公开(公告)号：US5507651A

公开(公告)日：1996-04-16

申请号：US283656

申请日：1994-08-01

申请人： Mitsuho Tanaka ,  Akira Katsumata ,  Hiroshi Arisaka

发明人： Mitsuho Tanaka ,  Akira Katsumata ,  Hiroshi Arisaka

IPC分类号： H01R12/55 ,  H01R9/09

CPC分类号： H01R12/62 ,  H01R12/716 ,  H01R12/79 ,  H01R12/57 ,  H01R12/714

摘要： A film circuit connector in which respective conductive tracks in film contact areas on front, mating faces are pressed together into electrical connection between side walls of a metal channel-section receptacle spring and a compressible elastomeric plug spring which engage respective rear faces of the films, the compressible plug spring providing a counter-force to the receptacle spring force, accommodating any variations in receptacle spring force arising longitudinally thereof, ensuring constant contact force between all tracks. Tabs for anchoring and grounding the receptacle spring to the circuit board are struck out and bent down from opposite walls of the receptacle spring, enabling electrical shielding of contact areas. Linking portions of conductive tracks connecting the mating contact portions on the front face of the film to board connecting portions, are formed on the rear face of the film for electrical and mechanical protection and may be insulated on all sides. The film is formed with windows for exposing conductive tracks for connection to a circuit board and pockets for trapping board mounted solder pads for connection to the conductive tracks. Film positioning and clamping members in the receptacle locate end film portions inwardly minimizing occupation of board space.

摘要翻译： 一种胶片电路连接器，其中在前面的胶片接触区域中的相应导电轨道，配合面压在一起，与金属槽部分接收器弹簧的侧壁和可压缩的弹性插塞弹簧电连接， 可压缩插塞弹簧提供对接收器弹簧力的反作用力，以容纳在其纵向方向上产生的插座弹簧力的任何变化，确保所有轨道之间的恒定的接触力。 用于将接收器弹簧锚定和接地到电路板的突片从接收器弹簧的相对的壁被击出并向下弯曲，从而能够对接触区域进行电屏蔽。 将导电轨道的连接部分形成在膜的后表面上，用于电气和机械保护，并且可以在所有侧面上绝缘，从而将膜的前表面上的配合接触部分连接到板连接部分。 薄膜形成有用于暴露用于连接到电路板的导电轨道的窗口和用于捕获板安装的焊盘以用于连接到导电轨道的凹穴。 容器中的薄膜定位和夹紧构件定位端部薄膜部分，从而最小化板空间的占用。

公开(公告)号：US5316486A

公开(公告)日：1994-05-31

申请号：US899688

申请日：1992-06-16

申请人： Mitsuho Tanaka ,  Akira Katsumata ,  Hiroshi Arisaka

发明人： Mitsuho Tanaka ,  Akira Katsumata ,  Hiroshi Arisaka

IPC分类号： H01R12/71 ,  H01R12/79 ,  H01R9/09

CPC分类号： H01R12/62 ,  H01R12/716 ,  H01R12/79 ,  H01R12/714

摘要： A film circuit connector in which respective conductive tracks in film contact areas on front, mating faces are pressed together into electrical connection between side walls of a metal channel-section receptacle spring and a compressible elastomeric plug spring which engage respective rear faces of the films, the compressible plug spring providing a counter-force to the receptacle spring force, accommodating any variations in receptacle spring force arising longitudinally thereof, ensuring constant contact force between all tracks. Tabs for anchoring and grounding the receptacle spring to the circuit board are struck out and bent down from opposite walls of the receptacle spring, enabling electrical shielding of contact areas. Linking portions of conductive tracks connecting the mating contact portions on the front face of the film to board connecting portions, are formed on the rear face of the film for electrical and mechanical protection and may be insulated on all sides. Film positioning and clamping members in the receptacle locate end film portions inwardly minimizing occupation of board space.

摘要翻译： 一种胶片电路连接器，其中在前面的胶片接触区域中的相应导电轨道，配合面压在一起，与金属槽部分接收器弹簧的侧壁和可压缩的弹性插塞弹簧电连接， 可压缩插塞弹簧提供对接收器弹簧力的反作用力，以容纳在其纵向方向上产生的插座弹簧力的任何变化，确保所有轨道之间的恒定的接触力。 用于将接收器弹簧锚定和接地到电路板的突片从接收器弹簧的相对的壁被击出并向下弯曲，从而能够对接触区域进行电屏蔽。 将导电轨道的连接部分形成在膜的后表面上，用于电气和机械保护，并且可以在所有侧面上绝缘，从而将膜的前表面上的配合接触部分连接到板连接部分。 容器中的薄膜定位和夹紧构件定位端部薄膜部分，从而最小化板空间的占用。

公开(公告)号：US5156553A

公开(公告)日：1992-10-20

申请号：US689348

申请日：1991-04-22

申请人： Akira Katsumata ,  Hiroshi Arisaka

发明人： Akira Katsumata ,  Hiroshi Arisaka

IPC分类号： H01R12/55 ,  H01R12/79 ,  H01R13/26

CPC分类号： H01R12/79 ,  H01R12/716 ,  H01R12/82 ,  H01R13/26

摘要： A film circuit connector assembly comprises matable housing assemblies each including an outer insulating housing receiving a film circuit supporting member carrying a film circuit with a mating contact area therein extending away from a mating face along a film circuit supporting wall with a circuit board engaging area of the film circuit extending out from a base of the housing assembly. A cylindrical spring is mounted in a recess extending along at least one film supporting wall in engagement with a rear face of a contact area pressing the contact areas of the mating connectors together. In one example, the housing assembly clamps free ends of the film circuit conductors in resiliently deformed condition into engagement with the circuit board. Apertures may be formed through the insulating web of the circuit board engaging area exposing conductive tracks thereof at locations corresponding to respective reflow solder pads of a circuit board and forming pockets receiving and confining the reflowing solder therein to avoid solder bridges being formed between adjacent tracks.

摘要翻译： 薄膜电路连接器组件包括可配置的壳体组件，每个壳体组件包括外部绝缘壳体，该外部绝缘壳体容纳胶片电路支撑构件，所述薄膜电路支撑构件承载具有配合接触区域的膜电路，所述配合接触区域沿着膜电路支撑壁远离配合面延伸，电路板接合区域 胶片电路从壳体组件的基部延伸出来。 圆柱形弹簧安装在沿着至少一个膜支撑壁延伸的凹部中，该凹槽与接合区域的后表面接合，从而将配合连接器的接触区域压在一起。 在一个示例中，壳体组件将弹性变形状态下的胶片电路导体的自由端夹持成与电路板接合。 可以通过电路板接合区域的绝缘网形成孔径，其在对应于电路板的各个回流焊盘的位置处暴露其导电轨道并且形成容纳接收并限制其中的回流焊料的凹坑，以避免在相邻轨道之间形成焊料桥。

公开(公告)号：US5213521A

公开(公告)日：1993-05-25

申请号：US824115

申请日：1992-01-22

申请人： Hiroshi Arisaka

发明人： Hiroshi Arisaka

IPC分类号： H01R13/719 ,  H05K9/00

CPC分类号： H01R23/688 ,  H01R12/523

摘要： A high frequency electrical connector assembly comprises first and second intermatable connectors including first and second intermatable housings, respectively, containing first and second board assemblies each comprising a series of conductive and insulating dielectric layers located alternately in overlying relation and extending transversely of a mating direction. Intermatable ground contacts extend between and interconnect all the conductive layers of respective board assemblies thereby forming ground planes, and, a first and second series of signal contacts having intermatable portions and anchoring portions extending through the respective board assemblies. The respective conductive layers extend to locations adjacent and spaced from the anchoring portions so that mating portions of the connector assembly are shieldingly enclosed between the board assemblies when the connectors are mated. The ground contacts are mating pin and socket portions or intermatable metal portions of the respective housings.

摘要翻译： 高频电连接器组件包括分别包括第一和第二可互换壳体的第一和第二可互换连接器，其包含第一和第二板组件，每个第一和第二可互换壳体包括交替地覆盖关系并横向于配合方向延伸的一系列导电和绝缘电介质层。 互补的接地触头在相应的板组件的所有导电层之间延伸并且互连，从而形成接地平面，以及具有可互换部分的第一和第二系列信号触头以及延伸通过各个板组件的锚定部分。 相应的导电层延伸到与锚定部分相邻和间隔开的位置，使得当连接器配合时，连接器组件的配合部分被屏蔽地封闭在板组件之间。 接地触头是相应壳体的配合销和插座部分或可互换的金属部分。

公开(公告)号：US5538433A

公开(公告)日：1996-07-23

申请号：US292500

申请日：1994-08-18

申请人： Hiroshi Arisaka

发明人： Hiroshi Arisaka

IPC分类号： H01R11/01 ,  H01L23/053 ,  H01R12/51 ,  H01R33/76 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K3/42 ,  H05K7/10 ,  H01R23/76

CPC分类号： H05K1/141 ,  H01R12/523 ,  H05K1/0218 ,  H05K7/1084 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/10333 ,  H05K2201/10704 ,  H05K3/368 ,  H05K3/429

摘要： A PGA connector for a microprocessor has a multilayer base board assembly with alternating conductive and dielectric layers of preselected thicknesses through which signal pins, current source pins and a grounding pin extend. The signal pins are insulated from the conductive layers and the current and grounding pin are connected to preselected conductive layers. A series of connecting apertures formed by holes with respective conductive linings extend through the layers at selected locations between pins to interconnect selected conductive layers. The connecting apertures interconnect all conductive layers of the base board or, in another example, alternately positioned connecting apertures interconnect only respective different sets of alternately positioned conductive layers of the base board enabling improved shielding and impedance regulation and matching.

摘要翻译： 用于微处理器的PGA连接器具有多层基板组件，其具有预定厚度的交替导电和介电层，信号引脚，电流源引脚和接地引脚通过该预选厚度延伸。 信号引脚与导电层绝缘，电流和接地引脚连接到预选的导电层。 由具有相应导电衬里的孔形成的一系列连接孔在引脚之间的选定位置处延伸穿过层以互连所选择的导电层。 连接孔互连基板的所有导电层，或者在另一示例中，交替地定位的连接孔仅互连的基板的交替定位的导电层的互不相同的组合，从而能够改善屏蔽和阻抗调节和匹配。

公开(公告)号：US5499924A

公开(公告)日：1996-03-19

申请号：US273057

申请日：1994-07-11

申请人： Hiroshi Arisaka ,  Kenji Kawawada ,  Kiyoshi Omata

发明人： Hiroshi Arisaka ,  Kenji Kawawada ,  Kiyoshi Omata

IPC分类号： H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H05K3/36 ,  H05K3/40 ,  H01R23/66

CPC分类号： H01R12/57 ,  H01R12/7082 ,  H05K3/365 ,  H01R12/52 ,  H05K3/4007

摘要： Connector members have respective film circuits with contact bumps of male and female sets or other complementary configurations and are brought into electrical connection by butting engagement. An elastomer underlies the bumps and is compressed by the engagement to provide contact pressure. The contact bumps of each female set are three or four in number arranged to form a triangular or square ring for engagement with a single male bump to provide a self-centering action. The male contact bump can be elongate so as to bridge completely across the ring. In other examples, both complementary contact bumps are elongate and extend in transverse directions on respective film circuits so that they are brought into transverse engagement, accommodating slight misalignment. Alternatively, instead of a bump configuration, a female member is formed by an aperture in a insulating layer of one film circuit overlying a conductive path and receiving a contact bump of the other film circuit.

摘要翻译： 连接器构件具有各自的具有阳和阴组接触凸块或其它互补配置的薄膜电路，并且通过对接接合而被电连接。 弹性体位于凸块之下，并通过接合而被压缩以提供接触压力。 每个阴套的接触凸块的数量为三个或四个，以形成用于与单个凸形突起接合的三角形或方形环，以提供自对中动作。 阳接触凸块可以是细长的，以便完全跨越环。 在其他示例中，互补接触凸块是细长的并且在相应的薄膜电路上在横向方向上延伸，使得它们被进入横向接合，容纳轻微的未对准。 或者，代替凸起构造，阴构件由覆盖导电路径的一个膜电路的绝缘层中的孔形成，并且接收另一个膜电路的接触凸块。

公开(公告)号：US5480309A

公开(公告)日：1996-01-02

申请号：US248067

申请日：1994-05-23

申请人： Hiroshi Arisaka

发明人： Hiroshi Arisaka

IPC分类号： H01R12/58 ,  H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42 ,  H05K3/46 ,  H05K7/10 ,  H01R29/00

CPC分类号： H05K7/1084 ,  H01R12/523 ,  H05K1/0295 ,  H05K1/141 ,  H05K1/0298 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/09954 ,  H05K2201/10333 ,  H05K2201/10689 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/429

摘要： A universal laminated base board assembly for connecting an integrated circuit device to a pcb has a series of alternating, overlying, conductive and insulating layers with two of the conductive layers providing ground and current lines on respective opposite faces. A plurality of through-holes extend through the layers and insulated from the conductive layers for receiving respective socket forming body portions of contact elements selected from signal, current and grounding types with the signal contact elements remaining insulated from the conductive layers and the current and grounding types having conductive layer connecting portions bridging the insulation into connection with the current and ground layers respectively. The contact elements are inserted in those through holes which are aligned with signal, current and ground line terminal lead pins, respectively, of the particular device chosen, adapting the base board to any one of a variety of different devices. The conductive layer connecting portions may be integral with, or formed separately from, respective body portions.

摘要翻译： 用于将集成电路器件连接到pcb的通用层叠基板组件具有一系列交替的，上覆的导电绝缘层，其中两个导电层在相应的相对面上提供接地线和电流线。 多个通孔延伸穿过层并与导电层绝缘，用于接收选自信号，电流和接地类型的接触元件的相应插座形成体部分，其中信号接触元件与导电层保持绝缘，并且电流和接地 具有将绝缘体桥接到电流和接地层的导电层连接部分的类型。 接触元件插入到分别与所选择的特定装置的信号，电流和接地线端子引脚对准的那些通孔中，使基板适应各种不同的装置中的任何一种。 导电层连接部分可以与相应的主体部分成一体或分开形成。

公开(公告)号：US5102352A

公开(公告)日：1992-04-07

申请号：US641757

申请日：1991-01-17

申请人： Hiroshi Arisaka

发明人： Hiroshi Arisaka

IPC分类号： H01R33/76 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14

CPC分类号： H01R12/523 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/141

摘要： A high frequency electrical connector for an integrated circuit such as a microprocessor comprises a board assembly comprising a series of conductive and insulating layers of preselected thicknesses arranged alternately, one on top of the other, with conductive layers adjacent front and rear faces. Ground and current source pins are implanted in the layers with connecting portions for external circuitry outstanding from at least one of the faces and with conductive layer contacting portions establishing electrical connection with selected conductive layers. Ground pins connect the conductive layers adjacent the front and rear faces providing front and rear ground shield layers. The layers may be corrugated providing shielding portions extending in the direction of the pins. The thicknesses of the layers and the separation of the pins are preselected to provide pin impedances matching those of other connecting devices.

摘要翻译： 用于诸如微处理器的集成电路的高频电连接器包括板组件，该板组件包括一系列预选厚度的导电绝缘层和绝缘层，预定厚度交替布置，一个在另一个之上，导电层邻近前后面。 接地和电流源极引脚被注入到具有从至少一个表面突出的外部电路的连接部分的层中，并且与导电层接触部分建立与所选择的导电层的电连接。 接地引脚连接前后面附近的导电层，提供前后接地屏蔽层。 这些层可以是波纹形的，提供在销的方向上延伸的屏蔽部分。 预先选择层的厚度和引脚的分离以提供与其它连接装置的引脚阻抗匹配的引线阻抗。