摘要:
A control circuit portion which controls the operations of memory cells is concentrated in a central portion and heat radiation plates are placed thereon via adhesive. A semiconductor integrated circuit having a function of the MPU or the like is placed above the control circuit portion via a bump electrode. The control circuit portion and a memory block are formed on separate chips respectively.
摘要:
Regular memory cell arrays are arranged in divided regions in three rows and three columns except for the region located at the second row and the second column. The region located at the intersection of the second row and the second column is provided with a redundant memory cell array. The replacement operation of the regular memory cell arrays with the redundant memory cell array is provided for each memory cell block.
摘要:
A power supply circuit and an oscillation circuit or the like of noise generation sources are concentrated, and the periphery thereof is surrounded by a guard ring. Guard ring is provided to have bonding pads at least partially thereon. Guard ring is effectively provided utilizing the region below bonding pads, so that effective noise reduction is achieved while preventing increase in chip area.
摘要:
A master control circuit provides access to a corresponding memory block via four local control circuits. The memory blocks are arranged so as to surround the master control circuit and the local control circuits. The amount of delay of a control signal to each memory block is set substantially equal to suppress skew in the control signal. A DRAM of high speed can be realized.
摘要:
A master control circuit provides access to a corresponding memory block via four local control circuits. The memory blocks are arranged so as to surround the master control circuit and the local control circuits. The amount of delay of a control signal to each memory block is set substantially equal to suppress skew in the control signal. A DRAM of high speed can be realized.
摘要:
A rectangular semiconductor substrate region is divided into regions arranged in a plurality of rows and columns, and memory array blocks are provided to surround a central region. The plurality of memory array blocks are divided into a plurality of banks. Peripheral regions on both sides of the rectangular semiconductor substrate region are used as regions for providing sense amplifier power supply circuits, and circuits for generating a voltage to be transmitted onto word lines are provided at the four corner regions of the central region. Thus, a large storage capacity semiconductor memory device operating stably at a high speed and with reduced power consumption can be implemented.
摘要:
A conductor line is placed at a layer overlying an input protection circuit electrically coupled to a pad such that the conductor line covers at least a part of the input protection circuit. The conductor line having a sufficiently large width disperses and absorbs the heat generated from the input protection circuit. Since the input protection circuit and the conductor line have a region overlapping with each other in the layout of plan view, an area for layout of the input protection circuit on a chip can be reduced effectively, and prevention of a destruction of the protection circuit due to the heat as well as an improvement of a resistance to the surge can be obtained.
摘要:
The present invention aims at providing a semiconductor memory device that can be manufactured by a MOS process and can realize a stable operation. A storage transistor has impurity diffusion regions, a channel formation region, a charge accumulation node, a gate oxide film, and a gate electrode. The gate electrode is connected to a gate line and the impurity diffusion region is connected to a source line. The storage transistor creates a state where holes are accumulated in the charge accumulation node and a state where the holes are not accumulated in the charge accumulation node to thereby store data “1” and data “0”, respectively. An access transistor has impurity diffusion regions, a channel formation region, a gate oxide film, and a gate electrode. The impurity diffusion region is connected to a bit line.
摘要:
The present invention aims at providing a semiconductor memory device that can be manufactured by a MOS process and can realize a stable operation. A storage transistor has impurity diffusion regions, a channel formation region, a charge accumulation node, a gate oxide film, and a gate electrode. The gate electrode is connected to a gate line and the impurity diffusion region is connected to a source line. The storage transistor creates a state where holes are accumulated in the charge accumulation node and a state where the holes are not accumulated in the charge accumulation node to thereby store data “1” and data “0”, respectively. An access transistor has impurity diffusion regions, a channel formation region, a gate oxide film, and a gate electrode. The impurity diffusion region is connected to a bit line.
摘要:
When data “1” is stored in a memory cell, a bit line is driven to an H level (control line drive potential) and the other bit line is driven to an L level (reference potential) when a sense operation is completed. When a verify write operation is initiated, a charge line is driven from an H level (power supply potential) to an L level (reference potential). By the GIDL current from a source line, accumulation of holes is initiated again for a storage node subsequent to discharge of holes, whereby the potential of the storage node rises towards an H level (period α). When the charge line is driven to an H level from an L level, the potential of the storage node further rises (period β).