摘要:
A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.
摘要:
A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
摘要:
A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
摘要:
A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
摘要:
A laminated ceramic device formed by laminating ceramics and conductive metals having a conductor section at a part of at least one of its upper and lower surfaces, in which the difference in level between the conductor section and the section other than the conductor section is smaller than the thickness of the conductor section. Consequently, even in the case of arranging the pattern conductors on both the upper and the lower surfaces of the device, a laminated ceramic device can be obtained in which pattern conductors can be arranged with high accuracy at low cost, no special care is required in the case of polishing, and the thickness accuracy and the bond strength of electrodes are high.
摘要:
A plasma display panel has a front substrate including a plurality of display electrode pairs, a dielectric layer, and a protective layer, and a rear substrate including a plurality of data electrodes, a barrier rib, and a phosphor layer. The front substrate and rear substrate face each other so that the display electrode pairs and the data electrodes intersect, and a hydrogen-absorbing material containing palladium is disposed inside the plasma display panel.
摘要:
The piezoelectric ceramic composition of the present invention contains, as a main component, a material having a composition represented by Formula: CaMXBi4−xTi4−X(Nb1−ATaA)XO15, where M is at least one element selected from the group consisting of Ca, Sr, and Ba; 0.0≦A≦1.0; and 0.0≦X≦0.6.
摘要翻译:本发明的压电陶瓷组合物作为主要成分含有具有式CaMXBi4-xTi4-X(Nb1-ATaA)XO15表示的组成的材料,其中M为选自Ca ,Sr和Ba; 0.0 <= A <= 1.0; 和0.0 <= X <= 0.6。
摘要:
The plasma display panel has a front plate that has a dielectric layer for covering a display electrode formed on a substrate and a protective layer formed on the dielectric layer, and a rear plate that is faced to the front plate so as to form discharge space, and has an address electrode in the direction crossing the display electrode, barrier ribs for partitioning the discharge space, and phosphor layers. The protective layer is formed by forming a ground film on the dielectric layer and sticking a agglomerated particle to the ground film. Here, the agglomerated particle is produced by coagulating a plurality of crystal particles made of metal oxide.
摘要:
The present invention provides a piezoelectric ceramic composition that is free from lead and has a small grain size, a high coupling coefficient, a high mechanical Q, and a large frequency constant. This composition is characterized by being expressed by a formula of (LixNa1−x−yKy)z−2wMa2wNb1−wMbwO3, wherein 0.03≦x≦0.2, 0≦y≦0.2, 0.98≦z≦1, 0
摘要翻译:本发明提供一种不含铅并具有小晶粒度,高耦合系数,高机械Q和大频率常数的压电陶瓷组合物。 该组合物的特征在于用式(LixNa1-x-yKy)z-2wMa2wNb1-wMbwO3表示,其中0.03 <= x <= 0.2,0 <= y <=0.2,0.98≤z≤1,0
摘要:
A plasma display panel includes a front plate having a dielectric layer covering a display electrode formed on a substrate and a protective layer formed on the dielectric layer, and a rear plate facing the front plate so as to form a discharge space. The plasma display panel also includes an address electrode in a direction crossing the display electrode, barrier ribs for partitioning the discharge space, and phosphor layers. The protective layer is constructed by forming a ground film on the dielectric layer and adhering agglomerated particles to the ground film. The agglomerated particles are produced by coagulating a plurality of crystal particles made of metal oxide.