申请日：2010-05-11
IPC分类号： H01L29/72
CPC分类号： H01L29/0847 , B82Y10/00 , H01L29/0665 , H01L29/0669 , H01L29/0673 , H01L29/0895 , H01L29/402 , H01L29/42356 , H01L29/42392 , H01L29/66477 , H01L29/66977 , H01L29/7391 , H01L29/775 , H01L29/78 , H01L29/78618 , H01L29/78696 , Y10S977/723 , Y10S977/938
摘要： A tunnel field effect transistor (TFET) includes a source region, the source region comprising a first portion of a nanowire; a channel region, the channel region comprising a second portion of the nanowire; a drain region, the drain region comprising a portion of a silicon pad, the silicon pad being located adjacent to the channel region; and a gate configured such that the gate surrounds the channel region and at least a portion of the source region.
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9.发明授权High-K dielectric and metal gate stack with minimal overlap with isolation region 有权高K电介质和金属栅极堆叠与隔离区域重叠公开(公告)号：US08232606B2
公开(公告)日：2012-07-31
申请号：US13150378
申请日：2011-06-01
IPC分类号： H01L29/76
CPC分类号： H01L29/517 , H01L21/28123 , H01L21/823842 , H01L21/823857 , H01L29/513 , H01L29/518
摘要： A high-k dielectric and metal gate stack with minimal overlap with an adjacent oxide isolation region and related methods are disclosed. One embodiment of the gate stack includes a high dielectric constant (high-k) dielectric layer, a tuning layer and a metal layer positioned over an active region defined by an oxide isolation region in a substrate, wherein an outer edge of the high-k dielectric layer, the tuning layer and the metal layer overlaps the oxide isolation region by less than approximately 200 nanometers. The gate stack and related methods eliminate the regrowth effect in short channel devices by restricting the amount of overlap area between the gate stack and adjacent oxide isolation regions.
摘要翻译： 公开了一种与相邻氧化物隔离区域具有最小重叠的高k电介质和金属栅极叠层及相关方法。 栅堆叠的一个实施例包括高介电常数（高k）电介质层，调谐层和位于由衬底中的氧化物隔离区限定的有源区上的金属层，其中高k的外边缘 电介质层，调谐层和金属层与氧化物隔离区重叠小于约200纳米。 栅极堆叠和相关方法通过限制栅极堆叠和相邻氧化物隔离区域之间的重叠区域的量来消除短沟道器件中的再生长效应。
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公开(公告)号：US20100295022A1
公开(公告)日：2010-11-25
申请号：US12470159
申请日：2009-05-21
IPC分类号： H01L29/66 , H01L21/3205 , H01L29/78 , H01L21/336
CPC分类号： H01L29/0665 , B82Y10/00 , H01L29/0673 , H01L29/42392 , H01L29/66439 , H01L29/775 , H01L29/78696
摘要： Nanowire-based field-effect transistors (FETs) and techniques for the fabrication thereof are provided. In one aspect, a FET is provided having a plurality of device layers oriented vertically in a stack, each device layer having a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region, wherein one or more of the device layers are configured to have a different threshold voltage from one or more other of the device layers; and a gate common to each of the device layers surrounding the nanowire channels.
摘要翻译： 提供了基于纳米线的场效应晶体管（FET）及其制造技术。 在一个方面，提供了一种FET，其具有在堆叠中垂直取向的多个器件层，每个器件层具有源极区，漏极区和连接源极区和漏极区的多个纳米线通道，其中一个或多个 的器件层被配置为具有来自一个或多个其它器件层的不同阈值电压; 以及围绕纳米线通道的每个器件层共用的栅极。
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