公开(公告)号：US09478503B2

公开(公告)日：2016-10-25

申请号：US14389103

申请日：2013-02-28

申请人： Mitsutoshi Makihata ,  Masayoshi Esashi ,  Shuji Tanaka ,  Masanori Muroyama ,  Hirofumi Funabashi ,  Yutaka Nonomura ,  Yoshiyuki Hata ,  Hitoshi Yamada ,  Takahiro Nakayama ,  Ui Yamaguchi

发明人： Mitsutoshi Makihata ,  Masayoshi Esashi ,  Shuji Tanaka ,  Masanori Muroyama ,  Hirofumi Funabashi ,  Yutaka Nonomura ,  Yoshiyuki Hata ,  Hitoshi Yamada ,  Takahiro Nakayama ,  Ui Yamaguchi

IPC分类号： H01L23/552 ,  H01L23/538 ,  B81B7/00 ,  H01L21/78 ,  H01L21/683 ,  H01L21/306 ,  H01L25/18 ,  H01L27/06 ,  H01L25/07 ,  H01L25/16 ,  B81C1/00 ,  H01L25/00 ,  H01L29/06

CPC分类号： H01L23/552 ,  B81B7/008 ,  B81C1/00238 ,  B81C2203/0792 ,  H01L21/3043 ,  H01L21/30625 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/5386 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L27/0611 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2224/03

摘要： An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.

摘要翻译： 提供了具有高绝缘公差的集成器件。 在相邻的装置之间设有具有倾斜侧面的凹槽。 当安装电子电路或MEMS装置的一侧是前表面时，由于倾斜表面，凹槽从前表面变窄到后表面。 模具材料（绝缘材料）设置在凹槽内，使得多个装置机械地接合在一起，彼此电绝缘。 形成相邻器件之间形成电导通的线构件沿着沟槽的侧表面和底表面。 为了将线导出到背面，凹槽的底表面具有孔，使得线构件从孔的背面露出。

公开(公告)号：US09215089B2

公开(公告)日：2015-12-15

申请号：US13502078

申请日：2009-10-14

申请人： Masanori Muroyama ,  Masayoshi Esashi ,  Shuji Tanaka ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

发明人： Masanori Muroyama ,  Masayoshi Esashi ,  Shuji Tanaka ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

IPC分类号： G06F13/00 ,  H04L12/40 ,  G01L1/14 ,  G01L5/22 ,  G06F13/376

CPC分类号： H04L12/40032 ,  G01L1/142 ,  G01L1/146 ,  G01L5/228 ,  G06F13/376 ,  H04L12/40013

摘要： A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.

摘要翻译： 触摸传感器系统包括总线，布置在总线上的多个触摸传感器装置，以及连接到所有总线并且集成来自触摸传感器装置的信息的信息集成装置。 触摸传感器装置包括传感器单元和信号处理单元，该单元通过总线将通过处理模拟传感器信号而产生的传感器数据信号发送到信息集成装置。 信号处理单元包括：数字转换单元，当传感器值超过预设阈值时给出信号处理开始许可的阈值评估单元;将传感器信号加上发射机标识号的ID添加单元，以及数据 发送单元，其将传感器数据信号输出到总线的信号线。 快速响应是可能的，而不增加数据量和主机处理负载，同时包括许多触摸传感器元件。

公开(公告)号：US08823114B2

公开(公告)日：2014-09-02

申请号：US13502083

申请日：2010-10-13

申请人： Shuji Tanaka ,  Masayoshi Esashi ,  Masanori Muroyama ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

发明人： Shuji Tanaka ,  Masayoshi Esashi ,  Masanori Muroyama ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

IPC分类号： H01L29/84 ,  H01L23/48 ,  G01L5/22 ,  G01L1/14 ,  B81C1/00 ,  H01L23/00 ,  H01L23/10

CPC分类号： B81C1/00238 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2201/019 ,  B81C2203/032 ,  B81C2203/0792 ,  G01L1/146 ,  G01L1/148 ,  G01L5/228 ,  H01L23/10 ,  H01L24/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/94 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00

摘要： Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.

摘要翻译： 提供了一种用于封装具有接触感测表面的传感器结构和处理传感器信号的信号处理LSI的技术。 传感器结构具有接触感应表面和传感器电极。 信号处理集成电路嵌入在半导体衬底中。 传感器结构和半导体衬底通过接合层粘接，形成传感器装置作为单个芯片。 传感器电极和集成电路密封在传感器装置的内部，并且集成电路的传感器电极和外部端子通过半导体衬底的侧表面被引出到半导体衬底的背面。

公开(公告)号：US08613231B2

公开(公告)日：2013-12-24

申请号：US13502082

申请日：2009-10-14

申请人： Masanori Muroyama ,  Masayoshi Esashi ,  Shuji Tanaka ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Hitoshi Yamada ,  Ui Yamaguchi

发明人： Masanori Muroyama ,  Masayoshi Esashi ,  Shuji Tanaka ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Hitoshi Yamada ,  Ui Yamaguchi

IPC分类号： G01D7/00 ,  G01L3/00 ,  G01L3/22

CPC分类号： G01L5/228 ,  G01L1/142 ,  G01L1/144 ,  G01L1/146 ,  G06F3/0414

摘要： Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion.

摘要翻译： 提供能够检测法向应力的多个法向应力检测传感器单元和片层部。 片层部分包括外部片层部分，包含法向应力检测单元的力检测片层部分和夹在外片层部分和力检测片层部分之间的中间层。 外层片部分和力检测片层部分包括在彼此相对的方向上突出的多个突起，并且被布置成使得突起彼此接合，并且介于其间的中间层。 每个法向应力检测传感器单元包括设置在力检测片部分上的突起的中心部分正下方的中心部分检测传感器装置，以及至少两个边缘检测传感器装置， 检测片部分。

公开(公告)号：US08336399B2

公开(公告)日：2012-12-25

申请号：US12903673

申请日：2010-10-13

申请人： Masanori Muroyama ,  Masayoshi Esashi ,  Shuji Tanaka ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

发明人： Masanori Muroyama ,  Masayoshi Esashi ,  Shuji Tanaka ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

IPC分类号： G01D7/00

CPC分类号： B25J13/084 ,  G01L1/146 ,  G01L5/228 ,  H01L24/32 ,  H01L2224/32221 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00

摘要： A sensor system includes a first sensing device that includes a sensor, and first and second surrounding portions that surround the sensor at least partially, a second sensing device that comprises a sensor, and first and second surrounding portions that surround the sensor at least partially, wherein at least one of a combination of shapes of the first and second surrounding portions of the respective first and second sensing devices and a combination of physical properties of the first and second surrounding portions of the respective first and second sensing devices is configured such that a detection characteristic of the first sensing device is different from a detection characteristic of the second sensing device.

摘要翻译： 传感器系统包括第一感测装置，其包括传感器，以及至少部分围绕传感器的第一和第二环绕部分，包括传感器的第二感测装置，以及至少部分围绕传感器的第一和第二环绕部分， 其中相应的第一和第二感测装置的第一和第二围绕部分的形状的组合中的至少一个以及相应的第一和第二感测装置的第一和第二包围部分的物理特性的组合被构造成使得 第一感测装置的检测特性与第二感测装置的检测特性不同。

公开(公告)号：US20120254490A1

公开(公告)日：2012-10-04

申请号：US13502078

申请日：2009-10-14

申请人： Masanori Muroyama ,  Masayoshi Esashi ,  Shuji Tanaka ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

发明人： Masanori Muroyama ,  Masayoshi Esashi ,  Shuji Tanaka ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

IPC分类号： G06F13/00

CPC分类号： H04L12/40032 ,  G01L1/142 ,  G01L1/146 ,  G01L5/228 ,  G06F13/376 ,  H04L12/40013

摘要： A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.

摘要翻译： 触摸传感器系统包括总线，布置在总线上的多个触摸传感器装置，以及连接到所有总线并且集成来自触摸传感器装置的信息的信息集成装置。 触摸传感器装置包括传感器单元和信号处理单元，该单元通过总线将通过处理模拟传感器信号而产生的传感器数据信号发送到信息集成装置。 信号处理单元包括：数字转换单元，当传感器值超过预设阈值时给出信号处理开始许可的阈值评估单元;将传感器信号加上发射机标识号的ID添加单元，以及数据 发送单元，其将传感器数据信号输出到总线的信号线。 快速响应是可能的，而不增加数据量和主机处理负载，同时包括许多触摸传感器元件。

公开(公告)号：US20120247226A1

公开(公告)日：2012-10-04

申请号：US13502082

申请日：2009-10-14

申请人： Masanori Muroyama ,  Masayoshi Esashi ,  Shuji Tanaka ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Hitoshi Yamada ,  Ui Yamaguchi

发明人： Masanori Muroyama ,  Masayoshi Esashi ,  Shuji Tanaka ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Hitoshi Yamada ,  Ui Yamaguchi

IPC分类号： G01L1/00

CPC分类号： G01L5/228 ,  G01L1/142 ,  G01L1/144 ,  G01L1/146 ,  G06F3/0414

摘要： Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion.

摘要翻译： 提供能够检测法向应力的多个法向应力检测传感器单元和片层部。 片层部分包括外部片层部分，包含法向应力检测单元的力检测片层部分和夹在外片层部分和力检测片层部分之间的中间层。 外层片部分和力检测片层部分包括在彼此相对的方向上突出的多个突起，并且被布置成使得突起彼此接合，并且介于其间的中间层。 每个法向应力检测传感器单元包括设置在力检测片部分上的突起的中心部分正下方的中心部分检测传感器装置，以及至少两个边缘检测传感器装置， 检测片部分。

公开(公告)号：US20120199921A1

公开(公告)日：2012-08-09

申请号：US13502083

申请日：2010-10-13

申请人： Shuji Tanaka ,  Masayoshi Esashi ,  Masanori Muroyama ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

发明人： Shuji Tanaka ,  Masayoshi Esashi ,  Masanori Muroyama ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： B81C1/00238 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2201/019 ,  B81C2203/032 ,  B81C2203/0792 ,  G01L1/146 ,  G01L1/148 ,  G01L5/228 ,  H01L23/10 ,  H01L24/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/94 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00

摘要： Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.

摘要翻译： 提供了一种用于封装具有接触感测表面的传感器结构和处理传感器信号的信号处理LSI的技术。 传感器结构具有接触感应表面和传感器电极。 信号处理集成电路嵌入在半导体衬底中。 传感器结构和半导体衬底通过接合层粘接，形成传感器装置作为单个芯片。 传感器电极和集成电路密封在传感器装置的内部，并且集成电路的传感器电极和外部端子通过半导体衬底的侧表面被引出到半导体衬底的背面。

公开(公告)号：US08698315B2

公开(公告)日：2014-04-15

申请号：US13596859

申请日：2012-08-28

申请人： Yoshiyuki Hata ,  Yutaka Nonomura ,  Teruhisa Akashi ,  Hirofumi Funabashi ,  Motohiro Fujiyoshi ,  Yoshiteru Omura

发明人： Yoshiyuki Hata ,  Yutaka Nonomura ,  Teruhisa Akashi ,  Hirofumi Funabashi ,  Motohiro Fujiyoshi ,  Yoshiteru Omura

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： B81C1/00825 ,  B81B2201/0235 ,  B81B2203/033 ,  B81B2203/0392 ,  G01C19/5762 ,  G01C19/5769 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/084

摘要： When forming a trench of a narrow width in a thick semiconductor layer, a trench can be formed without the occurrence of semiconductor residue. In this Specification, a semiconductor device in which a trench is formed in a semiconductor layer is disclosed. In the semiconductor layer of the semiconductor device, a compensation pattern which compensates for sudden changes in the width of the trench is formed at a place at which the width of the trench changes suddenly. In the semiconductor layer of the above-described semiconductor device, since a compensation pattern is formed at a place at which the trench width changes suddenly, in the case where forming the trench using a deep RIE method, the occurrence of steep inclined portions arising from semiconductor residue can be prevented. Consequently, when forming a trench of a narrow width in a thick semiconductor layer, the occurrence of semiconductor residue can be prevented.

摘要翻译： 当在厚半导体层中形成窄宽度的沟槽时，可以形成沟槽而不会发生半导体残渣。 在本说明书中，公开了在半导体层中形成沟槽的半导体器件。 在半导体器件的半导体层中，在沟槽宽度急剧变化的地方形成补偿沟槽宽度突然变化的补偿图案。 在上述半导体器件的半导体层中，由于在沟槽宽度突然变化的地方形成补偿图案，所以在使用深RIE法形成沟槽的情况下，由于 可以防止半导体残渣。 因此，当在厚半导体层中形成窄宽度的沟槽时，可以防止发生半导体残渣。

公开(公告)号：US08707784B2

公开(公告)日：2014-04-29

申请号：US13047274

申请日：2011-03-14

申请人： Teruhisa Akashi ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Hirofumi Funabashi ,  Yoshiyuki Hata ,  Yoshiteru Omura

发明人： Teruhisa Akashi ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Hirofumi Funabashi ,  Yoshiyuki Hata ,  Yoshiteru Omura

IPC分类号： G01C19/56

CPC分类号： G01C19/574 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/082

摘要： A structure having a first movable portion displaced perpendicular to a substrate surface and a second movable portion displaced parallel to the substrate surface is realized by a laminated structure employing a nested structure for the first portion and the second portion. The laminated structure is provided with inner and outer movable portions. A y spring is connected to the outer portion, and the outer portion is supported in a y-axis direction by the y spring at a height apart from an outer substrate. A z spring is connected to the inner portion, and the inner portion is supported in a z-axis direction by the z spring at a height apart from the outer substrate. The outer portion and the z spring are at different heights from the substrate, and the z spring overpasses across the outer portion at a height apart from the outer movable portion.

摘要翻译： 具有垂直于基板表面移动的第一可移动部分和平行于基板表面移动的第二可移动部分的结构通过采用用于第一部分和第二部分的嵌套结构的层压结构实现。 层叠结构设置有内部和外部可移动部分。 y弹簧连接到外部，并且外部部分通过y弹簧以与外部基板隔开的高度在y轴方向上支撑。 z弹簧连接到内部，并且内部通过z弹簧以与外基板隔开的高度在z轴方向上支撑。 外部部分和z弹簧与基板处于不同的高度，并且z弹簧在与外部可移动部分分开的高度处超过外部部分。