公开(公告)号：US20060240189A1

公开(公告)日：2006-10-26

申请号：US11246063

申请日：2005-10-11

申请人： Ming-Der Ger ,  Yuh Sung ,  Yih-Ming Liu ,  Mei-Jiun Shie ,  Han-Tao Wang

发明人： Ming-Der Ger ,  Yuh Sung ,  Yih-Ming Liu ,  Mei-Jiun Shie ,  Han-Tao Wang

IPC分类号： B05D1/18 ,  C23C16/00

CPC分类号： C25D11/30

摘要： The present invention relates to a low-temperature method for forming carbon nanotubes, which mainly includes preparing a co-catalyst of composite metal particles on a substrate, and growing carbon nanotubes on the substrate by a thermal CVD process at 400° C. The present invention uses a non-isothermal deposition (NITD) and a metal chemical substitution reaction to prepare the co-catalyst particles on the substrate.

摘要翻译： 本发明涉及一种用于形成碳纳米管的低温方法，其主要包括在基材上制备复合金属颗粒的助催化剂，并在400℃下通过热CVD法在基板上生长碳纳米管。本发明 本发明使用非等温沉积（NITD）和金属化学取代反应来制备底物上的助催化剂颗粒。

公开(公告)号：US20110212319A1

公开(公告)日：2011-09-01

申请号：US13094493

申请日：2011-04-26

申请人： LI-CHUN WANG ,  Han-Wen Kuo ,  Yuh Sung ,  Shiaw-Ruey Lin ,  Ming-Der Ger ,  Yih-Ming Liu ,  Wei-Ta Chang

发明人： LI-CHUN WANG ,  Han-Wen Kuo ,  Yuh Sung ,  Shiaw-Ruey Lin ,  Ming-Der Ger ,  Yih-Ming Liu ,  Wei-Ta Chang

IPC分类号： B32B3/26 ,  B82Y40/00 ,  B82Y30/00

CPC分类号： D01F9/127 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/15 ,  D01F9/1275 ,  D01F11/123 ,  D01F11/16 ,  Y10T428/249953 ,  Y10T428/24997 ,  Y10T428/249981 ,  Y10T428/24999

摘要： The invention discloses a carbon nanotube device, comprising a substrate, a catalyst layer formed on the substrate, a porous capping layer formed on the catalyst layer, and a carbon nanotube formed on the porous capping layer. A wafer for growing a carbon nanotube comprises a substrate, a catalyst layer formed on the substrate, and a porous capping layer formed on the catalyst layer, with carbon nanotube growning on the porous capping layer.

摘要翻译： 本发明公开了一种碳纳米管装置，包括基板，形成在基板上的催化剂层，形成在催化剂层上的多孔覆盖层和形成在多孔覆盖层上的碳纳米管。 用于生长碳纳米管的晶片包括基板，形成在基板上的催化剂层和形成在催化剂层上的多孔封盖层，其中碳纳米管生长在多孔覆盖层上。

公开(公告)号：US20100124655A1

公开(公告)日：2010-05-20

申请号：US12273418

申请日：2008-11-18

申请人： LI-CHUN WANG ,  Han-Wen Kuo ,  Yuh Sung ,  Shiaw-Ruey Lin ,  Ming-Der Ger ,  Yih-Ming Liu ,  Wei-Ta Chang

发明人： LI-CHUN WANG ,  Han-Wen Kuo ,  Yuh Sung ,  Shiaw-Ruey Lin ,  Ming-Der Ger ,  Yih-Ming Liu ,  Wei-Ta Chang

IPC分类号： B32B3/26 ,  D01F9/12 ,  C23C16/26

CPC分类号： D01F9/127 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/15 ,  D01F9/1275 ,  D01F11/123 ,  D01F11/16 ,  Y10T428/249953 ,  Y10T428/24997 ,  Y10T428/249981 ,  Y10T428/24999

摘要： The invention discloses a method for fabricating a carbon nanotube, and the method comprises the following steps: providing a substrate; forming a catalyst layer on the substrate; forming a porous capping layer on the catalyst layer to finish a wafer; forming the carbon nanotube on the wafer. By the porous capping layer, the well-aligned carbon nanotube can grow on the wafer through thermal CVD.

摘要翻译： 本发明公开了一种制造碳纳米管的方法，该方法包括以下步骤：提供基板; 在基板上形成催化剂层; 在所述催化剂层上形成多孔覆盖层以完成晶片; 在晶片上形成碳纳米管。 通过多孔覆盖层，良好对准的碳纳米管可以通过热CVD在晶片上生长。

公开(公告)号：US20080248430A1

公开(公告)日：2008-10-09

申请号：US11826791

申请日：2007-07-18

申请人： Yih-Ming Liu ,  Yuh Sung ,  Ming-Der Ger ,  Yun-Chih Fan ,  Yu-Hsien Chou ,  Chun-Tin Lin

发明人： Yih-Ming Liu ,  Yuh Sung ,  Ming-Der Ger ,  Yun-Chih Fan ,  Yu-Hsien Chou ,  Chun-Tin Lin

IPC分类号： B05D5/12 ,  C23C14/34 ,  G03F7/20

CPC分类号： H01J9/025 ,  C23C18/54 ,  H01J2201/30469

摘要： A nano-carbon material field emission cathode plate is prepared by an oxidation-reduction reaction, which includes immersing a substrate having a first metal layer thereon in a solution of a second metal salt with a nano-carbon material dispersed therein. A difference between the two standard redox potentials of the first metal and the second metal is so great that ions of the second metal in the solution are reduced to elemental metal while the first metal is oxidized, and thus a layer of the second metal is formed on the first metal layer with the nano-carbon material partially embedded in the second metal layer.

摘要翻译： 通过氧化还原反应制备纳米碳材料场致发射阴极板，其包括将其上具有第一金属层的基板浸渍在第二金属盐与分散在其中的纳米碳材料的溶液中。 第一金属和第二金属的两种标准氧化还原电位之间的差异非常大，使得第一金属被氧化时溶液中的第二金属的离子被还原为元素金属，因此形成第二金属层 在第一金属层上，其中纳米碳材料部分地嵌入第二金属层。

公开(公告)号：US20100075026A1

公开(公告)日：2010-03-25

申请号：US12289542

申请日：2008-10-30

申请人： Yuh Sung ,  Ming-Der Ger ,  Chang-Pin Chang ,  Chun-Chieh Tseng ,  Wen-Ding Chen

发明人： Yuh Sung ,  Ming-Der Ger ,  Chang-Pin Chang ,  Chun-Chieh Tseng ,  Wen-Ding Chen

IPC分类号： C08K3/08 ,  B05D3/10 ,  H01C17/00

CPC分类号： H05K3/182 ,  C23C18/1608 ,  C23C18/168 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/32 ,  C23C18/38 ,  H05K3/422 ,  H05K2203/0709

摘要： A copolymer deposited with particles of catalytic metal is disclosed in the present invention, which is formed from an ethylenically unsaturated monomer and a hydrophilic monomer, and the catalytic metal is Au, Ag, Pd, Pt or Ru. The copolymer is hydrophilic when the temperature is lower than a specific temperature, and will become hydrophobic when the temperature is greater than the specific temperature. The present invention also discloses a method for forming a metal layer on a substrate via electroless plating, which includes contacting the substrate with an ink composition, drying the ink composition on the substrate, and contacting the dried ink composition with an electroless plating solution, wherein the ink composition contains the copolymer of the present invention in an aqueous phase. The present invention further discloses a method for forming metal conductors in through holes of a substrate.

摘要翻译： 在本发明中公开了由烯属不饱和单体和亲水性单体形成的催化金属颗粒的共聚物，催化金属是Au，Ag，Pd，Pt或Ru。 当温度低于特定温度时，共聚物是亲水性的，当温度大于特定温度时，共聚物变得疏水。 本发明还公开了一种通过化学镀在基板上形成金属层的方法，该方法包括使基材与油墨组合物接触，干燥基材上的油墨组合物，以及使干燥的油墨组合物与化学镀溶液接触，其中 油墨组合物含有本发明的水相共聚物。 本发明还公开了一种用于在基板的通孔中形成金属导体的方法。

公开(公告)号：US20090041941A1

公开(公告)日：2009-02-12

申请号：US11979760

申请日：2007-11-08

申请人： Yuh Sung ,  Ming-Der Ger ,  Chang-Ping Chang ,  Chun-Chieh Tseng ,  Wen-Ding Chen

发明人： Yuh Sung ,  Ming-Der Ger ,  Chang-Ping Chang ,  Chun-Chieh Tseng ,  Wen-Ding Chen

IPC分类号： B05D1/36

CPC分类号： H05K1/095 ,  H05K3/182 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/0709 ,  H05K2203/072 ,  H05K2203/121

摘要： A method for forming a metal pattern on a substrate via printing and electroless plating is disclosed, which includes printing a pattern on the substrate with an ink composition, drying the printed pattern, and contacting the dried pattern with an electroless plating solution. The ink composition either contains components (i), (ii) and (iii), components (i) and (iv), or components (i) and (v), which are dissolved or dispersed in a solvent, wherein (i) is a binder; (ii) is a sulfate terminated polymer of an ethylenically unsaturated monomer; (iii) is a catalytic metal precursor; (iv) is a polymer of an ethylenically unsaturated monomer deposited with particles of catalytic metal; and (v) is a copolymer of an ethylenically unsaturated monomer and a hydrophilic monomer deposited with particles of catalytic metal. The binder (i) is a water swellable resin. The catalytic metal may be Au, Ag, Pd, Pt or Ru.

摘要翻译： 公开了一种通过印刷和化学镀在基板上形成金属图案的方法，其包括用油墨组合物在基板上印刷图案，干燥印刷图案，并将干燥图案与化学镀溶液接触。 油墨组合物中含有溶解或分散在溶剂中的组分（i），（ii）和（iii），组分（i）和（iv）或组分（i）和（v）），其中（i） 是一种粘合剂; （ii）是烯键式不饱和单体的硫酸封端聚合物; （iii）是催化金属前体; （iv）是沉积有催化金属颗粒的烯属不饱和单体的聚合物; 和（v）是烯属不饱和单体和沉积有催化金属颗粒的亲水单体的共聚物。 粘合剂（i）是水溶胀性树脂。 催化金属可以是Au，Ag，Pd，Pt或Ru。

公开(公告)号：US20060228489A1

公开(公告)日：2006-10-12

申请号：US11246174

申请日：2005-10-11

申请人： Yuh Sung ,  Ming-Der Ger ,  Yu-Hsien Chou ,  Jinn-Luh Ou

发明人： Yuh Sung ,  Ming-Der Ger ,  Yu-Hsien Chou ,  Jinn-Luh Ou

IPC分类号： B05D1/18 ,  B05D3/02

CPC分类号： C23C18/1676 ,  C23C18/1607 ,  C23C18/1651 ,  C23C18/1879 ,  C23C18/31 ,  C23C18/34 ,  C23C18/405 ,  C23C18/44 ,  H01L21/288 ,  H01L21/76877

摘要： The present invention discloses a method for forming a metallic microstructure on a patterned surface of a substrate by a nonisothermal deposition (NTID) in an electroless plating solution. The substrate is immersed in the solution being heated by a heating device mounted on a bottom of an electroless plating reactor while the heated solution being cooled by a cooling device provided in the reactor, and thus a seed layer is formed the patterned surface of the substrate. The substrate is then immersed in an electroless plating solution with a back surface of the substrate lying on the bottom of the reactor, so that the exposed seed layer is thickened to form the metallic microstructure.

摘要翻译： 本发明公开了一种在化学镀溶液中通过非等温沉积（NTID）在衬底的图案化表面上形成金属微结构的方法。 将衬底浸入被安装在化学镀电镀反应器底部的加热装置加热的溶液中，同时通过设置在反应器中的冷却装置冷却加热的溶液，从而种子层形成衬底的图案化表面 。 然后将衬底浸入无碱电解溶液中，其中衬底的背面位于反应器的底部，使得暴露的种子层变厚以形成金属微结构。

公开(公告)号：US20110315934A1

公开(公告)日：2011-12-29

申请号：US12923545

申请日：2010-09-28

申请人： Chen-Chi M. Ma ,  Min-Chien Hsiao ,  Shu-Hang Liao ,  Ming-Yu Yen ,  Ming-Der Ger ,  Chung-An Wang ,  Nen-Wen Pu ,  Yuh Sung ,  Chih-Chun Teng ,  Shie-Heng Lee ,  Min-Hsuan Hsiao

发明人： Chen-Chi M. Ma ,  Min-Chien Hsiao ,  Shu-Hang Liao ,  Ming-Yu Yen ,  Ming-Der Ger ,  Chung-An Wang ,  Nen-Wen Pu ,  Yuh Sung ,  Chih-Chun Teng ,  Shie-Heng Lee ,  Min-Hsuan Hsiao

IPC分类号： H01B1/24

CPC分类号： H01B1/24 ,  H01M4/96 ,  H01M8/0213 ,  H01M8/188 ,  H01M8/20 ,  Y02E60/528

摘要： A graphite-vinyl ester resin composite conducting plate is prepared in the present invention. The conducting plate can be used as a bipolar plate for a fuel cell, counter electrode for dye-sensitized solar cell and electrode of vanadium redox battery. The conducting plate is prepared as follows: a) compounding vinyl ester resin and graphite powder to form a bulk molding compound (BMC) material, the graphite powder content ranging from 70 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein 0.01-15 wt % functionalized graphene, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) to form a conducting plate having a desired shaped at 80-250° C. and 500-4000 psi.

摘要翻译： 在本发明中制备石墨 - 乙烯基酯树脂复合导电板。 导电板可用作燃料电池的双极板，染料敏化太阳能电池的对电极和钒氧化还原电池的电极。 导电板的制备如下：a）将乙烯基酯树脂和石墨粉末混合以形成体积模塑料（BMC）材料，石墨粉末的含量基于石墨粉末的总重量为70wt％至95wt％ 和乙烯基酯，其中在配混期间加入基于乙烯基酯树脂的重量的0.01-15重量％的官能化石墨烯; b）从步骤a）模制BMC材料，以形成在80-250℃和500-4000psi下具有所需成形的导电板。

公开(公告)号：US20080081193A1

公开(公告)日：2008-04-03

申请号：US11889375

申请日：2007-08-13

申请人： Jinn-Luh Ou ,  Yuh Sung ,  Chang-Ping Chang ,  Ming-Der Ger ,  Szu-Ching Hsiao ,  Yan-Cheng Chen

发明人： Jinn-Luh Ou ,  Yuh Sung ,  Chang-Ping Chang ,  Ming-Der Ger ,  Szu-Ching Hsiao ,  Yan-Cheng Chen

IPC分类号： C08F292/00 ,  B01J13/02

CPC分类号： C08F292/00 ,  B01J13/14 ,  C08F257/02 ,  C08F285/00 ,  C08L51/003 ,  C08L51/10 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998 ,  C08L2666/02

摘要： The present invention discloses a two-stage process for preparing functionalized magnetizable microspheres. The first stage includes forming an inner shell of styrene polymer or styrene copolymer around magnetizable nano particles having a monolayer of a non-water-soluble dispersing agent coated thereon. The second stage includes forming an outer shell of styrene polymer or styrene copolymer with sulfate (SO4−) bounded thereto around the inner shell by free radical polymerization. Preferably, nano particles of a noble metal are deposited on the surface of the outer shell. The magnetizable microspheres prepared by the process of the present invention have a size of 100-1000 nm, and the thickness ratio of the inner shell to the outer shell ranges from 10:1 to 1:10.

摘要翻译： 本发明公开了一种用于制备官能化可磁化微球的两阶段方法。 第一阶段包括在其上涂覆有非水溶性分散剂的单层的可磁化纳米颗粒周围形成苯乙烯聚合物或苯乙烯共聚物的内壳。 第二阶段包括通过自由基聚合在内壳周围形成与硫酸盐（SO 4 SO 3 - ）结合的苯乙烯聚合物或苯乙烯共聚物的外壳。 优选地，贵金属的纳米颗粒沉积在外壳的表面上。 通过本发明的方法制备的可磁化微球的尺寸为100-1000nm，内壳与外壳的厚度比为10:1至1:10。

公开(公告)号：US08318254B2

公开(公告)日：2012-11-27

申请号：US12289542

申请日：2008-10-30

申请人： Yuh Sung ,  Ming-Der Ger ,  Chang-Ping Chang ,  Chun-Chieh Tseng ,  Wen-Ding Chen

发明人： Yuh Sung ,  Ming-Der Ger ,  Chang-Ping Chang ,  Chun-Chieh Tseng ,  Wen-Ding Chen

IPC分类号： B05D1/36 ,  B05D5/00

CPC分类号： H05K3/182 ,  C23C18/1608 ,  C23C18/168 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/32 ,  C23C18/38 ,  H05K3/422 ,  H05K2203/0709

摘要： A copolymer deposited with particles of catalytic metal is disclosed in the present invention, which is formed from an ethylenically unsaturated monomer and a hydrophilic monomer, and the catalytic metal is Au, Ag, Pd, Pt or Ru. The copolymer is hydrophilic when the temperature is lower than a specific temperature, and will become hydrophobic when the temperature is greater than the specific temperature. The present invention also discloses a method for forming a metal layer on a substrate via electroless plating, which includes contacting the substrate with an ink composition, drying the ink composition on the substrate, and contacting the dried ink composition with an electroless plating solution, wherein the ink composition contains the copolymer of the present invention in an aqueous phase. The present invention further discloses a method for forming metal conductors in through holes of a substrate.

摘要翻译： 在本发明中公开了由烯属不饱和单体和亲水性单体形成的催化金属颗粒的共聚物，催化金属是Au，Ag，Pd，Pt或Ru。 当温度低于特定温度时，共聚物是亲水性的，当温度大于特定温度时，共聚物变得疏水。 本发明还公开了一种通过化学镀在基板上形成金属层的方法，该方法包括使基材与油墨组合物接触，干燥基材上的油墨组合物，以及使干燥的油墨组合物与化学镀溶液接触，其中 油墨组合物含有本发明的水相共聚物。 本发明还公开了一种用于在基板的通孔中形成金属导体的方法。