Iontophoretic Drug Delivery Packaging
    7.
    发明申请
    Iontophoretic Drug Delivery Packaging 有权
    离子电渗药物包装

    公开(公告)号:US20120022431A1

    公开(公告)日:2012-01-26

    申请号:US12597950

    申请日:2009-09-03

    申请人: Todd A. Krinke

    发明人: Todd A. Krinke

    IPC分类号: A61N1/30 B65B7/28 B65B5/04

    摘要: The present invention relates generally to iontophoretic drug delivery systems for transdermal delivery of therapeutic agents and, more particularly, to packaging such systems for long shelf life and easy assembly for use. The system package includes an iontophoretic skin worn patch component that accommodates a power source, electronics, electrodes and a drug pack component that carries a therapeutic agent which is contained as a separate sealed component. The packaged system further provides for ease of assembly at the time of use.

    摘要翻译: 本发明一般涉及用于经皮递送治疗剂的离子电渗药物递送系统,更具体地涉及包装这种系统以保持长期的保质期和易于使用的组装。 系统包装包括离子电渗皮肤磨损的贴片组件,其容纳电源,电子器件,电极和携带治疗剂的药物组分,其作为单独的密封组分包含。 该包装系统进一步提供了在使用时易于组装。

    Microactuated dimple for head suspensions
    8.
    发明授权
    Microactuated dimple for head suspensions 有权
    用于头部悬挂的微动凹坑

    公开(公告)号:US07256968B1

    公开(公告)日:2007-08-14

    申请号:US09952121

    申请日:2001-09-11

    申请人: Todd A. Krinke

    发明人: Todd A. Krinke

    IPC分类号: G11B21/10

    CPC分类号: G11B5/4826 G11B5/5552

    摘要: A head suspension for supporting a head slider over a disk in a dynamic storage device and providing precise movement of the head slider relative to tracks on the disk. The head suspension includes a load beam, a flexure having a slider mounting region, and a dimple interface transmitting a load beam force to the slider mounting region. The head suspension further includes a microactuator mounted to the load beam. Movement of the microactuator is transmitted through the dimple interface by action of frictional forces at the dimple interface so as to cause movement of the slider mounting region transverse to tracks on the disk. A method of precisely moving a head slider supported by a head suspension includes providing and driving a microactuator configured to transmit movement of the microactuator to a slider mounting region through a dimple interface by action of frictional forces at the dimple interface.

    摘要翻译: 一种用于将磁头滑动器支撑在动态存储装置中的磁盘上的磁头悬架,并且提供磁头滑块相对于磁盘上的轨道的精确移动。 磁头悬架包括负载梁,具有滑块安装区域的挠曲件和将载荷梁力传递到滑块安装区域的凹坑接口。 磁头悬架还包括安装到负载梁的微型致动器。 微型致动器的运动通过凹坑界面通过凹坑界面处的摩擦力的作用传递,以使滑块安装区域横向于盘上的轨道移动。 精确地移动由头悬挂器支撑的磁头滑块的方法包括提供和驱动微致动器,该微致动器被配置为通过凹陷界面处的摩擦力的作用将微型致动器的运动传递到通过凹坑界面的滑块安装区域。

    Integrated lead suspension with IC chip and method of manufacture
    9.
    发明授权
    Integrated lead suspension with IC chip and method of manufacture 失效
    集成芯片芯片及其制造方法

    公开(公告)号:US06483669B1

    公开(公告)日:2002-11-19

    申请号:US09397448

    申请日:1999-09-17

    申请人: Todd A. Krinke

    发明人: Todd A. Krinke

    IPC分类号: G11B548

    摘要: An integrated lead suspension or flexure having an integrated circuit (IC) mounting region on which an IC chip with an array of solder-covered terminals can be mounted. The suspension or flexure include a stainless steel layer, integrated conductive leads and an insulating layer between the conductive leads and the stainless steel layer. The stainless steel layer has an IC window for receiving an array of terminals of an IC. The integrated conductive leads extend along the stainless steel layer into the IC window, and include an array of bond pads in the IC window corresponding to the array of terminals of the IC to be mounted to the suspension or flexure. The insulating layer extends into the IC window and includes an array of solder mask holes corresponding to the array of conductive lead bond pads. The IC chip can thereby be mounted to the suspension or flexure in the IC window and its array of terminals soldered to the corresponding array of conductive lead bond pads through the array of solder mask holes.

    摘要翻译: 具有集成电路(IC)安装区域的集成引线悬架或挠曲件,可安装具有焊料覆盖端子阵列的IC芯片。 悬挂或挠曲包括不锈钢层,集成导电引线和导电引线与不锈钢层之间的绝缘层。 不锈钢层具有用于接收IC的端子阵列的IC窗口。 集成导电引线沿着不锈钢层延伸到IC窗口中,并且包括在IC窗口中的对应于要安装到悬架或挠曲件的IC的端子阵列的接合焊盘阵列。 绝缘层延伸到IC窗口中,并且包括对应于导电引线接合焊盘阵列的焊接掩模孔阵列。 因此,IC芯片可以安装在IC窗口中的悬挂或弯曲处,并且其阵列的端子通过焊接掩模孔的阵列焊接到相应的导电引线接合焊盘阵列。