摘要:
A urethane foam for shoe soles prepared by reacting a compound having at least two isocyanate-reactive hydrogen atoms and a molecular weight of 400 to 10000 with a polyisocyanate in the presence of a foam stabilizer, water and a catalyst, characterized in that the ratio r.sub.1 /r.sub.2 of a mean skill cell diameter r.sub.1 to a mean core cell diameter r.sub.2 is 0.02 to 0.80, wherein the mean skin cell diameter r.sub.1 is defined as the mean diameter of the cells which form the skin portion of a urethane foam extending from the surface to a depth of 5% of the foam thickness and the mean core cell diameter r.sub.2 is defined as the mean diameter of the cells which form the core portion of a urethane foam extending from a depth of 40% to a depth of 60% of the foam thickness.
摘要:
A polyester-polyol prepared by polycondensation of an acid component comprising terephthalic acid and adipic acid, and a polyhydric alcohol component, wherein the molar ratio of the terephthalic acid/adipic acid is 0.05 to 0.3; a process for preparing a polyurethane foam comprising reacting a polyisocyanate component and a polyol component, wherein the polyol component contains the above polyester-polyol; and a process for preparing a polyurethane foam comprising reacting an isocyanate prepolymer made of a polyisocyanate component and a polyol component (I) with a polyol component (II), wherein the polyol component (I) comprises the above polyester-polyol.
摘要:
The plastic polarized lens (10) of the present invention contains a polarized film (12) and layers (resin layers) (14a and 14b) comprising a thiourethane-based resin stacked over both surfaces of the polarized film (12), and the polarized film contains an organic coloring compound represented by the following general formula (1).
摘要:
To provide a semiconductor wafer surface protection sheet having good adhesion to irregularities on a patterned surface of a semiconductor wafer and having good peelability after wafer grinding. Specifically, a semiconductor wafer surface protection sheet is provided that includes a base layer having a tensile elasticity at 25° C., E(25), of 1 GPa or more; a resin layer A that satisfies the condition EA(60)/EA(25)
摘要:
There is provided an optical disc recording/reproducing apparatus which can reduce the chip size using the high-miniaturization process and can enhance the detection accuracy. A signal which is obtained by amplitude-adjusting a header region in a reproduced signal detected by an optical pickup (1) is digitized, and peak detection or bottom detection from the reproduced signal in each of a first section and a second section in the header region is performed by detection circuits (9) to (12), respectively. Then, amplitude data in the first section and the second section are obtained by subtracters (13) and (14) from the detected values in the respective detection circuits. A difference in amplitude between the first section and the second section in the header region is obtained by a subtracter (15) based on the amplitude data, and the amplitude difference is outputted as an off-track error signal. The respective detection circuits (9) to (12) perform detection operations in the first and second sections, and hold the detection operations in the sections other than the first and second sections.
摘要:
There is provided an optical disc recording/reproducing apparatus which can reduce the chip size using the high-miniaturization process and can enhance the detection accuracy. A signal which is obtained by amplitude-adjusting a header region in a reproduced signal detected by an optical pickup (1) is digitized, and peak detection or bottom detection from the reproduced signal in each of a first section and a second section in the header region is performed by detection circuits (9) to (12), respectively. Then, amplitude data in the first section and the second section are obtained by subtracters (13) and (14) from the detected values in the respective detection circuits. A difference in amplitude between the first section and the second section in the header region is obtained by a subtracter (15) based on the amplitude data, and the amplitude difference is outputted as an off-track error signal. The respective detection circuits (9) to (12) perform detection operations in the first and second sections, and hold the detection operations in the sections other than the first and second sections.
摘要:
The present invention relates to an extremely effective anti-allergic agent with a low toxicity, which possesses as its active ingredient a benzopyran derivative described by the general formula below (in the formula, R.sup.1 and R.sup.2 are each respectively a hydrogen atom, an acyl group, an alkyl group having 1.about.12 carbon atoms, or an alkenyl group having 2.about.10 carbon atoms; and R.sup.3 is a hydroxyl group, an acyloxy group, an alkoxy group having 1.about.10 carbon atoms, or an alkenyloxy group having 2.about.10 carbon atoms).General Formula ##STR1##
摘要:
The purpose of the present invention is to provide an electrostatically bonded vesicle which bears disulfide bonds or thiol groups. The present invention relates to a vesicle having a membrane which is formed from both a first polymer of (a) or (b) and a second polymer of (c) or (d) (with the proviso that a combination of (b) and (d) is excepted) and in which the cationic segment and anionic segment of the polymers are partially crosslinked. First polymer: (a) a block copolymer (I) having both an electrically non-charged hydrophilic segment and a cationic segment, (b) an amino acid polymer (I) having a cationic segment. Second polymer: (c) a block copolymer (II) having both an electrically non-charged hydrophilic segment and an anionic segment, (d) an amino acid polymer (II) having an anionic segment.
摘要:
To provide an olefinic expandable substrate and a dicing film that exhibits less contamination characteristics, high expandability without necking, which cannot be achieved by conventional olefinic expandable substrates. In order to achieve the object, an expandable film comprises a 1-butene-α-olefin copolymer (A) having a tensile modulus at 23° C. of 100 to 500 MPa and a propylenic elastomer composition (B) comprising a propylene-α-olefin copolymer (b1) and having a tensile modulus at 23° C. of 10 to 50 MPa, wherein the amount of the component (B) is 30 to 70 weight parts relative to 100 weight parts in total of components (A) and (B).
摘要:
To provide a semiconductor wafer surface protection sheet having good adhesion to irregularities on a patterned surface of a semiconductor wafer and having good peelability after wafer grinding. Specifically, a semiconductor wafer surface protection sheet is provided that includes a base layer having a tensile elasticity at 25 C°, E(25), of 1 GPa or more; a resin layer A that satisfies the condition EA(60)/EA(25)