摘要:
The level shifter circuit of an internal down converter includes a P channel MOS transistor constituting a resistance component, and a resistor constituting a resistance component. The temperature coefficient of resistance component is set larger than the temperature coefficient of resistance component so that the output voltage of level shifter circuit has a negative temperature characteristic. If a reference voltage generated by reference voltage generation circuit decreases when operating at a high temperature, the output voltage of level shifter circuit decreases as well. Thus, change in an internal voltage due to change in the operation temperature can be compensated.
摘要:
Column address A0-A11 is once predecoded by a first predecoder PD1, a second predecoder PD2, and a CDE buffer CDB and then applied to a column decoder CD. Column decoder CD selectively drives one of a plurality of column selecting lines CSL on the basis of the applied predecoded signals. This causes corresponding bit lines in respective memory cell arrays MCA1-MCA4 to be simultaneously selected. Column decoder CD includes a plurality of column drivers corresponding to the plurality of column selecting lines, and the column drivers are divided into a plurality of groups. The predecoded signals applied from second predecoder PD2 and CDE buffer CDB to column decoder CD are generated independently for respective groups, and signal lines for them are also distributed to respective groups. This causes the length of wiring of each predecoded signal line to be shortened.
摘要:
The level shifter circuit of an internal down converter includes a P channel MOS transistor constituting a resistance component, and a resistor constituting a resistance component. The temperature coefficient of resistance component is set larger than the temperature coefficient of resistance component so that the output voltage of level shifter circuit has a negative temperature characteristic. If a reference voltage generated by reference voltage generation circuit decreases when operating at a high temperature, the output voltage of level shifter circuit decreases as well. Thus, change in an internal voltage due to change in the operation temperature can be compensated.
摘要:
Column address A0-A11 is once predecoded by a first predecoder PD1, a second predecoder PD2, and a CDE buffer CDB and then applied to a column decoder CD. Column decoder CD selectively drives one of a plurality of column selecting lines CSL on the basis of the applied predecoded signals. This causes corresponding bit lines in respective memory cell arrays MCA1-MCA4 to be simultaneously selected. Column decoder CD includes a plurality of column drivers corresponding to the plurality of column selecting lines, and the column drivers are divided into a plurality of groups. The predecoded signals applied from second predecoder PD2 and CDE buffer CDB to column decoder CD are generated independently for respective groups, and signal lines for them are also distributed to respective groups. This causes the length of wiring of each predecoded signal line to be shortened.
摘要:
An n channel driver circuit comprised of an N channel MOS transistor is provided in parallel to a driver circuit comprised of a P channel MOS transistor. Normally, n channel driver circuit supplies an internal supply voltage, to activate driver circuit only at the time of current peak. Thus, an insufficient capability of n.sup.- channel driver circuit to supply current is supplemented.
摘要:
When address signal bits and/or data bits in a predetermined pattern are accessed a predetermined number of times successively, a test mode can be set. By using address signal bits and/or data bits as a test command for designating a test content, a test content is specified. A semiconductor memory device with an interface compatible with an interface of a normal static random access memory is provided.
摘要:
A refresh circuit performs directive operation for the execution of refresh operation in response to a cycle signal cyclically output from a timer circuit provided in a command-signal activating circuit. To execute testing, a stop signal generated in response to an external signal is activated, the activated stop signal is input to an AND gate, and the cycle signal is thereby invalidated. This causes the refresh operation to terminate, thereby enabling this semiconductor memory device to refresh characteristic testing to be performed.
摘要:
An output buffer includes first current driving units connected in parallel between a power-supply voltage and an output node; second current driving units connected in parallel between a ground voltage and an output node; a plurality of operation selection circuits setting the respective first and second current driving units to be in either activated or inactivated state in a non-volatile manner; first signal transmission circuits arranged respectively corresponding to the first current driving circuits and each transmitting the level of output data with a similar first propagation time period; and second signal transmission circuits arranged respectively corresponding to the second current driving units and each transmitting the level of the output data with a similar second propagation time period.
摘要:
A variable impedance power supply line and a variable impedance ground line supplying voltages VCL1 and VSL1, respectively, are set to a low impedance state in a stand-by cycle and in a row related signal set period, and to a high impedance state in a column circuitry valid time period. Variable impedance power supply line and variable impedance ground line supplying voltages VCL2 and VSL2, respectively, are set to a high impedance state in the stand-by cycle, and low impedance state in the active cycle and in the row related signal reset time period. Inverters operate as operating power supply voltage of voltages VCL1 and VSL2 or voltages VCL2 and VSL1, in accordance with a logic level of an output signal in the stand-by cycle and in the active cycle. Thus a semiconductor memory device is provided in which subthreshold current in the stand-by cycle and active DC current in the active cycle can be reduced.
摘要:
On a surface of a semiconductor chip having a longer side and a shorter side, a line of a plurality of first pads and a line of a plurality of second pads are arranged in the shape of a cross. Upon multibit expansion, increase in length of the longer side of semiconductor chip can be suppressed even though the number of pads is increased by additionally providing the second pad. In addition, there is no need to reduce the pitch between pads. Thus, a semiconductor memory device allowing multibit expansion is provided without an increase in size of the chip and the pad or reduction in pitches between pads and between pins.