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公开(公告)号：US20060237307A1
公开(公告)日：2006-10-26
申请号：US11473295
申请日：2006-06-22
申请人： Michael Yang , Dmitry Lubomirsky , Yezdi Dord , Saravjeet Singh , Sheshraj Tulshibagwale , Nicolay Kovarsky
发明人： Michael Yang , Dmitry Lubomirsky , Yezdi Dord , Saravjeet Singh , Sheshraj Tulshibagwale , Nicolay Kovarsky
IPC分类号： C25B11/00
CPC分类号： H01L21/2885 , A23D7/00 , A23D7/005 , A23D7/01 , A23J7/00 , C07F9/103 , C25D7/123 , C25D17/001
摘要： Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell further includes an anode positioned in a lower portion of the fluid basin, the anode having a plurality of parallel channels formed therethrough, and a base member configured to receive the anode, the base member having a plurality of groves formed into an anode receiving surface, each of the plurality of grooves terminating into an annular drain channel. A membrane support assembly configured to position a membrane immediately above the anode in a substantially planar orientation with respect to the anode surface is provided, the membrane support assembly having a plurality of channels and bores formed therein.
摘要翻译： 本发明的实施方案通常可以提供小体积的电化学电镀单元。 电镀槽通常包括配置成在其中容纳电镀液的流体池，流体池具有基本上水平的堰。 电池还包括位于流体槽的下部的阳极，阳极具有穿过其形成的多个平行通道，以及构造成容纳阳极的基座构件，底座构件具有形成为阳极接收的多个槽 多个槽中的每一个终止于环形排水通道。 提供了一种膜支撑组件，其被配置为将膜垂直于阳极定位在相对于阳极表面的基本上平面的方向上，膜支撑组件具有形成在其中的多个通道和孔。
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公开(公告)号：US20060124468A1
公开(公告)日：2006-06-15
申请号：US11345011
申请日：2006-02-01
IPC分类号： C25D7/12
CPC分类号： H01L21/2885 , C25D17/001
摘要： Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes a fluid basin configured to contain a plating solution therein, an anode assembly positioned in a lower portion of the fluid basin, a separation membrane positioned across the fluid basin above the anode assembly, a diffusion member positioned across the fluid basin above the separation membrane, and a plating membrane positioned across the fluid basin above the diffusion member. The plating method generally includes immersing the substrate in a plating solution, the plating solution containing metal ions to be plated, contacting a plating surface of the semiconductor substrate with a plating membrane, applying a plating bias to the semiconductor substrate to plate the metal ions in the plating solution positioned adjacent the plating surface of the substrate, removing the plating surface from contact with the plating membrane for a predetermined period of time, and recontacting the plating surface with the plating membrane to continue plating the metal ions onto the plating surface.
摘要翻译： 本发明的实施例通常提供一种基板处理系统和方法。 衬底处理系统通常包括配置成在其中容纳电镀液的流体池，位于流体池的下部的阳极组件，位于阳极组件上方的横跨流体池的隔离膜，跨过流体定位的扩散构件 在分离膜之上的盆地，以及位于扩散构件上方的横跨流体池的镀膜。 电镀方法通常包括将衬底浸入电镀溶液中，镀敷溶液含有待镀覆的金属离子，与半导体衬底的电镀表面接触镀覆膜，向半导体衬底施加电镀偏压以将金属离子 所述电镀液位于所述基板的电镀面附近，除去所述电镀表面与所述镀膜接触预定的时间，并且将所述电镀表面与所述电镀膜重新接触以继续将所述金属离子电镀到所述电镀表面上。
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公开(公告)号：US07025861B2
公开(公告)日：2006-04-11
申请号：US10360234
申请日：2003-02-06
CPC分类号： H01L21/2885 , C25D17/001
摘要： Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes a fluid basin configured to contain a plating solution therein, an anode assembly positioned in a lower portion of the fluid basin, a separation membrane positioned across the fluid basin above the anode assembly, a diffusion member positioned across the fluid basin above the separation membrane, and a plating membrane positioned across the fluid basin above the diffusion member. The plating method generally includes immersing the substrate in a plating solution, the plating solution containing metal ions to be plated, contacting a plating surface of the semiconductor substrate with a plating membrane, applying a plating bias to the semiconductor substrate to plate the metal ions in the plating solution positioned adjacent the plating surface of the substrate, removing the plating surface from contact with the plating membrane for a predetermined period of time, and recontacting the plating surface with the plating membrane to continue plating the metal ions onto the plating surface.
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公开(公告)号：US20070175752A1
公开(公告)日：2007-08-02
申请号：US11539477
申请日：2006-10-06
申请人： Michael Yang , Nicolay Kovarsky
发明人： Michael Yang , Nicolay Kovarsky
IPC分类号： C25B13/04
CPC分类号： C25D17/002 , A23D7/00 , A23D7/005 , A23D7/01 , A23J7/00 , C07F9/103 , C25D7/123 , C25D17/001 , C25D21/22 , H01L21/2885 , H01L21/76877
摘要： Embodiments of the invention provide a method for plating copper into features formed on a semiconductor substrate. The method includes positioning the substrate in a plating cell, wherein the plating cell includes a catholyte volume containing a catholyte solution, an anolyte volume containing an anolyte solution, an ionic membrane positioned to separate the anolyte volume from the catholyte volume, and an anode positioned in the anolyte volume. The method further includes applying a plating bias between the anode and the substrate, plating copper ions onto the substrate from the catholyte solution, and replenishing the copper ions plated onto the substrate from the catholyte solution with copper ions transported from the anolyte solution via the ionic membrane, wherein the catholyte solution has a copper concentration of greater than about 51 g/L.
摘要翻译： 本发明的实施例提供了一种将铜电镀到形成在半导体衬底上的特征的方法。 该方法包括将基板定位在电镀槽中，其中镀覆电池包括含有阴极电解液的阴极电解液体积，含有阳极电解液的阳极电解液体，将阳极电解液体积与阴极电解液容积分离的离子膜， 在阳极电解液中。 该方法还包括在阳极和衬底之间施加电镀偏压，从阴极电解液将铜离子镀覆到衬底上，并从阴极电解液中补充镀在衬底上的铜离子，铜离子从阳极电解液通过离子 膜，其中阴极电解液的铜浓度大于约51g / L。
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公开(公告)号：US20070181441A1
公开(公告)日：2007-08-09
申请号：US11462640
申请日：2006-08-04
申请人： Nicolay Kovarsky , Aron Rosenfeld , Michael Yang , Ivan Rodriguez
发明人： Nicolay Kovarsky , Aron Rosenfeld , Michael Yang , Ivan Rodriguez
CPC分类号： C25D7/123 , C25D17/002 , C25D21/02 , C25F3/02
摘要： The present invention generally includes deposition and electropolishing methods and an apparatus comprising an electroplating cell and auxiliary cell. In one embodiment for electropolishing a substrate, a cycle is performed in which the substrate is alternately placed in an anolyte solution to remove material and a catholyte solution to deposit material. As the cycle is repeated successively, an exposed layer disposed on the substrate is planarized. In another embodiment, an auxiliary cell may be used to deposit the ultrathin seed layer prior to electroplating.
摘要翻译： 本发明通常包括沉积和电解抛光方法以及包括电镀槽和辅助电池的装置。 在电抛光衬底的一个实施例中，执行循环，其中将衬底交替放置在阳极电解液中以除去材料和阴极电解液以沉积材料。 随着连续重复循环，平面化设置在基板上的曝光层。 在另一个实施例中，可以使用辅助电池在电镀之前沉积超薄种子层。
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公开(公告)号：US20070111519A1
公开(公告)日：2007-05-17
申请号：US11428230
申请日：2006-06-30
申请人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Michael Stewart , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
发明人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Michael Stewart , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
IPC分类号： H01L21/44
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1653 , C23C18/168 , C23C18/1682 , C23C18/1685 , C23C18/1689 , C25D7/123 , C25D17/001 , H01L21/02063 , H01L21/02068 , H01L21/02087 , H01L21/28518 , H01L21/28562 , H01L21/67051 , H01L21/6719 , H01L21/6723 , H01L21/67751 , H01L21/68785 , H01L21/76814 , H01L21/76843 , H01L21/76856 , H01L21/76873 , H01L21/76874
摘要： Embodiments of the invention provide methods for depositing a material onto a surface of a substrate by using one or more electroless, electrochemical plating, CVD and/or ALD processes. Embodiments of the invention provide a method for depositing a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP process on a single substrate processing platform. Other aspects provide a method for depositing a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides a method for forming a capping layer over substrate interconnects. Methods include the use of a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.
摘要翻译： 本发明的实施方案提供了通过使用一种或多种化学镀，CVD和/或ALD工艺将材料沉积到衬底的表面上的方法。 本发明的实施方案提供了一种用于在基板上沉积种子层的方法，该方法具有无电解方法，并随后在单个基板处理平台上用ECP工艺填充基板上的互连特征。 其它方面提供了一种用于在衬底上沉积种子层的方法，在衬底上填充互连特征，或者在衬底上顺序地沉积种子层和填充互连特征。 一个实施例提供了一种在衬底互连上形成覆盖层的方法。 方法包括使用蒸气干燥器进行基板的沉积前和沉积后清洁以及用于后沉积清洁的刷盒室。
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公开(公告)号：US20060033678A1
公开(公告)日：2006-02-16
申请号：US11192993
申请日：2005-07-29
申请人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
发明人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
CPC分类号： H01L21/67167 , C23C16/06 , C23C16/34 , C23C16/4488 , C23C18/1632 , C23C18/1653 , H01L21/28556 , H01L21/288 , H01L21/6719 , H01L21/67207 , H01L21/6723 , H01L21/67742 , H01L21/67745 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： Embodiments of the invention provide a cluster tool configured to deposit a material onto a substrate surface by using one or more electroless, electrochemical plating, CVD and/or ALD processing chambers. In one aspect, a ruthenium-containing catalytic layer is formed. Embodiments of the invention provide a hybrid deposition system configured to deposit a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP cell. Other aspects provide an electroless deposition system configured to deposit a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides an electroless deposition system configured to form a capping layer over substrate interconnects. The system includes a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.
摘要翻译： 本发明的实施例提供了一种集群工具，其被配置为通过使用一个或多个化学镀，CVD和/或ALD处理室将材料沉积到衬底表面上。 一方面，形成含钌催化剂层。 本发明的实施例提供了一种混合沉积系统，其被配置为利用无电解方法将种子层沉积在衬底上，并随后用ECP单元填充衬底上的互连特征。 其它方面提供一种无电镀沉积系统，其被配置为将衬底层沉积在衬底上，填充衬底上的互连特征，或者顺序地沉积衬底上的晶种层和填充互连特征。 一个实施例提供了一种配置成在衬底互连上形成覆盖层的无电沉积系统。 该系统包括蒸发干燥器，用于底物的沉积前和沉积后清洁以及用于后沉积清洁的刷盒室。
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8.发明授权公开(公告)号：US09214144B1
公开(公告)日：2015-12-15
申请号：US13950276
申请日：2013-07-24
申请人： Michael Yang
发明人： Michael Yang
CPC分类号： G10H1/08 , G10H1/46 , G10H7/008 , G10H2210/381 , G10H2210/385 , G10H2220/086 , G10H2250/035
摘要： A system and method are provided for mixing song data based on measure groupings. A player or program may recognize measure groupings in a song through identifying cuepoints. The player or program may use the cuepoints and/or other identifiers of measure groupings to generate a transition between the song and other songs. Parts of one or both songs may be time-stretched, or frames may be added or deleted, such that the beats in both songs are substantially aligned during the transition. The system and method may also involve altering the sequence of frames in one or both of the songs, so that the transition may have various sonic qualities as desired by a user. A choice of transition modes may be provided via a user interface that allow the user some control over when and how transitions between songs are executed.
摘要翻译： 提供了一种基于测量分组来混合歌曲数据的系统和方法。 播放器或程序可以通过识别曲线来识别歌曲中的测量分组。 播放器或程序可以使用度量分组的点和/或其他标识符来产生歌曲和其他歌曲之间的转换。 一首或两首歌曲的部分可能是时间延长的，或者可以添加或删除帧，使得两首歌曲中的节拍在转换期间基本对准。 系统和方法还可以涉及改变一个或两个歌曲中的帧序列，使得转换可以具有如用户所期望的各种声音质量。 转换模式的选择可以通过用户界面来提供，其允许用户对歌曲之间的转换何时以及如何进行控制。
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公开(公告)号：US09111519B1
公开(公告)日：2015-08-18
申请号：US13282432
申请日：2011-10-26
申请人： Michael Yang , Neel U. Sukhatme
发明人： Michael Yang , Neel U. Sukhatme
CPC分类号： G10H1/40 , G10H2210/385 , G10H2220/126 , G10H2240/325 , G11B27/038 , G11B27/322
摘要： A system and method are provided for generating cuepoints for mixing song data. One or more people may listen to a song and identify measure groupings within the song. The one or more people might generate markings corresponding to these measure groupings and submit the markings to a cuepoint generation system. The markings may then be reconciled into cuepoints that may be used for mixing the song with other song data. In some embodiments, the cuepoints may be adjusted based on characteristics of the particular songs that are to be mixed together.
摘要翻译： 提供了一种用于产生用于混合歌曲数据的点的系统和方法。 一个或多个人可以听歌曲，并在歌曲中识别测量组。 一个或多个人可能产生与这些度量分组相对应的标记，并将标记提交给一个生成系统。 然后可以将标记调整成可用于将歌曲与其他歌曲数据混合的连接点。 在一些实施例中，可以基于要混合在一起的特定歌曲的特征来调整节点。
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公开(公告)号：US09002478B1
公开(公告)日：2015-04-07
申请号：US13036821
申请日：2011-02-28
申请人： Michael Yang , Wenbo Hou , Sheldon Williams
发明人： Michael Yang , Wenbo Hou , Sheldon Williams
CPC分类号： A61N1/0587
摘要： An epicardial lead is passively fixed in a pericardial space by a passive fixation member. The passive fixation member extends from a distal portion of an epicardial lead and acts against a pericardial layer and an epicardial layer to hold the lead in place. The epicardial lead may include an electrode that is connected to a conductor that extends from a distal portion of the lead. In some embodiments the epicardial lead includes a material that promotes fibrosis to fix the lead to heart tissue. The passive fixation member may include a shocking coil.
摘要翻译： 心外膜由被动固定构件被动地固定在心包空间中。 被动固定构件从心外膜引导件的远端部分延伸并作用于心包层和心外膜层以将引线保持在适当位置。 心外膜引线可以包括连接到从引线的远端部分延伸的导体的电极。 在一些实施方案中，心外膜引线包括促进纤维化以将引线固定到心脏组织的材料。 被动固定构件可包括震动线圈。
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