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公开(公告)号：US08877566B2
公开(公告)日：2014-11-04
申请号：US13586421
申请日：2012-08-15
CPC分类号： H01L23/42 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/3511 , H01L2924/00
摘要： A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.
摘要翻译： 一种用于微电子封装的散热器或盖，其中散热器具有包括至少一个曲线轮廓的下表面，其中曲线轮廓选自至少一个正或突出的曲线特征，至少一个负或凹入 曲线特征及其组合。 包括散热器/盖的微电子封装，其中在散热器/盖和电路芯片之间的界面中改善了散热或降低了机械应力。
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公开(公告)号：US20120309132A1
公开(公告)日：2012-12-06
申请号：US13586421
申请日：2012-08-15
CPC分类号： H01L23/42 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/3511 , H01L2924/00
摘要： A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.
摘要翻译： 一种用于微电子封装的散热器或盖，其中散热器具有包括至少一个曲线轮廓的下表面，其中曲线轮廓选自至少一个正或突出的曲线特征，至少一个负或凹入 曲线特征及其组合。 包括散热器/盖的微电子封装，其中在散热器/盖和电路芯片之间的界面中改善了散热或降低了机械应力。
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公开(公告)号：US08269340B2
公开(公告)日：2012-09-18
申请号：US11857812
申请日：2007-09-19
CPC分类号： H01L23/42 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/3511 , H01L2924/00
摘要： A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.
摘要翻译： 一种用于微电子封装的散热器或盖，其中散热器具有包括至少一个曲线轮廓的下表面，其中曲线轮廓选自至少一个正或突出的曲线特征，至少一个负或凹入 曲线特征及其组合。 包括散热器/盖的微电子封装，其中在散热器/盖和电路芯片之间的界面中改善了散热或降低了机械应力。
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公开(公告)号：US20090072387A1
公开(公告)日：2009-03-19
申请号：US11857812
申请日：2007-09-19
IPC分类号： H01L23/34
CPC分类号： H01L23/42 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/3511 , H01L2924/00
摘要： A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.
摘要翻译： 一种用于微电子封装的散热器或盖，其中散热器具有包括至少一个曲线轮廓的下表面，其中曲线轮廓选自至少一个正或突出的曲线特征，至少一个负或凹入 曲线特征及其组合。 包括散热器/盖的微电子封装，其中在散热器/盖和电路芯片之间的界面中改善了散热或降低了机械应力。
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公开(公告)号：US20100252775A1
公开(公告)日：2010-10-07
申请号：US12819697
申请日：2010-06-21
CPC分类号： C09K13/04
摘要： An indium cap layer is formed by blanket depositing indium onto a surface of metallic interconnects separated by interlayer dielectric, and then selectively chemically etching the indium located on the interlayer dielectric leaving an indium cap layer. Etchants containing a strong acid are provided for selectively removing the indium.
摘要翻译： 通过在由层间电介质分离的金属互连件的表面上覆盖沉积铟，然后选择性地化学蚀刻位于层间电介质上的铟而形成铟盖层，留下铟盖层。 提供含有强酸的蚀刻剂用于选择性地除去铟。
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公开(公告)号：US07412134B2
公开(公告)日：2008-08-12
申请号：US11540268
申请日：2006-09-30
IPC分类号： G02B6/34
CPC分类号： G02B6/2821 , G02B6/02 , G02B6/02033 , G02B6/03622 , G02B6/283 , G02B6/29316 , G02B6/421 , G02B6/4249
摘要： A single-mode optical waveguide with a core, surrounded by a cladding consisting of an inner soft layer and an outer harder layer is described. The outer layer has a grating structure on its inner surface, whose spatial frequency is the same as that of the guided mode. The thickness of the inner cladding is sufficient to keep the grating outside the mode field in undeformed regions of the waveguide, so that normally no out-coupling of the light results. Connections are made by crossing two such waveguides at an angle and pressing them together. This results in deformation of the two waveguides such that the gratings are brought into proximity with the cores. Light is coupled out of one waveguide and into the other in the deformed region, resulting in a self-aligning optical connection. The out-coupled light propagates normal to the waveguide axis, so errors in the crossing angle cause little change in efficiency. Because the cladding system is sufficiently resilient to recover after deformation, the connection is remakeable.
摘要翻译： 描述了具有由包含内软层和外硬层的覆层围绕的芯的单模光波导。 外层在其内表面具有光栅结构，其空间频率与导向模式相同。 内包层的厚度足以将光栅保持在波导的未变形区域中的模场外，使得通常不会导致光的外耦合。 通过将两个这样的波导以一定角度交叉并将它们压在一起而形成连接。 这导致两个波导的变形，使得光栅与芯接近。 光从一个波导耦合到变形区域中的另一个，导致自对准光学连接。 输出耦合光垂直于波导轴传播，因此交叉角的误差几乎不会导致效率的变化。 因为包层系统具有足够的弹性以在变形后恢复，所以连接是可重新制造的。
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公开(公告)号：US07115996B2
公开(公告)日：2006-10-03
申请号：US10852142
申请日：2004-05-25
申请人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
发明人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
CPC分类号： H01L21/76849 , H01L21/2885 , H01L21/76856 , H01L21/76858 , H01L21/76862 , H01L23/53238 , H01L24/11 , H01L2224/0401 , H01L2224/04042 , H01L2224/05546 , H01L2224/13099 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/15747 , H05K3/244 , H01L2924/00
摘要： A method to selectively cap interconnects with indium or tin bronzes and copper oxides thereof is provided. The invention also provides the interconnect and copper surfaces so formed.
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8.发明授权Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped 有权选择性地与铟或锡青铜和/或其氧化物覆盖互连的方法以及如此封闭的互连公开(公告)号：US06784088B2
公开(公告)日：2004-08-31
申请号：US10345288
申请日：2003-01-16
申请人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
发明人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
IPC分类号： H01L2144
CPC分类号： H01L21/76849 , H01L21/2885 , H01L21/76856 , H01L21/76858 , H01L21/76862 , H01L23/53238 , H01L24/11 , H01L2224/0401 , H01L2224/04042 , H01L2224/05546 , H01L2224/13099 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/15747 , H05K3/244 , H01L2924/00
摘要： A method to selectively cap a cooper BEOL terminal pad with a Cu/Sn/Au alloy. The method includes providing one or more Cu BEOL terminal pads and coating the pads with a Sn coating followed by coating the Sn with a Au coating. The coated pads are then annealed to form the Cu/Sn/Au capping alloy.
摘要翻译： 一种用Cu / Sn / Au合金选择性地覆盖铜合金BEOL端子焊盘的方法。 该方法包括提供一个或多个Cu BEOL端子焊盘并且用焊锡涂覆Sn涂层，然后用Au涂层涂覆Sn。 然后将涂覆的焊盘退火以形成Cu / Sn / Au封盖合金。
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公开(公告)号：US09143259B2
公开(公告)日：2015-09-22
申请号：US13597763
申请日：2012-08-29
CPC分类号： H04J14/00 , H04B10/801 , H04Q11/0005 , H04Q11/0066 , H04Q2011/0073
摘要： A system and method for optical switching of networks in a multi-node computing system with programmable magneto-optical switches that enable optical signal routing on optical pathways. The system includes a network of optical links interconnecting nodes with switching elements that are controlled by electrical control signals. Data transmission is along the optical links and an optical pathway is determined by the electrical control signals which are launched ahead of optical signal. If links are available, an optical pathway is reserved, and the electrical signal sets the necessary optical switches for the particular optical pathway. There is thereby eliminated the need for optical-electrical-optical conversion at each node in order to route data packets through the network. If a link or optical pathway is not available the system tries to find an alternative path. If no alternative path is available, the system reserves buffering. After transmission, all reservations are released.
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公开(公告)号：US08178153B2
公开(公告)日：2012-05-15
申请号：US11395857
申请日：2006-03-31
CPC分类号： H01L23/3735 , H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A heat transfer control structure and a method for fabrication thereof includes at least one heat transfer control layer interposed between and contacting a heat source material and a heat sink material. The at least one heat transfer control layer is selected predicated upon thermal phonon spectra overlap between the heat source material, the at least one heat transfer control layer and the heat sink material. The at least one heat transfer control layer may enhance or retard heat transfer between the heat source material and the heat sink material. The at least one heat transfer control layer may be selected based upon a value of a thermal phonon correlating parameter such as a Debye temperature, a density or a lattice constant.
摘要翻译： 传热控制结构及其制造方法包括插入在热源材料和散热材料之间并与之接触的至少一个传热控制层。 根据热源材料，至少一个传热控制层和散热材料之间的热声子光谱重叠来选择至少一个传热控制层。 至少一个传热控制层可以增强或延缓热源材料和散热材料之间的热传递。 可以基于诸如德拜温度，密度或晶格常数的热声子相关参数的值来选择至少一个传热控制层。
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