Method and apparatus for manufacturing amorphous metal ribbon
    1.
    发明授权
    Method and apparatus for manufacturing amorphous metal ribbon 失效
    无定形金属带的制造方法和装置

    公开(公告)号:US5765625A

    公开(公告)日:1998-06-16

    申请号:US760339

    申请日:1996-12-04

    IPC分类号: B22D11/06

    CPC分类号: B22D11/0611 B22D11/0697

    摘要: A method and apparatus for manufacturing an amorphous metal ribbon provides the following: jetting a molten metal from a nozzle, which has a slit-shaped opening, to a cooling roll, which rotates at a high speed, so as to form a puddle on the cooling roll; and spreading the puddle for rapid solidification. Additionally, the present invention provides at a position upstream from the puddle in a direction opposite the direction of rotation of the cooling roll, cleaning the surface of the cooling roll by blowing carbon dioxide gas to which ultrasonic vibration is applied.

    摘要翻译: 用于制造非晶态金属带的方法和装置提供如下:从具有狭缝形开口的喷嘴将熔融金属喷射到高速旋转的冷却辊上,以在其上形成熔池 冷却辊; 并铺设水坑快速凝固。 此外,本发明提供了一种在水槽上游方向与冷却辊旋转方向相反的方向,通过吹入施加有超声波振动的二氧化碳来清洁冷却辊的表面。

    Field effect transistor
    5.
    发明授权
    Field effect transistor 失效
    场效应晶体管

    公开(公告)号:US5389807A

    公开(公告)日:1995-02-14

    申请号:US110937

    申请日:1993-08-24

    申请人: Nobuo Shiga

    发明人: Nobuo Shiga

    CPC分类号: H01L29/8124 H01L29/1029

    摘要: It is an object of the present invention to provide a dual-gate type MESFET having a high drain breakdown voltage and excellent high-frequency characteristics. A semiconductor substrate used in the present invention is obtained by sequentially forming a non-doped buffer layer 2, a thin first pulse-doped layer 3 having a high impurity concentration, and a cap layer 7 on an underlying semiconductor substrate 1 by epitaxial growth. The cap layer 7 has a thin second pulse-doped layer 5 having a high impurity concentration sandwiched between non-doped layers 4 and 6. The thickness and impurity concentration of the second pulse-doped layer 5 are set such that the second pulse-doped layer 5 is depleted by a surface depletion layer caused by the interface state of the cap layer surface, and the surface depletion layer does not extend to the first pulse-doped layer 3. A source electrode 13, a drain electrode 16, and first and second gate electrodes 14 and 15 are formed on the semiconductor substrate surface. High-impurity-concentration ion implantation regions 10, 11, and 12 are formed at a source electrode formation region, a drain electrode formation region, and a region between the first and second gate electrode formation regions to extend from the semiconductor substrate surface to the first pulse-doped layer 3. The second electrode 15 formed on the drain electrode 16 side is sufficiently separated from the high-impurity-concentration ion implantation region 12 below the drain electrode 16.

    摘要翻译: 本发明的目的是提供一种具有高漏极击穿电压和优异的高频特性的双栅极型MESFET。 本发明中使用的半导体衬底通过外延生长顺序形成非掺杂缓冲层2,杂质浓度高的薄的第一脉冲掺杂层3和下层半导体衬底1上的覆盖层7来获得。 盖层7具有夹在非掺杂层4和6之间的具有高杂质浓度的薄的第二脉冲掺杂层5.第二脉冲掺杂层5的厚度和杂质浓度被设定为使得第二脉冲掺杂 层5被由覆盖层表面的界面状态引起的表面耗尽层耗尽,并且表面耗尽层不延伸到第一脉冲掺杂层3.源电极13,漏电极16以及第一和第 第二栅电极14和15形成在半导体衬底表面上。 在源电极形成区域,漏电极形成区域以及第一和第二栅电极形成区域之间的区域形成高杂质浓度离子注入区域10,11和12,以从半导体衬底表面延伸到 第一脉冲掺杂层3.形成在漏电极16侧的第二电极15与漏电极16下方的高杂质浓度离子注入区12充分分离。

    Monolithic microwave integrated circuit receiving device having a space
between antenna element and substrate
    6.
    发明授权
    Monolithic microwave integrated circuit receiving device having a space between antenna element and substrate 失效
    单片微波集成电路接收装置,其在天线元件和衬底之间具有空间

    公开(公告)号:US5381157A

    公开(公告)日:1995-01-10

    申请号:US875015

    申请日:1992-04-28

    申请人: Nobuo Shiga

    发明人: Nobuo Shiga

    摘要: The receiving device according to this invention includes one or more patch or helical antennas and one or more receiving units formed monolithically on a single substrate. In order to widen the receiving frequency band, antenna elements are formed not directly on a compound semiconductor substrate but with a space between the antenna element and the substrate. In the patch antenna embodiment, patch elements are supported by dielectric posts, whereby there is provided a void between most of the patch antenna and the underlying semiconductor substrate.

    摘要翻译: 根据本发明的接收装置包括一个或多个贴片或螺旋天线以及一个或多个接收单元,其单片地形成在单个基板上。 为了加宽接收频带,天线元件不是直接形成在复合半导体衬底上,而是在天线元件和衬底之间具有空间。 在贴片天线实施例中,贴片元件由电介质柱支撑,由此在贴片天线和下面的半导体衬底的大部分之间提供空隙。

    Semiconductor device
    8.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号:US5070376A

    公开(公告)日:1991-12-03

    申请号:US631909

    申请日:1990-12-21

    申请人: Nobuo Shiga

    发明人: Nobuo Shiga

    摘要: A semiconductor device includes an FET having side gate electrodes. The FET has a plurality of side gate electrodes, and the side gate electrodes, side gate input terminals and lead wires connecting them are arranged such that a difference between electrical lengths from the side gate electrodes to the input terminals (pads) is smaller than a quarter wavelength of the input signals thereto. Thus, even if a microwave signal is applied to the side gate input terminals, the signals reach the side gate electrodes with substantially the same phase and the side gate effect extends to the entire gate electrode.

    摘要翻译: 半导体器件包括具有侧栅电极的FET。 FET具有多个侧栅电极,侧栅电极,侧栅极输入端和与它们连接的引线布置成使得从侧栅电极到输入端(焊盘)的电长度之间的差小于 输入信号的四分之一波长。 因此,即使微波信号施加到侧栅极输入端子,信号到达具有大致相同相位的侧栅电极,并且侧栅效应延伸到整个栅电极。

    Optical module coupling device
    10.
    发明授权
    Optical module coupling device 失效
    光模块耦合装置

    公开(公告)号:US4955684A

    公开(公告)日:1990-09-11

    申请号:US391050

    申请日:1989-08-09

    申请人: Nobuo Shiga

    发明人: Nobuo Shiga

    IPC分类号: G02B6/42 H01L31/0203

    CPC分类号: H01L31/0203 G02B6/4202

    摘要: In an optical module with a substrate having an optical unit mounted thereon which substrate is provided on the bottom of a package so that the optical unit is optically coupled with an end of an optical fiber extending into the package, a chip carrier, including the optical unit, is die-bonded to a conductive land formed on the substrate. A recess is formed in the bottom of the package which faces the land. Thus, a capacitance of a parallel-plate capacitor formed by the land and the bottom of the is made negligibly small.

    摘要翻译: 在具有其上安装有光学单元(3)的基板(6)的光学模块中,其设置在封装(8)的底部上,并且具有光学单元,光学单元与延伸到 封装(8),包括光学单元(3)的芯片载体(2)被芯片接合到形成在基板(6)上的导电焊盘(7)上,并且在 所述包装(8)的底部面向所述平台(7)。 因此,由平台(7)形成的并联板电容器和封装(8)的底部形成的阻止高速运转的电容可以忽略不计。