公开(公告)号：US08420422B2

公开(公告)日：2013-04-16

申请号：US13041917

申请日：2011-03-07

申请人： Masafumi Asano ,  Ryoichi Inanami ,  Masayuki Hatano

发明人： Masafumi Asano ,  Ryoichi Inanami ,  Masayuki Hatano

IPC分类号： H01L21/00

CPC分类号： H01L22/20 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L22/12

摘要： According to the embodiments, a distribution of a recess portion shape is calculated based on a result obtained by measuring the recess portion shape of a first projection and recess pattern formed on a surface of a template. Next, a distribution of an application amount of a curing agent to a processing target layer is calculated based on the distribution of the recess portion shape, and the curing agent is applied to the processing target layer based on this distribution of the application amount of the curing agent. Next, a second projection and recess pattern is formed by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent.

摘要翻译： 根据实施例，基于通过测量形成在模板的表面上的第一突起和凹部图案的凹部形状获得的结果来计算凹部形状的分布。 接下来，基于凹部形状的分布计算固化剂的涂布量到处理对象层的分布，并且基于该涂布量的分布将固化剂施加到处理对象层 固化剂。 接下来，通过使固化剂在第一突起和凹部图案与固化剂接触的状态下固化而将第一突起和凹陷图案转印到固化剂上形成第二突起和凹陷图案。

公开(公告)号：US20110229988A1

公开(公告)日：2011-09-22

申请号：US13041917

申请日：2011-03-07

申请人： Masafumi ASANO ,  Ryoichi Inanami ,  Masayuki Hatano

发明人： Masafumi ASANO ,  Ryoichi Inanami ,  Masayuki Hatano

IPC分类号： H01L21/66 ,  G06F19/00

CPC分类号： H01L22/20 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L22/12

摘要： According to the embodiments, a distribution of a recess portion shape is calculated based on a result obtained by measuring the recess portion shape of a first projection and recess pattern formed on a surface of a template. Next, a distribution of an application amount of a curing agent to a processing target layer is calculated based on the distribution of the recess portion shape, and the curing agent is applied to the processing target layer based on this distribution of the application amount of the curing agent. Next, a second projection and recess pattern is formed by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent.

摘要翻译： 根据实施例，基于通过测量形成在模板的表面上的第一突起和凹部图案的凹部形状获得的结果来计算凹部形状的分布。 接下来，基于凹部形状的分布计算固化剂的涂布量到处理对象层的分布，并且基于该涂布量的分布将固化剂施加到处理对象层 固化剂。 接下来，通过使固化剂在第一突起和凹部图案与固化剂接触的状态下固化而将第一突起和凹陷图案转印到固化剂上形成第二突起和凹陷图案。

公开(公告)号：US08901012B2

公开(公告)日：2014-12-02

申请号：US13599358

申请日：2012-08-30

申请人： Masayuki Hatano ,  Hiroshi Tokue

发明人： Masayuki Hatano ,  Hiroshi Tokue

IPC分类号： C23C16/52 ,  H01L21/67 ,  C23C16/44

CPC分类号： C23C16/52 ,  B82Y10/00 ,  B82Y40/00 ,  C23C16/4401 ,  G03F7/0002 ,  H01L21/6715

摘要： According to one embodiment, a semiconductor manufacturing apparatus includes a substrate stage, a transfer unit, and a control unit. A substrate is settable on the substrate stage. The transfer unit is configured to transfer a pattern having an uneven configuration onto a major surface of the substrate by attachably and removably holding a template. The pattern is provided in the transfer surface. The control unit is configured to acquire information relating to a number of foreign objects on the major surface prior to the transferring of the pattern. The control unit adds the number for a plurality of the substrates including the pattern transferred by the transfer unit. The control unit causes the transfer unit not to implement the transferring of the pattern in the case where the sum has reached the upper limit.

摘要翻译： 根据一个实施例，半导体制造装置包括基板台，转印单元和控制单元。 衬底可在衬底台上设置。 转印单元被配置为通过可附接地和可移除地保持模板将具有不均匀构造的图案转印到基板的主表面上。 转印面上设有图案。 控制单元被配置为在传送图案之前获取与主表面上的多个异物相关的信息。 控制单元添加包括由传送单元传送的图案的多个基板的数量。 在总和达到上限的情况下，控制单元使得传送单元不执行图案的传送。

公开(公告)号：US5983933A

公开(公告)日：1999-11-16

申请号：US974550

申请日：1997-11-19

申请人： Tadahiro Ohmi ,  Yuji Kawano ,  Keiji Hirao ,  Hisashi Tanaka ,  Naoya Masuda ,  Yukio Minami ,  Masayuki Hatano ,  Shigeaki Tanaka ,  Michio Yamaji ,  Hiroshi Morokoshi ,  Michio Kuramochi ,  Nobukazu Ikeda ,  Shigeru Itoi ,  Michihiro Kashiwa

发明人： Tadahiro Ohmi ,  Yuji Kawano ,  Keiji Hirao ,  Hisashi Tanaka ,  Naoya Masuda ,  Yukio Minami ,  Masayuki Hatano ,  Shigeaki Tanaka ,  Michio Yamaji ,  Hiroshi Morokoshi ,  Michio Kuramochi ,  Nobukazu Ikeda ,  Shigeru Itoi ,  Michihiro Kashiwa

IPC分类号： F16K27/00 ,  F15B13/00 ,  F15B13/08 ,  F17D1/02 ,  F16K3/00

CPC分类号： F15B13/0832 ,  F15B13/0817 ,  F15B13/0871 ,  F15B13/0892 ,  F15B13/0896 ,  F16K27/003 ,  Y10T137/87249 ,  Y10T137/87684 ,  Y10T137/87917

摘要： A valve mount having two valves removably installed thereon from above as arranged in a direction comprises an inflow channel forming member having a channel in communication with an inlet of the valve disposed at one end thereof, a communication channel forming member having a channel for causing an outlet of the valve at the end to communicate with an inlet of the other valve adjacent thereto, an outflow channel forming member having a channel in communication with an outlet of the other valve, and a subchannel forming member having a channel in communication with an inlet-outlet port formed in the other valve.

摘要翻译： 具有两个可自由拆卸地安装在其上的阀的阀座具有一个流入通道形成构件，该流入通道形成构件具有与设置在其一端的阀的入口连通的通道;连通通道形成构件，具有通道， 所述阀的端部的出口与与其相邻的另一阀的入口连通，具有与所述另一个阀的出口连通的通道的流出通道形成构件，以及具有与入口连通的通道的子通道形成构件 - 出口端口形成在另一个阀门中。

公开(公告)号：US5737162A

公开(公告)日：1998-04-07

申请号：US693351

申请日：1996-08-06

申请人： Hiroki Ito ,  Takashi Moriyama ,  Kenji Kamei ,  Suenobu Hamano ,  Etsuo Nitta ,  Kazuhiko Arai ,  Naoaki Takeji ,  Koji Takahata ,  Masayuki Hatano

发明人： Hiroki Ito ,  Takashi Moriyama ,  Kenji Kamei ,  Suenobu Hamano ,  Etsuo Nitta ,  Kazuhiko Arai ,  Naoaki Takeji ,  Koji Takahata ,  Masayuki Hatano

IPC分类号： H01H33/14 ,  H01H33/59 ,  H02H3/00

CPC分类号： H01H33/596 ,  H01H33/143

摘要： An objective of this invention is to provide a DC circuit breaking device having functions for transmitting direct currents to an electric power system and interrupting direct currents to the electric power system under abnormal conditions such as grounding and short-circuits, where the DC circuit breaking device can minimize the capacity of a condenser for the commuting circuit while rapidly changing the arc voltage to cause arc currents to be quickly extended and vibrated in order to interrupt direct currents in a short arc time. This DC circuit breaking device includes a main DC circuit breaker for interrupting the transmission of direct currents to an electric power system and a DC circuit breaker that is connected in series to the main DC circuit breaker and which is smaller than the main DC circuit breaker. The circuit breaking device also includes a commutation circuit that is connected in parallel to the DC circuit breaker and the small DC circuit breaker which are connected together in series and which is constituted by a reactor and a condenser. The circuit breaking device also includes a surge absorber for absorbing a surged voltage applied to for the condenser.

摘要翻译： 本发明的目的是提供一种直流断路装置，其具有在直流断路装置等异常条件下向电力系统发送直流电流和中断到电力系统的直流的功能。 可以最小化通勤电路的电容器的容量，同时快速改变电弧电压，使电弧电流迅速延伸和振动，以便在短时间内中断直流电流。 该DC断路装置包括用于中断与电力系统的直流的传输的主DC断路器和与主DC断路器串联连接并且小于主DC断路器的DC断路器。 断路装置还包括与DC断路器和小型DC断路器并联连接的换向电路，它们串联连接在一起并且由反应器和冷凝器构成。 断路装置还包括用于吸收施加到冷凝器的浪涌电压的浪涌吸收器。

公开(公告)号：US08550801B2

公开(公告)日：2013-10-08

申请号：US13230554

申请日：2011-09-12

申请人： Yohko Furutono ,  Shinji Mikami ,  Masayuki Hatano ,  Tetsuro Nakasugi

发明人： Yohko Furutono ,  Shinji Mikami ,  Masayuki Hatano ,  Tetsuro Nakasugi

IPC分类号： B29C59/02

CPC分类号： B29C59/022 ,  B29C35/0888 ,  B29C2035/0827 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

摘要： In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.

摘要翻译： 在一个实施例中，压印装置包括被配置为保持用于印记的模板的模板保持部分。 该装置还包括模板移动部件，其构造成移动模板以将模板按压在转印目标基板上的光固化树脂上，或者从光固化树脂脱模模板。 该装置还包括配置成用光照射光固化树脂以固化光固化树脂的光源。 该设备还包括脱模控制部件，当脱模模板从光固化树脂脱模时，该脱模控制部件被配置为基于模板从其脱模的喷射区域的位置来控制模板的脱模速度或脱模角度。

公开(公告)号：US20120061882A1

公开(公告)日：2012-03-15

申请号：US13230554

申请日：2011-09-12

申请人： Yohko Furutono ,  Shinji Mikami ,  Masayuki Hatano ,  Tetsuro Nakasugi

发明人： Yohko Furutono ,  Shinji Mikami ,  Masayuki Hatano ,  Tetsuro Nakasugi

IPC分类号： B29C35/08

CPC分类号： B29C59/022 ,  B29C35/0888 ,  B29C2035/0827 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

摘要： In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.

摘要翻译： 在一个实施例中，压印装置包括被配置为保持用于印记的模板的模板保持部分。 该装置还包括模板移动部件，其构造成移动模板以将模板按压在转印目标基板上的光固化树脂上，或者从光固化树脂脱模模板。 该装置还包括配置成用光照射光固化树脂以固化光固化树脂的光源。 该设备还包括脱模控制部件，当脱模模板从光固化树脂脱模时，该脱模控制部件被配置为基于模板从其脱模的喷射区域的位置来控制模板的脱模速度或脱模角度。

公开(公告)号：US5837953A

公开(公告)日：1998-11-17

申请号：US693367

申请日：1996-08-06

申请人： Hiroki Ito ,  Takashi Moriyama ,  Kenji Kamei ,  Minoru Kimura ,  Suenobu Hamano ,  Takashi Yonezawa ,  Etsuo Nitta ,  Kazuhiko Arai ,  Hiroyuki Sasao ,  Naoaki Takeji ,  Takateru Hashimoto ,  Masayuki Hatano

发明人： Hiroki Ito ,  Takashi Moriyama ,  Kenji Kamei ,  Minoru Kimura ,  Suenobu Hamano ,  Takashi Yonezawa ,  Etsuo Nitta ,  Kazuhiko Arai ,  Hiroyuki Sasao ,  Naoaki Takeji ,  Takateru Hashimoto ,  Masayuki Hatano

IPC分类号： H01H33/91 ,  H01H33/18 ,  H01H33/56 ,  H01H33/59

CPC分类号： H01H33/182 ,  H01H33/18 ,  H01H33/56 ,  H01H33/596 ,  H01H33/91

摘要： A DC circuit breaking device is provided for interrupting the transmission of direct currents to an electric power system by making external changes to an arc generated upon contacting or separation of contacts 11 and 12 in order to rapidly extend and vibrate arc currents. In a self-excited commuting DC circuit breaking device, coils 41 and 42 opposed to a fixed and a movable contact 11 and 12, respectively, are disposed around the outer circumferences of the contacts 11 and 12, and currents flowing through a commutation circuit or the contacts 11 and 12 are allowed to flow through the opposed coils 41 and 42 so as to apply magnetic fields to the neighborhood of an arc. This constitution provides the DC circuit breaking device with high performance that it can rapidly extend and vibrate arc currents to thereby interrupt direct currents.

摘要翻译： 提供了一种直流断路装置，用于通过使触点11和12接触或分离时产生的电弧发生外部变化来中断向电力系统传输直流电流，以便快速延伸和振动电弧电流。 在自激通勤直流断路装置中，分别与固定触点11和可动触头12相对的线圈41和42设置在触头11和12的外周周围，并且流过换向电路或 允许触点11和12流过相对的线圈41,42，以将磁场施加到电弧附近。 这种结构提供了具有高性能的直流断路装置，其可以快速地延伸和振动电弧电流，从而中断直流电流。

公开(公告)号：US08691123B2

公开(公告)日：2014-04-08

申请号：US13204844

申请日：2011-08-08

申请人： Yasutada Nakagawa ,  Takuya Kono ,  Ikuo Yoneda ,  Masayuki Hatano

发明人： Yasutada Nakagawa ,  Takuya Kono ,  Ikuo Yoneda ,  Masayuki Hatano

IPC分类号： B29C43/58

CPC分类号： G05B19/418 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/16

摘要： According to one embodiment, a fine processing method includes determining a resist amount required for each first region of a pattern formation surface and a total amount of resist. The method include dividing the total amount of resist by a volume of one resist drop to determine the resist drops total number. The method include determining a provisional position for the resist drop of the total number. The method include assigning the each first region to nearest one resist drop, and partitioning again the pattern formation surface into second regions assigned to the each resist drop. The method include determining a divided value by dividing the volume of the one resist drop by the required total amount of resist determined. The method include finalizing a final position of the each resist drop, if a distribution of the divided value in the pattern formation surface falls within a target range.

摘要翻译： 根据一个实施例，精细处理方法包括确定图案形成表面的每个第一区域和抗蚀剂总量所需的抗蚀剂量。 该方法包括将抗蚀剂的总量除以一个抗蚀剂滴的体积以确定抗蚀剂滴数总数。 该方法包括确定总数的抗蚀剂落下的临时位置。 该方法包括将每个第一区域分配给最接近的一个抗蚀剂层，以及再次将图案形成表面分割成分配给每个抗蚀剂层的第二区域。 该方法包括通过将一个抗蚀剂液滴的体积除以所需的抗蚀剂总量确定分割值。 如果图案形成表面中的分割值的分布落在目标范围内，则该方法包括确定每个抗蚀剂液滴的最终位置。

公开(公告)号：US20130217155A1

公开(公告)日：2013-08-22

申请号：US13607504

申请日：2012-09-07

申请人： Kazuya Fukuhara ,  Masayuki Hatano

发明人： Kazuya Fukuhara ,  Masayuki Hatano

IPC分类号： B05D3/00 ,  H01L21/31 ,  C23C16/52

CPC分类号： B29C43/021 ,  B29C2043/025 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to one embodiment, a pattern forming method using a template containing a pattern that has at least one recess section or protrusion section to transfer the shape of the pattern to a resin layer on a substrate, is provided. The method includes a process for coating the resin on the substrate, a process for making the hardness of the first portion as a portion of the resin higher than the hardness of the second portion as the portion other than the first portion, and a process in which the portion other than the pattern of the template makes contact with the first portion, in a state where a gap is maintained between the template and the resin, the shape of the pattern is transferred to the second portion, and the resin is cured. Embodiments of an apparatus for pattern forming are also provided.

摘要翻译： 根据一个实施例，提供一种使用包含具有至少一个凹部或突起部的图案的模板的图案形成方法，以将图案的形状转印到基板上的树脂层。 该方法包括在基板上涂布树脂的方法，使作为树脂部分的第一部分的硬度高于作为第一部分以外的部分的第二部分的硬度的方法，以及 在模板和树脂之间保持间隙的状态下，模板图案之外的部分与第一部分接触的部分，图案的形状被转印到第二部分，树脂固化。 还提供了用于图案形成的装置的实施例。