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    ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY
    2.
    发明申请
    ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY 有权
    方向独立的设备配置和组装

    公开(公告)号：US20150093860A1

    公开(公告)日：2015-04-02

    申请号：US14040552

    申请日：2013-09-27

    申请人： David W. Hamby ,  Adam M. Scotch ,  Sridharan Venk ,  Alan Lenef

    发明人： David W. Hamby ,  Adam M. Scotch ,  Sridharan Venk ,  Alan Lenef

    IPC分类号： H01L33/62 ,  H01L33/38 ,  H05K1/11 ,  H01L23/00

    CPC分类号： H01L33/62 ,  H01L24/83 ,  H01L33/38 ,  H01L2924/12041 ,  H05K1/111 ,  H05K3/303 ,  H05K2201/0939 ,  H05K2201/09809 ,  H05K2201/10106 ,  H05K2203/048 ,  H05K2203/0776 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

    摘要： The present disclosure is directed to orientation-independent device configuration and assembly. An electronic device may comprise conductive pads arranged concentrically on a surface of the device. The conductive pads on the device may mate with conductive pads in a device location in circuitry. Example conductive pads may include at least a first circular conductive pad and a second ring-shaped conductive pad arranged to concentrically surround the first conductive pad. The concentric arrangement of the conductive pads allows for orientation-independent placement of the device in the circuitry. In particular, the conductive pads of the device will mate correctly with the conductive pads of the circuitry regardless of variability in device orientation. In one embodiment, the device may also be configured for use with fluidic self-assembly (FSA). For example, a device housing may be manufactured with pockets that cause the device to attain neutral buoyancy during manufacture.

    摘要翻译： 本公开涉及定向无关的装置配置和组装。 电子设备可以包括同心地布置在设备的表面上的导电焊盘。 器件上的导电焊盘可与电路中的器件位置中的导电焊盘配合。 示例性导电焊盘可以包括至少第一圆形导电焊盘和布置成同心地围绕第一导电焊盘的第二环形导电焊盘。 导电焊盘的同心布置允许器件在电路中的定向无关放置。 特别地，器件的导电焊盘将正确地与电路的导电焊盘配合，而不管器件取向如何变化。 在一个实施例中，该装置还可以被配置为与流体自组装（FSA）一起使用。 例如，可以制造具有在制造期间使装置达到中性浮力的袋的装置壳体。

    Wavelength Converter for an LED, Method of Making, and LED Containing Same
    3.
    发明申请
    Wavelength Converter for an LED, Method of Making, and LED Containing Same 有权
    用于LED的波长转换器，制造方法和包含相同的LED

    公开(公告)号：US20130313603A1

    公开(公告)日：2013-11-28

    申请号：US13982667

    申请日：2012-01-31

    申请人： Darshan Kundaliya ,  Madis Raukas ,  Adam M. Scotch ,  David Hamby ,  Kailash Mishra ,  Matthew Stough

    发明人： Darshan Kundaliya ,  Madis Raukas ,  Adam M. Scotch ,  David Hamby ,  Kailash Mishra ,  Matthew Stough

    IPC分类号： H01L33/50 ,  C30B23/02 ,  C30B23/06 ,  C09K11/77 ,  C30B29/68

    CPC分类号： H01L33/502 ,  C09K11/7701 ,  C09K11/7721 ,  C09K11/7774 ,  C30B23/025 ,  C30B23/066 ,  C30B29/68 ,  Y10T428/24942

    摘要： A wavelength converter for an LED is described that comprises a substrate of monocrystalline garnet having a cubic crystal structure, a first lattice parameter and an oriented crystal face. An epitaxial layer is formed directly on the oriented crystal face of the substrate. The layer is comprised of a monocrystalline garnet phosphor having a cubic crystal structure and a second lattice parameter that is different from the first lattice parameter wherein the difference between the first lattice parameter and the second lattice parameter results in a lattice mismatch within a range of ±15%. The strain induced in the phosphor layer by the lattice mismatch shifts the emission of the phosphor to longer wavelengths when a tensile strain is induced and to shorter wavelengths when a compressive strain is induced. Preferably, the wavelength converter is mounted on the light emitting surface of a blue LED to produce an LED light source.

    摘要翻译： 描述了一种用于LED的波长转换器，其包括具有立方晶体结构的单晶石榴石基底，第一晶格参数和取向晶体面。 外延层直接形成在基板的取向晶面上。 该层由具有立方晶体结构的单晶石榴石荧光体和与第一晶格参数不同的第二晶格参数组成，其中第一晶格参数和第二晶格参数之间的差异导致在± 15％。 通过晶格失配在荧光体层中诱发的应变当诱发拉伸应变时将磷光体的发射移动到更长的波长，并且当产生压缩应变时将其发射到较短的波长。 优选地，波长转换器安装在蓝色LED的发光表面上以产生LED光源。

    Modular lighting techniques
    4.
    发明授权
    Modular lighting techniques 有权
    模块化照明技术

    公开(公告)号：US09243790B2

    公开(公告)日：2016-01-26

    申请号：US13667476

    申请日：2012-11-02

    申请人： Richard S. Speer ,  David W. Hamby ,  Thomas D. Dreeben ,  Adam M. Scotch ,  Kenneth G. Grossman

    发明人： Richard S. Speer ,  David W. Hamby ,  Thomas D. Dreeben ,  Adam M. Scotch ,  Kenneth G. Grossman

    IPC分类号： F21V29/00 ,  F21V23/06 ,  F21S2/00 ,  F21Y101/02

    CPC分类号： F21V23/06 ,  F21S2/005 ,  F21Y2115/10

    摘要： Techniques and architecture are disclosed for providing a modular lighting system/luminaire having an integrated heat sink assembly. In some cases, the system/luminaire may comprise a plurality of individual modular light sources which have been operatively coupled with one another. In some instances, a modular light source may include one or more light engines (e.g., light emitting diodes or LEDs) which have been operatively coupled with an individual heat sink module. When assembled, the plurality of heat sink modules may define, in the aggregate, a plurality of heat conduits which dissipate thermal energy from the light engines by convective heat transfer. Also, in some cases, the heat sink modules may be electrically isolated from one another, allowing for the heat sink assembly itself, in part or in whole, to function as part of the desired circuit.

    摘要翻译： 公开了用于提供具有集成散热器组件的模块化照明系统/灯具的技术和架构。 在一些情况下，系统/灯具可以包括已经可操作地彼此耦合的多个单独的模块化光源。 在一些情况下，模块化光源可以包括已经与各个散热器模块操作耦合的一个或多个光引擎（例如，发光二极管或LED）。 当组装时，多个散热器模块可以集中地限定多个热导管，其通过对流热传递从光引擎消散热能。 此外，在一些情况下，散热器模块可以彼此电隔离，允许散热器组件本身部分或全部地用作所需电路的一部分。

    LED lighting apparatus, systems and methods of manufacture
    5.
    发明授权
    LED lighting apparatus, systems and methods of manufacture 有权
    LED照明设备，系统及制造方法

    公开(公告)号：US08585243B2

    公开(公告)日：2013-11-19

    申请号：US13170256

    申请日：2011-06-28

    申请人： David W. Hamby ,  Adam M. Scotch ,  John H. Selverian

    发明人： David W. Hamby ,  Adam M. Scotch ,  John H. Selverian

    IPC分类号： F21V29/00

    CPC分类号： F21V23/06 ,  F21K9/20 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01R12/714 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/117 ,  H05K2201/10106 ,  Y02P70/611 ,  Y10T29/49147

    摘要： A light emitting diode (LED) lighting system including a lighting apparatus comprising at least one printed circuit board having an array of light emitting diode (LED) chips mounted thereto, the printed circuit board including a segmented conductor pathway configured to electrically couple at least a portion of the array of LED chips, and a portion of the printed circuit board forming a card edge connector, the card edge connector including a portion of the segmented conductor pathway which provides an electrical contact configured to electrically couple the segmented conductor pathway to a power source.

    摘要翻译： 一种发光二极管（LED）照明系统，包括照明装置，该照明装置包括至少一个具有安装在其上的发光二极管（LED）芯片阵列的印刷电路板，所述印刷电路板包括分段导体路径，其被配置为电耦合至少一个 所述LED芯片阵列的一部分和形成卡缘连接器的印刷电路板的一部分，所述卡片边缘连接器包括所述分段导体通路的一部分，其提供电接触件，所述电触头被配置为将所述分段导体通路电耦合到电力 资源。

    LED with light transmissive heat sink
    6.
    发明授权
    LED with light transmissive heat sink 有权
    LED带透光散热器

    公开(公告)号：US08071997B2

    公开(公告)日：2011-12-06

    申请号：US11543863

    申请日：2006-10-06

    申请人： Adam M. Scotch ,  George C. Wei

    发明人： Adam M. Scotch ,  George C. Wei

    IPC分类号： H01L23/36

    CPC分类号： H01L33/641 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.

    摘要翻译： 可以从具有第一表面的大功率LED芯片和第二表面形成更有效或更高亮度的LED组件，第一表面安装到基板; 第二表面与导热率大于30瓦每米开尔文的透光散热器紧密地热接触。 LED芯片否则与至少第一电连接和用于为LED芯片供电的第二电连接电接触。 提供透光散热器可以使来自LED芯片的热传导加倍，从而增加寿命或效率或亮度或三者之间的平衡。

    LED lighting apparatus, systems and methods of manufacture
    9.
    发明授权
    LED lighting apparatus, systems and methods of manufacture 有权
    LED照明设备，系统及制造方法

    公开(公告)号：US08480267B2

    公开(公告)日：2013-07-09

    申请号：US13170265

    申请日：2011-06-28

    申请人： David W. Hamby ,  Adam M. Scotch ,  John H. Selverian

    发明人： David W. Hamby ,  Adam M. Scotch ,  John H. Selverian

    IPC分类号： F21V3/00

    CPC分类号： F21V5/007 ,  F21K9/20 ,  F21K9/64 ,  F21V17/16 ,  F21Y2105/10 ,  F21Y2115/10

    摘要： A light emitting diode (LED) lighting apparatus including an array of first optic elements overlying an array of LED chips, wherein each of the LED chips is configured to emit light of a first wavelength range through a light emitting surface of the overlying first optic element. The array of first optic elements are also underlying an array of second optic elements, wherein each of the second optic elements is configured to convert light of the first wavelength range to be emitted through the light emitting surface of the underlying first optic element to light of a second wavelength range different from the first wavelength range.

    摘要翻译： 一种发光二极管（LED）照明装置，包括覆盖LED芯片阵列的第一光学元件的阵列，其中每个LED芯片被配置为通过覆盖的第一光学元件的发光表面发射第一波长范围的光 。 第一光学元件的阵列也在第二光学元件的阵列的下面，其中每个第二光学元件被配置成将要通过下面的第一光学元件的发光表面发射的第一波长范围的光转换成 与第一波长范围不同的第二波长范围。