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27 条记录 (耗时 0.017 秒)

    Transient Thermal Modeling of Multisource Power Devices
    2.
    发明申请
    Transient Thermal Modeling of Multisource Power Devices 有权
    多源功率器件的瞬态热建模

    公开(公告)号：US20120278029A1

    公开(公告)日：2012-11-01

    申请号：US13095406

    申请日：2011-04-27

    申请人： Maxat Touzelbaev ,  Yizhang Yang ,  Gamal Refai-Ahmed

    发明人： Maxat Touzelbaev ,  Yizhang Yang ,  Gamal Refai-Ahmed

    IPC分类号： G01K13/00 ,  G06F15/00

    CPC分类号： G01K7/42

    摘要： Embodiments of systems and methods for improved measurement of transient thermal responses in electronic systems are described herein. Embodiments of the disclosure use the known thermal transfer function of an electronic system to generate an equivalent resistor-capacitor (RC) network having a dynamic response that is identical to a given power excitation as the actual electronic system would have to that power excitation. Using the analogy between thermal and electrical systems, a Foster RC network is constructed, comprising a plurality of RC stages in which resistors and capacitors are connected in parallel. Subsequently, the analog thermal RC network is converted into an infinite impulse response (IIR) digital filter, whose coefficients can be obtained the Z-transform of the analog thermal RC network. This IIR digital filter establishes the recursive relationship between temperature output at the current time step and measured power input at the previous time step. Using this IIR digital filter, temperature response subject to arbitrary time-dependent power can be calculated in very small amount of time compared with prior art methods.

    摘要翻译： 本文描述了用于改进电子系统中瞬态热响应测量的系统和方法的实施例。 本公开的实施例使用电子系统的已知热传递函数来产生具有与给定功率激励相同的动态响应的等效电阻器 - 电容器（RC）网络，因为实际电子系统将具有该功率激励。 使用热电系统之间的类比，构建了Foster RC网络，其包括多个RC级，其中电阻器和电容器并联连接。 随后，模拟热RC网络被转换成无限脉冲响应（IIR）数字滤波器，其系数可以获得模拟热RC网络的Z变换。 该IIR数字滤波器建立了当前时间步长的温度输出与前一时间步长的测量功率输入之间的递归关系。 使用该IIR数字滤波器，与现有技术方法相比，可以以非常小的时间量计算受任意时间依赖功率的温度响应。

    Transient thermal modeling of multisource power devices
    4.
    发明授权
    Transient thermal modeling of multisource power devices 有权
    多源功率器件的瞬态热建模

    公开(公告)号：US08635044B2

    公开(公告)日：2014-01-21

    申请号：US13095406

    申请日：2011-04-27

    申请人： Maxat Touzelbaev ,  Yizhang Yang ,  Gamal Refai-Ahmed

    发明人： Maxat Touzelbaev ,  Yizhang Yang ,  Gamal Refai-Ahmed

    IPC分类号： G01K13/00

    CPC分类号： G01K7/42

    摘要： Embodiments of systems and methods for improved measurement of transient thermal responses in electronic systems are described herein. Embodiments of the disclosure use the known thermal transfer function of an electronic system to generate an equivalent resistor-capacitor (RC) network having a dynamic response that is identical to a given power excitation as the actual electronic system would have to that power excitation. Using the analogy between thermal and electrical systems, a Foster RC network is constructed, comprising a plurality of RC stages in which resistors and capacitors are connected in parallel. Subsequently, the analog thermal RC network is converted into an infinite impulse response (IIR) digital filter, whose coefficients can be obtained the Z-transform of the analog thermal RC network. This IIR digital filter establishes the recursive relationship between temperature output at the current time step and measured power input at the previous time step. Using this IIR digital filter, temperature response subject to arbitrary time-dependent power can be calculated in very small amount of time compared with prior art methods.

    摘要翻译： 本文描述了用于改进电子系统中瞬态热响应测量的系统和方法的实施例。 本公开的实施例使用电子系统的已知热传递函数来产生具有与给定功率激励相同的动态响应的等效电阻器 - 电容器（RC）网络，因为实际电子系统将具有该功率激励。 使用热电系统之间的类比，构建了Foster RC网络，其包括多个RC级，其中电阻器和电容器并联连接。 随后，模拟热RC网络被转换成无限脉冲响应（IIR）数字滤波器，其系数可以获得模拟热RC网络的Z变换。 该IIR数字滤波器建立了当前时间步长的温度输出与前一时间步长的测量功率输入之间的递归关系。 使用该IIR数字滤波器，与现有技术方法相比，可以以非常小的时间量计算受任意时间依赖功率的温度响应。

    Computing center power and cooling control apparatus and method
    9.
    发明授权
    Computing center power and cooling control apparatus and method 有权
    计算中心电源及冷却控制装置及方法

    公开(公告)号：US08868944B2

    公开(公告)日：2014-10-21

    申请号：US12754758

    申请日：2010-04-06

    申请人： Gamal Refai-Ahmed ,  Stanley Ossias ,  Maxat Touzelbaev

    发明人： Gamal Refai-Ahmed ,  Stanley Ossias ,  Maxat Touzelbaev

    IPC分类号： G06F1/32 ,  H05K7/20 ,  G06F1/20

    CPC分类号： G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296 ,  H05K7/20836 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

    摘要： Various computing center control and cooling apparatus and methods are disclosed. In one aspect, a method of controlling plural processors of a computing system is provided. The method includes monitoring activity levels of the plural processors over a time interval to determine plural activity level scores. The plural activity level scores are compared with predetermined processor activity level scores corresponding to preselected processor operating modes to determine a recommended operating mode for each of the plural processors. Each of the plural processors is instructed to operate in one of the recommended operating modes.

    摘要翻译： 公开了各种计算中心控制和冷却装置和方法。 一方面，提供一种控制计算系统的多个处理器的方法。 该方法包括在一段时间间隔内监视多个处理器的活动级别，以确定多个活动级别得分。 将多个活动水平分数与对应于预选处理器操作模式的预定处理器活动水平评分进行比较，以确定多个处理器中的每一个的推荐操作模式。 指示多个处理器中的每一个以推荐的操作模式之一进行操作。

    Heat sink for a circuit device
    10.
    发明授权
    Heat sink for a circuit device 有权
    散热器为电路设备

    公开(公告)号：US07911791B2

    公开(公告)日：2011-03-22

    申请号：US12490805

    申请日：2009-06-24

    申请人： Gamal Refai-Ahmed ,  Maxat Touzelbaev

    发明人： Gamal Refai-Ahmed ,  Maxat Touzelbaev

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H01L23/467 ,  F28D15/02 ,  F28F1/34 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： Various heat sinks, method of use and manufacture thereof are disclosed. In one aspect, a method of providing thermal management for a circuit device is provided. The method includes placing a heat sink in thermal contact with the circuit device wherein the heat sink includes a base member in thermal contact with the circuit device, a first shell coupled to the base member that includes a first inclined internal surface, a lower end and first plurality of orifices at the lower end to enable a fluid to transit the first shell, and at least one additional shell coupled to the base member and nested within the first shell. The at least one additional shell includes a second inclined internal surface and a second plurality of orifices to enable the fluid to transit the at least one additional shell. The fluid is moved through the first shell and the at least one additional shell.

    摘要翻译： 公开了各种散热器，其使用方法和制造方法。 一方面，提供了一种为电路装置提供热管理的方法。 该方法包括将散热器放置成与电路装置热接触，其中散热器包括与电路装置热接触的基座部件，耦合到基部部件的第一壳体，其包括第一倾斜内表面，下端和 在下端的第一组多个孔以使流体能够转移第一壳体，以及至少一个额外的壳体，其联接到基部构件并嵌套在第一壳体内。 所述至少一个附加壳体包括第二倾斜内表面和第二多个孔口，以使流体能够转移至少一个附加壳体。 流体通过第一壳体和至少一个附加壳体移动。