摘要:
A test signal applied to an embedded memory is changed in synchronization with a test clock signal, set to an invalidated state by an asynchronous control signal asynchronous to the test clock signal and then is applied to a memory. The memory takes in a received signal in synchronization with a memory clock signal. An invalid data generating circuit modifies the test signal in accordance with the asynchronous control signal and generates a test signal and to apply the test signal to the memory. A period of an invalid state of the modified test signal can be adjusted and therefore, by monitoring a changing timing of the asynchronous control signal PTX with an external tester, setup and hold times of a signal for the memory can be measured. Setup and hold times and an access time for an embedded memory can be correctly measured.
摘要:
Internal read out data bits are divided into a plurality of data groups, and data bits in corresponding positions in different data groups are paired off. A determination gate is provided to each pair of data bits, and determining operation is performed in each pair to compress the result of determination to finally generate a 1-bit flag indicating a match/mismatch in logic level among the internal read out data. Consequently, a multi-bit test circuit that has a reduced layout area and can perform high-speed multi-bit determination is provided.
摘要:
Signals outputted from an I/O buffer with a parallel drive configuration are stabilized for reliability enhancement. Each I/O cell has a complementary I/O cell that outputs one output signal as a complementary signal made up of a non-inverted signal and an inverted signal. Two I/O cells are coupled in parallel. Output portions of first inverters are coupled together through a first wiring; and output portions of second inverters are coupled together through a second wiring. The first wiring is formed on the lower side of the I/O cells so that it is astride the two I/O cells, and the second wiring is formed above the first wiring so that it is astride the two I/O cells. The wirings are laid out so that the wiring length of the first wiring and the wiring length of the second wiring are substantially equal to each other.
摘要:
A power supply circuit and an oscillation circuit or the like of noise generation sources are concentrated, and the periphery thereof is surrounded by a guard ring. Guard ring is provided to have bonding pads at least partially thereon. Guard ring is effectively provided utilizing the region below bonding pads, so that effective noise reduction is achieved while preventing increase in chip area.
摘要:
A voltage generation circuit includes a voltage comparing circuit to compare a reference voltage signal Vi and an internal power supply voltage Vcc and a current supply transistor to supply current based on the output voltage of the voltage comparing circuit and maintain Vcc. The voltage generation circuit also includes a reference voltage signal generation circuit which responds to a control signal ACT activated for a prescribed time period prior to the operation timing of a load and sets Vi=Vref when control signal ACT is inactive and Vi=Vref+.DELTA.V when control signal ACT is active.
摘要翻译:电压产生电路包括用于比较参考电压信号Vi和内部电源电压Vcc的电压比较电路和电流源晶体管,以基于电压比较电路的输出电压提供电流并维持Vcc。 电压产生电路还包括参考电压信号产生电路,其响应于在负载的操作定时之前的规定时间段内激活的控制信号ACT,并且当控制信号ACT无效时设置Vi = Vref,并且Vi = Vref + DELTA V 当控制信号ACT有效时。
摘要:
A semiconductor device having amplifying circuits provided near corresponding bonding pads receiving external signals, and positioned between the bonding pads and internal circuits to which such external signals are to be applied. The device includes a control signal generating circuit for the amplifying circuits which is not provided in conventional semiconductor devices. In response to external control signals, the control signal generating circuit generates internal control signals for controlling electric paths between a power supply and ground in the amplifying circuits. During the standby period of the semiconductor device, the paths between the power supply and ground are cut regardless of the potential of the corresponding bonding pads, preventing flow of a through current.
摘要:
A semiconductor integrated circuit device in which circuit functions can be remedied or changed by severing at least a portion of a circuit pattern and a method for producing such semiconductor integrated circuit device. The circuit pattern is formed on the semiconductor substrate. A field shield plate is formed on the major surface of the semiconductor substrate for electrically separating respective elements constituting the circuit. The circuit pattern includes a fuse element. The fuse element is provided on the field shield plate. The portion of the field shield plate lying directly below the fuse element is isolated from other portions of the field shield plate. In such semiconductor integrated circuit device, the portion of the field shield plate lying directly below the fuse element is separated from other portions of the field shield plate, so that short-circuiting between the semiconductor substrate and the field shield plate cannot occur even when the laser beam is irradiated with a laser beam deviation at the time of severing of the fuse element.
摘要:
A memory cell circuit of an associative memory composed of only four NMOS transistors is disclosed. Each memory cells of the circuit is connected two bit lines, a word line, a match setup line for commanding coincidence detection, and a match line for transferring the results of detection. The data signals are stored in the gate capacity of each of the transistors 3. This simplified memory cell circuit contributes to higher integration of the associative memory.
摘要:
Regular memory cell arrays are arranged in divided regions in three rows and three columns except for the region located at the second row and the second column. The region located at the intersection of the second row and the second column is provided with a redundant memory cell array. The replacement operation of the regular memory cell arrays with the redundant memory cell array is provided for each memory cell block.
摘要:
In a semiconductor device, a connection conductive layer is formed by patterning on a p-type semiconductor substrate. A silicon nitride film is formed on the connection conductive layer with an insulating layer. A silicon oxide film is formed on the silicon nitride film. The silicon oxide film is provided with a hole. The silicon nitride film is exposed at a bottom of the hole. The hole is located immediately above the connection conductive layer. Thereby, a thickness of the insulating layer on a fuse element which can be blown can be controlled easily in the semiconductor device.