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公开(公告)号：US20070252227A1
公开(公告)日：2007-11-01
申请号：US11698100
申请日：2007-01-26
IPC分类号： H01L31/0232
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L31/0232 , H01L33/483 , H01L33/58 , H01L33/62 , H01L2224/05026 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/73204 , H01L2924/00014
摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.
摘要翻译： 光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件， 在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂 。 在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光学装置的电极和 透明构件电连接并且还通过透明粘合剂粘合。
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公开(公告)号：US07153042B2
公开(公告)日：2006-12-26
申请号：US11152253
申请日：2005-06-15
CPC分类号： H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/48227 , H01L2224/49433 , H01L2924/00014
摘要： An optic device includes a base, an optical chip mounted on the base, and a transparent plate. A cylinder mirror in which an imaging optical system is incorporated is fitted on the base of the optic device, wherein a pair of positioning pins are provided at the bottom of the cylinder mirror. First positioning holes for defining a mounting position of the cylinder mirror to the base and second positioning holes having a smaller diameter than that of the first positioning holes for defining a mounting position of the optical chip to the base are formed in the base of the optic device.
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公开(公告)号：US07582944B2
公开(公告)日：2009-09-01
申请号：US11698100
申请日：2007-01-26
IPC分类号： H01L31/0232
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L31/0232 , H01L33/483 , H01L33/58 , H01L33/62 , H01L2224/05026 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/73204 , H01L2924/00014
摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.
摘要翻译： 光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件， 在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂 。 在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光学装置的电极和 透明构件电连接并且还通过透明粘合剂粘合。
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公开(公告)号：US20060083459A1
公开(公告)日：2006-04-20
申请号：US11152253
申请日：2005-06-15
IPC分类号： G02B6/12
CPC分类号： H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/48227 , H01L2224/49433 , H01L2924/00014
摘要： An optic device includes a base, an optical chip mounted on the base, and a transparent plate. A cylinder mirror in which an imaging optical system is incorporated is fitted on the base of the optic device, wherein a pair of positioning pins are provided at the bottom of the cylinder mirror. First positioning holes for defining a mounting position of the cylinder mirror to the base and second positioning holes having a smaller diameter than that of the first positioning holes for defining a mounting position of the optical chip to the base are formed in the base of the optic device.
摘要翻译： 光学装置包括基座，安装在基座上的光学芯片和透明板。 其中结合有成像光学系统的圆柱镜装配在光学装置的基座上，其中一对定位销设置在气缸镜的底部。 用于将气缸镜的安装位置定义到基座的第一定位孔和具有比用于将光学芯片安装到基座的安装位置的第一定位孔的直径小的第二定位孔形成在光学器件的基座中 设备。
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公开(公告)号：US06897428B2
公开(公告)日：2005-05-24
申请号：US10877927
申请日：2004-06-25
IPC分类号： H01L27/14 , H01L23/00 , H01L23/02 , H01L23/04 , H01L23/08 , H01L27/00 , H01L27/146 , H01L31/00 , H04N3/14 , H04N5/335
CPC分类号： H01L27/14601 , H01L24/97 , H01L27/14618 , H01L2224/48091 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014
摘要： A solid-state imaging device includes: a housing having a base and a rectangular-frame-shaped rib that are resin molded integrally; metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space, an external terminal portion exposed on a bottom face, and a side electrode portion exposed on an external side face; an imaging element fixed on the base; connection members connecting electrodes of the imaging element and the internal terminal portions of the metal lead pieces, respectively; and a transparent plate fixed on an upper end face of the rib. A thickness of each metal lead piece at a position of its internal terminal portion is substantially equal to a thickness of the base, and the external terminal portion is formed with a reverse face of the metal lead piece at a position corresponding to the internal terminal portion. In the resin molding, the internal terminal portion is pressed against the upper mold, whereby the occurrence of resin burrs is suppressed.
摘要翻译： 固态成像装置包括：壳体，其具有基部和矩形框状的肋，其一体地树脂模制; 嵌入壳体中的金属引线片，其中每个具有面向内部空间的内部端子部分，暴露在底面上的外部端子部分和暴露在外侧面上的侧面电极部分; 固定在基座上的成像元件; 连接构件分别连接成像元件的电极和金属引线片的内部端子部分; 以及固定在肋的上端面上的透明板。 每个金属引线片在其内部端子部分的位置处的厚度基本上等于基部的厚度，并且外部端子部分在与内部端子部分对应的位置处形成有金属引线片的反面 。 在树脂成型中，将内部端子部压在上模上，抑制树脂毛刺的发生。
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公开(公告)号：US20060121184A1
公开(公告)日：2006-06-08
申请号：US11269748
申请日：2005-11-09
IPC分类号： B05D5/06
CPC分类号： H01L27/14618 , B05D1/286 , B05D3/067 , H01L23/10 , H01L27/14623 , H01L2224/48091 , H01L2924/16195 , H01L2924/00014
摘要： An adhesive sheet is attached to a package substrate having a through hole so that an ultraviolet (UV) curable resin layer of the adhesive sheet faces the package substrate. Light is then radiated to the UV curable resin layer through the through hole in order to cure the exposed part of the UV curable resin layer. The cured part of the UV curable resin layer is removed together with a base film of the adhesive sheet. A glass plate is then attached to the UV curable resin remaining on the package substrate. Light is then radiated to bond the glass plate to the package substrate.
摘要翻译： 将粘合片附着到具有通孔的封装基板上，使得粘合片的紫外线（UV）固化树脂层面向封装基板。 然后通过通孔将光照射到UV固化树脂层，以固化UV可固化树脂层的暴露部分。 UV固化树脂层的固化部分与粘合片的基膜一起除去。 然后将玻璃板连接到残留在封装基板上的UV固化树脂。 然后照射光以将玻璃板粘合到封装衬底。
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公开(公告)号：US20050001145A1
公开(公告)日：2005-01-06
申请号：US10877927
申请日：2004-06-25
IPC分类号： H01L27/14 , H01L23/00 , H01L23/02 , H01L23/04 , H01L23/08 , H01L27/00 , H01L27/146 , H01L31/00 , H04N3/14 , H04N5/335
CPC分类号： H01L27/14601 , H01L24/97 , H01L27/14618 , H01L2224/48091 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014
摘要： A solid-state imaging device includes: a housing having a base and a rectangular-frame-shaped rib that are resin molded integrally; metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space, an external terminal portion exposed on a bottom face, and a side electrode portion exposed on an external side face; an imaging element fixed on the base; connection members connecting electrodes of the imaging element and the internal terminal portions of the metal lead pieces, respectively; and a transparent plate fixed on an upper end face of the rib. A thickness of each metal lead piece at a position of its internal terminal portion is substantially equal to a thickness of the base, and the external terminal portion is formed with a reverse face of the metal lead piece at a position corresponding to the internal terminal portion. In the resin molding, the internal terminal portion is pressed against the upper mold, whereby the occurrence of resin burrs is suppressed.
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公开(公告)号：US20110083322A1
公开(公告)日：2011-04-14
申请号：US12970407
申请日：2010-12-16
IPC分类号： H01R43/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/49171 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , Y10T29/49117 , H01L2224/85 , H01L2924/00014
摘要： An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.
摘要翻译： 光学装置包括基板，光学元件，半透明部件，多个第一端子和密封剂。 密封剂位于比半透明组件的顶表面更低的位置。 半透明部件的顶面从密封剂露出，而半透明部件的侧表面被密封剂覆盖。
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公开(公告)号：US07822090B2
公开(公告)日：2010-10-26
申请号：US12186979
申请日：2008-08-06
CPC分类号： B82Y20/00 , G11B7/127 , H01L2224/48091 , H01S5/0021 , H01S5/0071 , H01S5/02212 , H01S5/02216 , H01S5/02224 , H01S5/02248 , H01S5/02292 , H01S5/024 , H01S5/02476 , H01S5/028 , H01S5/34333 , H01L2924/00014
摘要： A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than −15° C. and not more than −5° C.
摘要翻译： 半导体器件包括光学半导体元件，包括由用于安装光学半导体元件的金属制成的基座的封装以及用于通过覆盖封装和光学半导体元件来封装光学半导体元件的盖和气体。 用包装封装的气体的氧浓度不小于15％且小于30％，露点不低于-15℃且不大于-5℃。
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10.发明申请Optical device module, fabrication method thereof, optical device unit and fabrication method thereof 有权光器件模块及其制造方法，光学元件单元及其制造方法公开(公告)号：US20080100732A1
公开(公告)日：2008-05-01
申请号：US11798370
申请日：2007-05-14
CPC分类号： H04N5/2251 , H01L2924/0002 , H04N5/2257 , H05K1/189 , H05K2201/046 , H05K2201/10121 , H05K2201/10689 , H01L2924/00
摘要： One end of a flexible substrate is connected to a solid-state image sensing device and the other end constitutes an external connection part in which external lead-out electrodes are provided. A plurality of electronic components are mounted on a mounting part of the flexible substrate. The flexible substrate is bent at a first bent part thereof to make an acute angle with the solid-state image sensing device and also bent at a second bent part thereof to make an acute angle with the external connection part. The two acute angles are alternate angles and the solid-state image sensing device has a cross section of the letter Z.
摘要翻译： 柔性基板的一端连接到固态图像感测装置，另一端构成外部引出电极的外部连接部。 多个电子部件安装在柔性基板的安装部上。 柔性基板在其第一弯曲部分处弯曲以与固态图像感测装置成锐角并且在其第二弯曲部分处弯曲以与外部连接部分成锐角。 两个锐角是交替的角度，固态图像感测装置具有字母Z的横截面。
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