公开(公告)号：US4091064A

公开(公告)日：1978-05-23

申请号：US689348

申请日：1976-05-24

申请人： Mitsuo Kakinuma ,  Isoji Motegi ,  Yasuo Matsui ,  Masatake Matsui ,  Masaaki Ohtsuju ,  Kiyoshi Takahashi ,  Takeo Fukuda

发明人： Mitsuo Kakinuma ,  Isoji Motegi ,  Yasuo Matsui ,  Masatake Matsui ,  Masaaki Ohtsuju ,  Kiyoshi Takahashi ,  Takeo Fukuda

IPC分类号： B29C47/00 ,  B29C47/94 ,  H01B13/14 ,  B29F3/10

CPC分类号： B29C47/0004 ,  B29C47/0016 ,  B29C47/94 ,  H01B13/145 ,  B29C47/0014 ,  B29K2101/10 ,  B29K2301/10

摘要： Electric cables insulated with a cured polyolefin and having high electrical breakdown strength are produced, in each instance, by applying, an insulating layer of polyolefin containing a curing agent onto a conductor by means of an extruder, forming and hot-curing said layer by means of a long-land die, simultaneously applying a specific forming coagent to a tapered portion of the long-land die, and cooling the resulting hot-cured insulating layer formed on the conductor in a cooling zone.

摘要翻译： 用固化的聚烯烃绝缘并且具有高的电击穿强度的电缆在每种情况下都被制造，通过使用挤出机将含有固化剂的聚烯烃的绝缘层涂覆到导体上，通过所述方法形成和热固化所述层 同时将特定的成型助剂施加到长版裸片的锥形部分，并且在冷却区中冷却形成在导体上的热固化绝缘层。

公开(公告)号：US07922918B2

公开(公告)日：2011-04-12

申请号：US11872215

申请日：2007-10-15

申请人： Yasuo Matsui ,  Shunji Araki

发明人： Yasuo Matsui ,  Shunji Araki

IPC分类号： H01B13/00

CPC分类号： H05K3/244 ,  C23C28/023 ,  C25D5/12 ,  C25D5/34 ,  H01H1/023 ,  H01H1/403 ,  H05K1/11 ,  H05K3/26 ,  H05K2203/025 ,  H05K2203/0392 ,  Y10T29/49155 ,  Y10T29/4916

摘要： There is provided a method of manufacturing a circuit board having a first fixed contact and a second fixed contact that extend substantially orthogonal to each other on the same surface, the life span required for the first fixed contact being longer than that required for the second fixed contact. The method includes: etching a copper foil formed on the entire surface of an insulating substrate to form the patterns of the first and second fixed contacts; polishing the surface of the insulating substrate with buff to remove an oxide film adhered to the copper foil; and sequentially forming a nickel layer having a thickness of about 1 to about 5 μm and a gold layer having a thickness of about 0.01 to about 0.5 μm on each of the first and second fixed contacts. In the method, the buffing direction is substantially aligned with a direction in which a first movable contact slides on the first fixed contact.

摘要翻译： 提供了一种制造电路板的方法，该电路板具有第一固定触点和第二固定触点，该第一固定触点和第二固定触点在同一表面上基本上彼此正交延伸，第一固定触点所需的寿命比第二固定触点所需的寿命长 联系。 该方法包括：蚀刻形成在绝缘基板的整个表面上的铜箔，以形成第一和第二固定触点的图案; 用抛光抛光绝缘基板的表面以去除附着在铜箔上的氧化膜; 并且在第一和第二固定触头中的每一个上依次形成厚度为约1至约5μm的镍层和厚度为约0.01至约0.5μm的金层。 在该方法中，抛光方向基本上与第一可动触头在第一固定触点上滑动的方向对准。

公开(公告)号：US07799852B2

公开(公告)日：2010-09-21

申请号：US11477524

申请日：2006-06-30

申请人： Yukihiro Kiuchi ,  Masatoshi Iji ,  Katsushi Terajima ,  Isao Katayama ,  Yasuo Matsui ,  Ken Oota

发明人： Yukihiro Kiuchi ,  Masatoshi Iji ,  Katsushi Terajima ,  Isao Katayama ,  Yasuo Matsui ,  Ken Oota

IPC分类号： C08K3/36 ,  C08L61/10 ,  C08L63/00

CPC分类号： C08L61/06 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  C08L2666/22 ,  C08L2666/14 ,  H01L2924/00

摘要： An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1≦E≦0.27 W+21.8 in the case of 30≦W

摘要翻译： 可以用作半导体封装树脂的环氧树脂组合物，其中通过适当地使固化制品的交联结构本身适当地适应而不使用任何阻燃材料，并且不特别高填充无机填料可以获得阻燃性的改善。 环氧树脂组合物包含环氧树脂（A），酚醛树脂（B），无机填料（C）和固化促进剂（D），其中240±20％C的挠曲模量E（kgf / mm2） 通过固化该组合物而得到的固化物是在30＆lt; NE; W <60的情况下满足0.015W + 4.1＆amp; NlE; E＆lt; NlE; 0.27W + 21.8的值，或满足0.30W-13＆NlE; E＆NlE; 3.7W-184 其中W（重量％）是固化物中无机填料（C）的含量，60＆lt; NlE; W＆nlE; 95。 该组合物的固化物在热分解或点火时形成发泡层以发挥阻燃性。

公开(公告)号：US4435826A

公开(公告)日：1984-03-06

申请号：US297509

申请日：1981-08-28

申请人： Yasuo Matsui

发明人： Yasuo Matsui

IPC分类号： H04L7/00 ,  H04J3/06 ,  H04L7/08

CPC分类号： H04J3/0611

摘要： A frame synchronizer for detecting synchronizing patterns inserted at leading positions of data trains, for each data, which data trains are independent for each period, by a mechanical sensor mounted on the earth observing satellite LANDSAT is disclosed. The code synchronizer comprises a PN code generator for cyclically generating a PN code, a comparator and a counter. A receiving code train including the PN code as a synchronizing signal is applied to the PN code generator and the number of times of coincidence of the output code of the PN generator and an input code is counted. When the number of times of coincidence exceeds a preset number, it is determined that the synchronization has been obtained. A probability of wrong synchronization is minimized and the loss of image on a ground station is prevented.

摘要翻译： 公开了一种帧同步器，用于通过安装在地球观测卫星LANDSAT上的机械传感器检测插入在数据列的前导位置上的同步模式，对于每个数据，哪些数据列对于每个周期是独立的。 代码同步器包括用于循环产生PN码的PN码发生器，比较器和计数器。 将包括作为同步信号的PN码的接收码串应用于PN码发生器，并计数PN发生器的输出码和输入码的一致次数。 当重合次数超过预设值时，确定已经获得了同步。 错误同步的概率被最小化，并且防止了地面站上的图像损失。

公开(公告)号：US07098276B1

公开(公告)日：2006-08-29

申请号：US09830016

申请日：1999-10-20

申请人： Yukihiro Kiuchi ,  Masatoshi Iji ,  Katsushi Terajima ,  Isao Katayama ,  Yasuo Matsui ,  Ken Oota

发明人： Yukihiro Kiuchi ,  Masatoshi Iji ,  Katsushi Terajima ,  Isao Katayama ,  Yasuo Matsui ,  Ken Oota

IPC分类号： C08K3/36 ,  C08L61/10 ,  C08L63/00

CPC分类号： C08L61/06 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  C08L2666/22 ,  C08L2666/14 ,  H01L2924/00

摘要： An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1≦E≦0.27 W+21.8 in the case of 30≦W

摘要翻译： 可以用作半导体封装树脂的环氧树脂组合物，其中通过适当地使固化制品的交联结构本身适当地适应而不使用任何阻燃材料，并且不特别高填充无机填料可以获得阻燃性的改善。 环氧树脂组合物包括环氧树脂（A），酚醛树脂（B），无机填料（C）和固化促进剂（D），其中挠曲模量E（kgf / mm 2） ）在固化组合物得到的固化制品的240±20％C下，在30 <= W <60的情况下为满足0.015W + 4.1 <= E <= 0.27W + 21.8的值，或满足0.30W 在60 <= W <= 95的情况下，-13 <= E <= 3.7W-184其中W（重量％）是固化物中无机填料（C）的含量。 该组合物的固化物在热分解或点火时形成发泡层以发挥阻燃性。

公开(公告)号：US5575501A

公开(公告)日：1996-11-19

申请号：US389807

申请日：1995-02-16

申请人： Seiichi Moriyama ,  Yasuo Matsui ,  Kiyoshi Sadakata

发明人： Seiichi Moriyama ,  Yasuo Matsui ,  Kiyoshi Sadakata

IPC分类号： B62D1/185 ,  B62D1/19 ,  F16F7/12

CPC分类号： B62D1/192 ,  F16F7/126 ,  F16C3/03

摘要： In a collapsible steering shaft a collapse load is decreased while assuring the heat resistance of a coupling portion between an outer shaft and an inner shaft. In addition, a time during which a great collapse load is needed is also decreased. Female serration grooves on an inner surface of the outer shaft are engaged with male serration grooves on an outer surface of the inner shaft. A recess is formed on the outer surface of the inner shaft and is aligned with a root in the male serration grooves, and a steel ball is set in the recess. A part of this steel ball intrudes into a top part of a thread in the female serration grooves. A flat portion is formed by removing a part of the male serration grooves, whereby the top part crushed by the steel ball can be prevented from frictionally engaging with the male serration grooves.

摘要翻译： 在可折叠的转向轴中，在确保外轴和内轴之间的联接部的耐热性的同时减小了塌陷负载。 此外，还需要大塌陷负载的时间。 在外轴的内表面上的母齿槽与内轴的外表面上的公齿槽啮合。 在内轴的外表面上形成凹部，并且与雄齿锯齿槽中的根部对准，并且将钢球设置在凹部中。 该钢球的一部分侵入到母齿槽中的螺纹的顶部。 通过去除一部分雄性锯齿沟形成平坦部分，由此可以防止由钢球破碎的顶部与雄性锯齿槽摩擦接合。

公开(公告)号：US4484042A

公开(公告)日：1984-11-20

申请号：US519684

申请日：1983-08-02

申请人： Yasuo Matsui

发明人： Yasuo Matsui

IPC分类号： H01H13/02 ,  H01H13/12 ,  H01H13/38 ,  H01H5/04

CPC分类号： H01H13/38 ,  H01H13/02

摘要： A push-button switch affording a clear click feeling, comprising a contact plate which is curved in one direction and which is formed into a movable contact by providing therein two substantially parallel slits extending in a perimetric direction, forming a movable contact portion between said two slits, and curving both side edges of said contact plate along said slits oppositely to the direction of the curvature of said movable contact portion so as to form normally-contacted contact portion; a switch body which includes first stationary contacts and a second stationary contact; and a push button; said normally-contacted contact portions of said contact plate being normally held in electrical contact with said first stationary contacts of said switch body, while said movable contact portion of said contact plate is depressed and deformed oppositely to the direction of the curvature thereof by said push button, thereby to come into electrical contact with said second stationary contact of said switch body; said contact plate including both-end joint portions which join said movable contact portion and said normally-contacted contact portions integrally, a pair of bent line portions being formed between said each joint portion and said normally-contacted contact portions, said each bent line portion defining an acute angle with respect to the slit.

摘要翻译： 一种提供清晰咔嗒感的按钮开关，包括：在一个方向上弯曲的接触板，并且通过在其中提供沿周向延伸的两个基本上平行的狭缝形成可动触点，在所述两个之间形成可动接触部分 使所述接触板的两侧缘沿着与所述可动接触部的曲率方向相反的所述狭缝弯曲，从而形成正常接触的接触部分; 开关主体，其包括第一固定触点和第二固定触点; 和按钮; 所述接触板的所述常触点接触部分通常与所述开关体的所述第一固定触点保持电接触，同时所述接触板的所述可动接触部分通过所述推动与其曲率方向相反地相对地变形 从而与所述开关体的所述第二固定触点电接触; 所述接触板包括一体地连接所述可动接触部分和所述常接触接触部分的两端连接部分，一对弯曲线部分形成在所述每个接合部分和所述常接触部分之间，所述每个弯曲线部分 限定相对于狭缝的锐角。

公开(公告)号：US20080093335A1

公开(公告)日：2008-04-24

申请号：US11872215

申请日：2007-10-15

申请人： Yasuo Matsui ,  Shunji Araki

发明人： Yasuo Matsui ,  Shunji Araki

IPC分类号： H01B13/00

CPC分类号： H05K3/244 ,  C23C28/023 ,  C25D5/12 ,  C25D5/34 ,  H01H1/023 ,  H01H1/403 ,  H05K1/11 ,  H05K3/26 ,  H05K2203/025 ,  H05K2203/0392 ,  Y10T29/49155 ,  Y10T29/4916

摘要： There is provided a method of manufacturing a circuit board having a first fixed contact and a second fixed contact that extend substantially orthogonal to each other on the same surface, the life span required for the first fixed contact being longer than that required for the second fixed contact. The method includes: etching a copper foil formed on the entire surface of an insulating substrate to form the patterns of the first and second fixed contacts; polishing the surface of the insulating substrate with buff to remove an oxide film adhered to the copper foil; and sequentially forming a nickel layer having a thickness of about 1 to about 5 μm and a gold layer having a thickness of about 0.01 to about 0.5 μm on each of the first and second fixed contacts. In the method, the buffing direction is substantially aligned with a direction in which a first movable contact slides on the first fixed contact.

摘要翻译： 提供了一种制造电路板的方法，该电路板具有第一固定触点和第二固定触点，该第一固定触点和第二固定触点在同一表面上基本上彼此正交延伸，第一固定触点所需的寿命比第二固定触点所需的寿命长 联系。 该方法包括：蚀刻形成在绝缘基板的整个表面上的铜箔，以形成第一和第二固定触点的图案; 用抛光抛光绝缘基板的表面以去除附着在铜箔上的氧化膜; 并且在第一和第二固定触头的每一个上依次形成厚度约1至约5μm的镍层和厚度约0.01至约0.5μm的金层。 在该方法中，抛光方向基本上与第一可动触头在第一固定触点上滑动的方向对准。

公开(公告)号：US20060247393A1

公开(公告)日：2006-11-02

申请号：US11477524

申请日：2006-06-30

申请人： Yukihiro Kiuichi ,  Masatoshi Iji ,  Katsushi Terajima ,  Isao Katayama ,  Yasuo Matsui ,  Ken Oota

发明人： Yukihiro Kiuichi ,  Masatoshi Iji ,  Katsushi Terajima ,  Isao Katayama ,  Yasuo Matsui ,  Ken Oota

IPC分类号： C08L63/00

CPC分类号： C08L61/06 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  C08L2666/22 ,  C08L2666/14 ,  H01L2924/00

摘要： An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1≦E≦0.27 W+21.8 in the case of 30≦W

摘要翻译： 可以用作半导体封装树脂的环氧树脂组合物，其中通过适当地使固化制品的交联结构本身适当地适应而不使用任何阻燃材料，并且不特别高填充无机填料可以获得阻燃性的改善。 环氧树脂组合物包括环氧树脂（A），酚醛树脂（B），无机填料（C）和固化促进剂（D），其中挠曲模量E（kgf / mm 2） ）在固化组合物得到的固化制品的240±20％C下，在30 <= W <60的情况下为满足0.015W + 4.1 <= E <= 0.27W + 21.8的值，或满足0.30W 在60 <= W <= 95的情况下，-13 <= E <= 3.7W-184其中W（重量％）是固化物中无机填料（C）的含量。 该组合物的固化物在热分解或点火时形成发泡层以发挥阻燃性。