公开(公告)号：US6054181A

公开(公告)日：2000-04-25

申请号：US692286

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05D3/12

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal direction, and has a plurality of positions for respectively placing a plurality of boats. The wafers are conveyed from a supply section to a coating section, and are subjected to a coating treatment one by one. The wafers, which have undergone the coating treatment, are conveyed to the interface section. The wafers, which have undergone the coating treatment, are loaded into the first boat placed on the stage, in the interface section. The first boat containing the wafers, which have undergone the coating treatment, is located at a transfer position by moving the stage. The first boat, located at a transfer position by moving the stage. The first boat, located at the transfer position, is conveyed from the stage into a heating section, and the wafers, which have undergone the coating treatment, are subjected to a heating treatment simultaneously and all together.

摘要翻译： 一种将多个晶片进行涂覆和打浆处理的方法，其中第一个船被放置在布置在界面部分中的台上。 第一艘船能够容纳沿垂直方向间隔堆叠的晶片。 舞台能够沿水平方向移动，并且具有用于分别放置多个船的多个位置。 将晶片从供给部输送到涂布部，并逐个进行涂布处理。 已经经过涂覆处理的晶片被输送到界面部分。 已经进行了涂覆处理的晶片被装载到接口部分中放置在载物台上的第一个舟皿中。 包含经过涂覆处理的晶片的第一艘船通过移动台架位于转移位置。 第一艘船，通过移动舞台位于转移位置。 位于转移位置的第一个船从载物台输送到加热部分，并且经过涂覆处理的晶片同时进行加热处理。

公开(公告)号：US5565034A

公开(公告)日：1996-10-15

申请号：US331083

申请日：1994-10-28

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05C5/00

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.

摘要翻译： 根据本发明的基板处理装置包括接口部分，其具有第一传送部件，用于从涂覆处理部分传送物体，用于根据单个片材处理将物体施加到物体上，并将物体保持部件移动 用于可拆卸地供给多个物体保持部件并同时移动多个物体保持部件的部件，以及具有用于将放置在物体保持部件上的物体转印到热处理部的热转印部件的热处理部， 根据分批处理对经过涂覆处理的多个物体进行处理。

公开(公告)号：US5725664A

公开(公告)日：1998-03-10

申请号：US692436

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05C5/00

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space. A dehumidifier is arranged on the circulation line for dehumidifying air in the circulation line to provide localized dehumidification of the surrounding space formed by the casing.

摘要翻译： 一种用于对多个晶片进行涂覆和加热处理的设备，包括用于对晶片进行一次涂覆处理的涂布部分，将经过涂覆处理的晶片全部进行加热处理的加热部分一起进行加热处理;以及 布置在涂覆部分和加热部分之间的界面部分。 在热处理部分中对晶片进行热处理，同时晶片在船上沿垂直方向间隔堆叠。 已经经过涂覆处理的晶片通过接口部分中的传送部件装载到船中。 输送构件和舟皿由在界面部分处由壳体形成的周围空间包围。 循环管线与供气和排气系统结合，用于在周围空间循环空气。 在循环管线上设置除湿器，用于对循环管线中的空气进行除湿，以提供由壳体形成的周围空间的局部除湿。

公开(公告)号：US5664254A

公开(公告)日：1997-09-02

申请号：US594937

申请日：1996-01-31

申请人： Jun Ohkura ,  Naruaki Iida ,  Hiroyuki Kudou ,  Masanori Tateyama ,  Yasuhiro Sakamoto

发明人： Jun Ohkura ,  Naruaki Iida ,  Hiroyuki Kudou ,  Masanori Tateyama ,  Yasuhiro Sakamoto

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/677 ,  H01L21/687 ,  G03D5/00 ,  G03D3/08

CPC分类号： H01L21/6715 ,  H01L21/67781 ,  H01L21/68707

摘要： A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle .theta. to load/unload the wafer into/from the process units, an arm section arranged to move in the main handler in the Z-axis direction, a plurality of holding arms arranged in the arm section to constitute a multi-stage structure so as to respectively hold the wafers, each holding arm being advanced and retreated on an X-Y plane from the arm section, an optical sensor, arranged in the arm section, for detecting a holding state of the wafer in each of the plurality of holding arms, and a controller for controlling an operation of the main handler, an operation of the arm section, and operations of the plurality of holding arms on the basis of a detection result from the optical sensor, wherein the controller advances or retreats each holding arm while operating at least one of the main handler and the arm section, and causes the optical sensor to detect the holding state of the wafer by each holding arm before the holding arm reaches a corresponding one of the process units.

摘要翻译： 晶片处理装置包括在Y轴方向上延伸的公共路径，其中一个晶片或多个晶片被输送，多个处理单元堆叠在公共路径的两侧以构成多级结构， 主处理器沿着Y轴方向在公共路径中移动并且以角度θ围绕Z轴旋转以将晶片装载/卸载到处理单元中/从加工单元中卸载晶片，臂部分布置成在Z轴方向上移动到主处理器中， 多个保持臂，布置在所述臂部中，以构成多个阶段结构，以分别保持晶片，每个保持臂从臂部在XY平面上前进和后退;光学传感器，布置在 臂部，用于检测多个保持臂中的每一个中的晶片的保持状态;以及控制器，用于控制主处理器的操作，臂部的操作以及多个保持臂的操作 bas 具有来自光学传感器的检测结果，其中控制器在操作主处理器和臂部分中的至少一个的同时前进或后退每个保持臂，并且使得光学传感器通过每个保持臂检测晶片的保持状态 在握持臂到达相应的一个处理单元之前。

公开(公告)号：USRE37470E1

公开(公告)日：2001-12-18

申请号：US09388589

申请日：1999-09-02

申请人： Jun Ohkura ,  Naruaki Iida ,  Hiroyuki Kudou ,  Masanori Tateyama ,  Yasuhiro Sakamoto

发明人： Jun Ohkura ,  Naruaki Iida ,  Hiroyuki Kudou ,  Masanori Tateyama ,  Yasuhiro Sakamoto

IPC分类号： G03D500

CPC分类号： H01L21/6715 ,  H01L21/67781 ,  H01L21/68707

摘要： A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle &thgr; to load/unload the wafer into/from the process units, an arm section arranged to move in the main handler in the Z-axis direction, a plurality of holding arms arranged in the arm section to constitute a multi-stage structure so as to respectively hold the wafers, each holding arm being advanced and retreated on an X-Y plane from the arm section, an optical sensor, arranged in the arm section, for detecting a holding state of the wafer in each of the plurality of holding arms, and a controller for controlling an operation of the main handler, an operation of the arm section, and operations of the plurality of holding arms on the basis of a detection result from the optical sensor, wherein the controller advances or retreats each holding arm while operating at least one of the main handler and the arm section, and causes the optical sensor to detect the holding state of the wafer by each holding arm before the holding arm reaches a corresponding one of the process units.

摘要翻译： 晶片处理装置包括在Y轴方向上延伸的公共路径，其中一个晶片或多个晶片被输送，多个处理单元堆叠在公共路径的两侧以构成多级结构， 主处理器沿着Y轴方向在公共路径中移动并且以角度θ围绕Z轴旋转以将晶片装载/卸载到处理单元中/从加工单元中卸载晶片，臂部分布置成在Z轴方向上移动到主处理器中， 多个保持臂，布置在所述臂部中，以构成多个阶段结构，以分别保持晶片，每个保持臂从臂部在XY平面上前进和后退;光学传感器，布置在 臂部，用于检测多个保持臂中的每一个中的晶片的保持状态;以及控制器，用于控制主处理器的操作，臂部的操作以及多个保持臂的操作 bas 具有来自光学传感器的检测结果，其中控制器在操作主处理器和臂部分中的至少一个的同时前进或后退每个保持臂，并且使得光学传感器通过每个保持臂检测晶片的保持状态 在握持臂到达相应的一个处理单元之前。

公开(公告)号：US08372480B2

公开(公告)日：2013-02-12

申请号：US13178299

申请日：2011-07-07

申请人： Akira Miyata ,  Masanori Tateyama

发明人： Akira Miyata ,  Masanori Tateyama

IPC分类号： B05D3/02 ,  B05D3/06

CPC分类号： H01L21/67276

摘要： A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.

摘要翻译： 根据要进行的方法的处理配方产生转移流。 在转移流程中，根据衬底转移顺序列出的一种类型的模块与从衬底转移到模块中的衬底转移单元到基板准备好被转移回到基板转移顺序的必要停留时间相关联 相应工艺完成后的基片转印单元。 将循环限制时间确定为通过将所需的停留时间除以安装在涂布机/显影剂中的模块的数量而获得的那些中最长的必需转印周期时间。 要使用的模块的数量被确定为通过将必要的停留时间除以周期限制时间或值被提升的最接近的整数而获得的值。

公开(公告)号：US20090098298A1

公开(公告)日：2009-04-16

申请号：US12248534

申请日：2008-10-09

申请人： Akira MIYATA ,  Masanori Tateyama

发明人： Akira MIYATA ,  Masanori Tateyama

IPC分类号： B05D3/02 ,  B05C11/02

CPC分类号： H01L21/67276

摘要： A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.

摘要翻译： 根据要进行的方法的处理配方产生转移流。 在转移流程中，根据衬底转移顺序列出的一种类型的模块与从衬底转移到模块中的衬底转移单元到基板准备好被转移回到基板转移顺序的必要停留时间相关联 相应工艺完成后的基片转印单元。 将循环限制时间确定为通过将所需的停留时间除以安装在涂布机/显影剂中的模块的数量而获得的那些中最长的必需转印周期时间。 要使用的模块的数量被确定为通过将必要的停留时间除以周期限制时间或值被提升的最接近的整数而获得的值。

公开(公告)号：US06526329B2

公开(公告)日：2003-02-25

申请号：US09866717

申请日：2001-05-30

申请人： Masanori Tateyama ,  Syuzo Fujimaru

发明人： Masanori Tateyama ,  Syuzo Fujimaru

IPC分类号： G06F700

CPC分类号： H01L21/67248 ,  G03F7/7075 ,  G05B19/41865 ,  G05B2219/31429 ,  Y02P90/20 ,  Y10S414/14

摘要： The present invention is a substrate processing method comprising the steps of successively extracting unprocessed wafers from a cassette, successively conveying the extracted wafers to a plurality of processing units, causing the processing units to process the wafers in parallel, and returning the processed wafers to a cassette. A process completion prediction time at which processes for one lot are completed is calculated and displayed corresponding to a process recipe that has been set to a plurality of wafers for at least one lot. Corresponding to the process completion prediction time, a cassette that contains a plurality of unprocessed wafers for one lot is accepted. A cassette that contains a plurality of processed wafers for one lot is returned.

摘要翻译： 本发明是一种基板处理方法，包括以下步骤：从盒中连续提取未处理的晶片，将提取的晶片连续地传送到多个处理单元，使处理单元平行地处理晶片，并将处理后的晶片返回到 盒式磁带 根据已经设定为至少一批的多个晶片的处理配方，计算并显示一批完成处理的处理完成预测时间。 对应于处理完成预测时间，接收一批包含多个未处理的晶片的盒。 返回包含一批批处理的多个晶片的盒。

公开(公告)号：US06394670B2

公开(公告)日：2002-05-28

申请号：US09853748

申请日：2001-05-14

申请人： Kunie Ogata ,  Takashi Aiuchi ,  Masanori Tateyama

发明人： Kunie Ogata ,  Takashi Aiuchi ,  Masanori Tateyama

IPC分类号： G03D500

CPC分类号： G03F7/70525 ,  G03F7/70975

摘要： A system comprises a first maintenance interval storage for storing a first maintenance interval of each component which is not related to an actual utilization of an apparatus, a second maintenance interval storage storing a second maintenance interval of each component which is related to the actual utilization of the apparatus, a maintenance demander for demanding maintenance of some component based on the passing of the first maintenance interval of this component; and a maintenance interval prolonger for judging the second maintenance interval has passed or not based on the passing of the first maintenance interval, and when the second maintenance interval has not yet passed, suspending the demand for maintenance by the maintenance demander and prolonging the first maintenance interval. Consequently, it becomes possible to manage a maintenance timing of each component and give notice thereof on the side of the apparatus composed of a plurality of components.

摘要翻译： 一种系统，包括：第一维护间隔存储器，用于存储与设备的实际利用无关的每个组件的第一维护间隔;存储与每个组件的实际使用相关的每个组件的第二维护间隔的第二维护间隔存储 该装置是基于该部件的第一维护间隔的通过而要求维护一些部件的维护需求者; 并且用于判断第二维护间隔的维护间隔延长器是否已经通过了第一维护间隔的通过，并且当第二维护间隔还没有通过时，暂停维护需求者的维护需求并延长了第一维护间隔 间隔。 因此，可以管理每个部件的维护定时，并且在由多个部件组成的装置的侧面通知它。

公开(公告)号：US08015940B2

公开(公告)日：2011-09-13

申请号：US12248534

申请日：2008-10-09

申请人： Akira Miyata ,  Masanori Tateyama

发明人： Akira Miyata ,  Masanori Tateyama

IPC分类号： B05C5/02

CPC分类号： H01L21/67276

摘要： A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.

摘要翻译： 根据要进行的方法的处理配方产生转移流。 在转移流程中，根据衬底转移顺序列出的一种类型的模块与从衬底转移到模块中的衬底转移单元到基板准备好被转移回到基板转移顺序的必要停留时间相关联 相应工艺完成后的基片转印单元。 将循环限制时间确定为通过将所需的停留时间除以安装在涂布机/显影剂中的模块的数量而获得的那些中最长的必需转印周期时间。 要使用的模块的数量被确定为通过将必要的停留时间除以周期限制时间或值被提升的最接近的整数而获得的值。