公开(公告)号：US4850991A

公开(公告)日：1989-07-25

申请号：US94908

申请日：1987-09-10

申请人： Minoru Nakanishi ,  Akira Sakurai ,  Takatoshi Kobayashi ,  Zenbei Meiwa ,  Norihiro Abe

发明人： Minoru Nakanishi ,  Akira Sakurai ,  Takatoshi Kobayashi ,  Zenbei Meiwa ,  Norihiro Abe

IPC分类号： A61F13/15 ,  A61F13/56 ,  A61L15/42

CPC分类号： A61F13/5605 ,  A61L15/42 ,  A61F2013/51097 ,  A61F2013/51411 ,  A61F2013/530481 ,  A61F2013/530802 ,  Y10T428/249985 ,  Y10T428/2982 ,  Y10T428/2998 ,  Y10T442/653 ,  Y10T442/678

摘要： An absorbent article comprises a liquid-permeable surface sheet, a liquid-impermeable leak-proof sheet and an absorbent layer disposed between the two sheets, said leak-proof sheet having on the outside surface a composite comprising a hydrophobic polymer having a glass transition temperature of zero degree centigrade or lower and foamed beads of a polymer. It is improved in the anti-slipping property, the leak-proof property and the permeability to moisture.

公开(公告)号：US5126201A

公开(公告)日：1992-06-30

申请号：US458063

申请日：1989-12-28

申请人： Daisuke Shiba ,  Norihiro Abe ,  Takatoshi Kobayashi

发明人： Daisuke Shiba ,  Norihiro Abe ,  Takatoshi Kobayashi

IPC分类号： A61F13/511 ,  A61F13/15 ,  A61F13/49 ,  A61L15/18 ,  D01F8/06 ,  D04H1/4382 ,  D04H1/541

CPC分类号： A61L15/18 ,  D04H1/4209 ,  D04H1/4382 ,  Y10S428/913 ,  Y10T428/2927 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T428/2958 ,  Y10T442/641

摘要： An absorbent article using, as a surface material (or a liquid-permeable top sheet), a nonwoven fabric is disclosed, the nonwoven fabric containing at least 10% by weight of a conjugate fiber comprising first and second parts differing from each other, wherein the second part covers at least a part of the first part, at least the first part contains an inorganic component in a proportion higher than that contained in the second part, and the content of the inorganic component in the first part is at least 1.5% by weight based on the weight of the first part. The nonwoven fabric has excellent cutting properties while retaining satisfactory strength, absorbency and touch.

公开(公告)号：US07041399B2

公开(公告)日：2006-05-09

申请号：US10450176

申请日：2001-12-12

申请人： Yasuyuki Hirai ,  Norihiro Abe ,  Yoshiyuki Takeda

发明人： Yasuyuki Hirai ,  Norihiro Abe ,  Yoshiyuki Takeda

IPC分类号： B32B27/38 ,  C08L63/00

CPC分类号： H05K1/0326 ,  B32B15/08 ,  C08G59/4021 ,  C08G59/686 ,  H05K1/0373 ,  Y10S428/901 ,  Y10T428/12007 ,  Y10T428/24994 ,  Y10T428/2971 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529

摘要： Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

摘要翻译： 公开了一种层压板或半固化片的清漆，其包含将（a）环氧树脂，（b）双氰胺和（c）具有咪唑环的化合物混合在一起而得到的热处理产物，使得组分（c）为 以组分（a）的重量计0.001至0.03重量％，并将所得混合物在70℃至小于140℃的温度下在有机溶剂中进行反应热处理 使得所有组分在不存在溶剂的情况下彼此相容; 和（d）无机填料，使用清漆制备的层压板或预浸料以及使用层压板和/或预浸料制备的印刷线路板。

公开(公告)号：US5214490A

公开(公告)日：1993-05-25

申请号：US777343

申请日：1991-12-05

申请人： Norihiro Abe ,  Tatsuyuki Miyagawa

发明人： Norihiro Abe ,  Tatsuyuki Miyagawa

IPC分类号： G01B11/02 ,  G01B11/04 ,  G06T1/00 ,  G06T7/60

CPC分类号： G01B11/022 ,  G01B11/04

摘要： With four CCD (charge coupled device) based cameras and flashing devices, each of which is installed with an angle against the optical axis of a camera, four corners of sheets being transferred line are photographed. Each of four corner detecting sections detects absolute coordinates of a corner based on differences in brightness of standstill picture of sheet corner taken by each camera. Then, based on the detected absolute coordinates of sheet corners, sheet dimensions computing section calculates lengths, widths and diagonal dimensions of sheets.

摘要翻译： PCT No.PCT / JP91 / 00558 Sec。 371 1991年12月5日第 102（e）日期1991年12月5日PCT 1991年4月25日PCT PCT。 出版物WO91 / 16599 日期为1991年10月31日。使用四个基于CCD（电荷耦合器件）的相机和闪光装置，其中每个相机与相机的光轴成一定角度，拍摄了传送线的四个角落。 基于每个摄像机拍摄的片角的静止图像的亮度差异，四个拐角检测部分中的每一个检测角部的绝对坐标。 然后，基于检测到的边角的绝对坐标，片材尺寸计算部分计算片材的长度，宽度和对角线尺寸。

公开(公告)号：US07390571B2

公开(公告)日：2008-06-24

申请号：US11362011

申请日：2006-02-27

申请人： Yasuyuki Hirai ,  Norihiro Abe ,  Yoshiyuki Takeda

发明人： Yasuyuki Hirai ,  Norihiro Abe ,  Yoshiyuki Takeda

IPC分类号： B32B27/38 ,  B32B27/04 ,  B32B27/18 ,  B32B15/092 ,  C08L63/00

CPC分类号： H05K1/0326 ,  B32B15/08 ,  C08G59/4021 ,  C08G59/686 ,  H05K1/0373 ,  Y10S428/901 ,  Y10T428/12007 ,  Y10T428/24994 ,  Y10T428/2971 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529

摘要： Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

摘要翻译： 公开了一种层压板或半固化片的清漆，其包含将（a）环氧树脂，（b）双氰胺和（c）具有咪唑环的化合物混合在一起而得到的热处理产物，使得组分（c）为 以组分（a）的重量计0.001至0.03重量％，并将所得混合物在70℃至小于140℃的温度下在有机溶剂中进行反应热处理 使得所有组分在不存在溶剂的情况下彼此相容; 和（d）无机填料，使用清漆制备的层压板或预浸料以及使用层压板和/或预浸料制备的印刷线路板。

公开(公告)号：US4714466A

公开(公告)日：1987-12-22

申请号：US816860

申请日：1986-01-07

申请人： Masatake Dohzono ,  Iwao Miyashita ,  Norihiro Abe

发明人： Masatake Dohzono ,  Iwao Miyashita ,  Norihiro Abe

IPC分类号： A61F13/20 ,  D04H1/46 ,  A61F13/16

CPC分类号： A61F13/2085 ,  A61F13/2051 ,  D04H1/492 ,  Y10S428/913 ,  Y10S604/904 ,  Y10T428/24992 ,  Y10T442/689

摘要： An absorbent member, suitable for a tampon, is produced by ejecting a liquid against a sheet of water-absorptive fibers in order to interlace the fibers with each other and moulding under a pressure the sheet to form the absorbent member.

摘要翻译： 通过将液体喷射到吸水性纤维片上，以将纤维彼此交织并在压力下成型以形成吸收体，从而制造适用于卫生棉条的吸收体。

公开(公告)号：US07538150B2

公开(公告)日：2009-05-26

申请号：US11219821

申请日：2005-09-07

申请人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

发明人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

IPC分类号： B32B15/08 ,  B32B27/04 ,  B32B27/28 ,  C08K5/521 ,  C08L61/08 ,  C08L63/02 ,  H05K1/05

CPC分类号： C08L61/34 ,  B32B27/00 ,  B32B27/04 ,  C08G59/226 ,  C08L63/00 ,  C08L2205/02 ,  C08L2205/03 ,  H05K1/0326 ,  Y10T428/24636 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/16 ,  C08L2666/14 ,  C08L2666/22

摘要： The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

摘要翻译： 本发明公开了一种热固性树脂组合物，其包含（A）35〜75重量份的含有以苯并恶嗪环作为主成分的化合物的热固性树脂，（B）10〜25重量份的缩聚产物 苯酚，具有三嗪环的化合物和醛，和（C）10至45重量份的环氧树脂，基于组分（A），（B）的有机固体组分的总量100重量份， 和（C），和（i）重均分子量为1,000〜3000的双酚F环氧树脂，或（ii）双酚F环氧树脂和双酚A环氧树脂的混合环氧树脂，其重均分子量 （C）中含有0〜100重量％的组分（C）; 以及预浸料，布线板用层叠板和使用该预浸料的布线基板。

公开(公告)号：US06720077B2

公开(公告)日：2004-04-13

申请号：US10073309

申请日：2002-02-13

申请人： Yasuyuki Hirai ,  Hironori Suzuki ,  Yoshiyuki Takeda ,  Kenichi Oohori ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe

发明人： Yasuyuki Hirai ,  Hironori Suzuki ,  Yoshiyuki Takeda ,  Kenichi Oohori ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe

IPC分类号： B32B2738

CPC分类号： B32B15/08 ,  B32B27/04 ,  B32B27/38 ,  B32B2307/206 ,  B32B2457/08 ,  C08K5/3155 ,  C08K5/5313 ,  C09K21/12 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L63/00

摘要： The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50° C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.

摘要翻译： 本发明涉及含有环氧树脂，胺型固化剂，具有式1所示结构的有机磷化合物和有机溶剂的树脂组合物，其中环氧树脂和有机磷化合物在 50℃以下。 该树脂组合物具有足够的阻燃性，不含任何含卤素阻燃剂，具有良好的耐热性和良好的耐化学性，并且对于通过在配混期间发生的反应而消耗环氧树脂引起的反应稳定性或固化性没有引起任何问题 树脂组合物。

公开(公告)号：US20060141262A1

公开(公告)日：2006-06-29

申请号：US11362011

申请日：2006-02-27

申请人： Yasuyuki Hirai ,  Norihiro Abe ,  Yoshiyuki Takeda

发明人： Yasuyuki Hirai ,  Norihiro Abe ,  Yoshiyuki Takeda

IPC分类号： B32B27/38 ,  B32B27/04 ,  C08L63/00 ,  B32B37/00

CPC分类号： H05K1/0326 ,  B32B15/08 ,  C08G59/4021 ,  C08G59/686 ,  H05K1/0373 ,  Y10S428/901 ,  Y10T428/12007 ,  Y10T428/24994 ,  Y10T428/2971 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529

摘要： Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

摘要翻译： 公开了一种层压板或半固化片的清漆，其包含将（a）环氧树脂，（b）双氰胺和（c）具有咪唑环的化合物混合在一起而得到的热处理产物，使得组分（c）为 以组分（a）的重量计0.001至0.03重量％，并将所得混合物在70℃至小于140℃的温度下在有机溶剂中进行反应热处理 使得所有组分在不存在溶剂的情况下彼此相容; 和（d）无机填料，使用清漆制备的层压板或预浸料以及使用层压板和/或预浸料制备的印刷线路板。

公开(公告)号：US20060008632A1

公开(公告)日：2006-01-12

申请号：US11219821

申请日：2005-09-07

申请人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

发明人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

IPC分类号： B32B27/38 ,  B32B15/08 ,  C08L63/00 ,  B32B27/04

CPC分类号： C08L61/34 ,  B32B27/00 ,  B32B27/04 ,  C08G59/226 ,  C08L63/00 ,  C08L2205/02 ,  C08L2205/03 ,  H05K1/0326 ,  Y10T428/24636 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/16 ,  C08L2666/14 ,  C08L2666/22

摘要： The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

摘要翻译： 本发明公开了一种热固性树脂组合物，其包含（A）35〜75重量份的含有以苯并恶嗪环作为主成分的化合物的热固性树脂，（B）10〜25重量份的缩聚产物 苯酚，具有三嗪环的化合物和醛，和（C）10至45重量份的环氧树脂，基于组分（A），（B）的有机固体组分的总量100重量份， 和（C），和（i）重均分子量为1,000〜3000的双酚F环氧树脂，或（ii）双酚F环氧树脂和双酚A环氧树脂的混合环氧树脂，其重均分子量 （C）中含有0〜100重量％的组分（C）; 以及预浸料，布线板用层叠板和使用该预浸料的布线基板。