公开(公告)号：USRE38588E1

公开(公告)日：2004-09-14

申请号：US10218559

申请日：2002-08-14

申请人： Morimasa Tanimoto ,  Satoshi Suzuki ,  Akira Matsuda ,  Kinya Sugie

发明人： Morimasa Tanimoto ,  Satoshi Suzuki ,  Akira Matsuda ,  Kinya Sugie

IPC分类号： H01L2348

CPC分类号： H01L23/49582 ,  B32B15/01 ,  C22C13/00 ,  C22C13/02 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A lead material for an electronic part having no adverse effect on the environment, having excellent solderability, desirable welding strength during welding and a low degree of nonuniform thickness of the plated layer during reflow processing. The lead material has a first plated layer and a second plated layer, both of which do not contain Pb, laminated on the surface of a conductive substrate in such order. The melting point of the second plated layer is lower than that of the first plated layer. The first and second plated layers are made of a Sn substance and a Sn alloy, respectively or vice versa.

公开(公告)号：US6110608A

公开(公告)日：2000-08-29

申请号：US987318

申请日：1997-12-09

申请人： Morimasa Tanimoto ,  Satoshi Suzuki ,  Akira Matsuda ,  Kinya Sugie

发明人： Morimasa Tanimoto ,  Satoshi Suzuki ,  Akira Matsuda ,  Kinya Sugie

IPC分类号： B32B15/01 ,  C22C13/00 ,  C22C13/02 ,  H01L23/48 ,  H01L23/495 ,  H01V23/48

CPC分类号： H01L23/49582 ,  B32B15/01 ,  C22C13/00 ,  C22C13/02 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T428/12708 ,  Y10T428/12715

摘要： A lead material for an electronic part having no adverse effect on the environment, having excellent solderability, desirable welding strength during welding and a low degree of nonuniform thickness of the plated layer during reflow processing. The lead material has a first plated layer and a second plated layer, both of which do not contain Pb, laminated on the surface of a conductive substrate in such order. The melting point of the second plated layer is lower than that of the first plated layer. The first and second plated layers are made of a Sn substance and a Sn alloy, respectively or vice versa.

摘要翻译： 用于电子部件的铅材料，对环境没有不利影响，具有优异的可焊性，焊接期间所需的焊接强度和回流处理期间镀层厚度不均匀。 引线材料具有第一镀层和第二镀层，它们都不含Pb，按顺序层压在导电衬底的表面上。 第二镀层的熔点低于第一镀层的熔点。 第一和第二镀层分别由Sn物质和Sn合金制成，反之亦然。

公开(公告)号：US06770383B2

公开(公告)日：2004-08-03

申请号：US10247319

申请日：2002-09-18

申请人： Hitoshi Tanaka ,  Akira Matsuda ,  Satoshi Suzuki ,  Morimasa Tanimoto

发明人： Hitoshi Tanaka ,  Akira Matsuda ,  Satoshi Suzuki ,  Morimasa Tanimoto

IPC分类号： H01R1303

CPC分类号： B32B15/01 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  C23C28/028 ,  H01R13/03 ,  Y10S428/929 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722

摘要： To provide a plated material having both high heat-resistance and good insertability/extractability. The plated material comprises an undercoating of any one of metals belonging to group 4, group 5, group 6, group 7, group 8, group 9 or group 10 of the periodic table or an alloy containing any one of those metals as a main component, an intermediate coating of Cu or a Cu alloy, and a top-coating of Sn or an Sn alloy, the undercoating, the intermediate coating and the top-coating being formed on a surface of an electrically conductive base in this order, and the thickness of the top-coating is 1.9 times or more the thickness of the intermediate coating.

摘要翻译： 提供具有高耐热性和良好的可插入性/可萃取性的电镀材料。 电镀材料包括属于周期表第4族，第5族，第6族，第7族，第8族，第9族或第10族的金属中的任一种的底涂层或含有这些金属中的任一种作为主要成分的合金 ，Cu或Cu合金的中间涂层以及Sn或Sn合金的顶涂层，底涂层，中间涂层和顶涂层依次形成在导电基材的表面上，并且 顶涂层的厚度为中间涂层厚度的1.9倍或更多。

公开(公告)号：US5338618A

公开(公告)日：1994-08-16

申请号：US951587

申请日：1992-09-25

申请人： Satoshi Suzuki ,  Nobuyuki Shibata ,  Ryotomo Shirakawa ,  Akira Matsuda

发明人： Satoshi Suzuki ,  Nobuyuki Shibata ,  Ryotomo Shirakawa ,  Akira Matsuda

IPC分类号： C22C1/10 ,  C22C5/06 ,  H01H1/023 ,  H01H1/0237 ,  H01H11/04 ,  H01R39/20 ,  H01H1/02

CPC分类号： H01H1/0237 ,  Y10T428/12486 ,  Y10T428/12882 ,  Y10T428/12896 ,  Y10T428/12903

摘要： An electric contact material containing Li oxide of 0.01 to 2.0% by weight when represented in terms of the amount of Li, oxide of at least one rare earth element of 0.05 to 0.18% by weight when represented in terms of the amount of the rare earth element, and Ag or Ag alloy as the remaining portion; an electric contact material containing Li oxide of 0.01 to 2.0% by weight when represented in terms of the amount of Li, at least one rare earth element of 0.05 to 0.18% by weight when represented in terms of the amount of the rare earth element, at least one element selected from a group consisting of In, Sn, Zn, Mn, Pd, Sb, Cu, Mg, Pb, Cd, Cr and Bi by an amount of 0.1 to 1.0% by weight (however, in the case of Zn and Mn, the amount is set less than 0.5% by weight), and/or at least one element selected from a group consisting of Fe, Ni and Co by an amount of 0.03 to 0.6% by weight, and Ag as the remaining portion; and an electric contact formed by using the above material. It is excellent in the arc resistance, wear resistance an lubricity in a small current region and is suitable as the material for a slide contact and rotary slide contact.

摘要翻译： 当以稀土量表示的至少一种稀土元素的Li的氧化物为0.05〜0.18重量％表示时，含有0.01〜2.0重量％的Li氧化物的电接触材料 元素，Ag或Ag合金作为剩余部分; 当以Li的量表示，含有0.01〜2.0重量％的Li氧化物的电接触材料，当以稀土元素的量表示时，至少一种稀土元素为0.05〜0.18重量％ 选自由In，Sn，Zn，Mn，Pd，Sb，Cu，Mg，Pb，Cd，Cr和Bi组成的组中的至少一种元素，其量为0.1至1.0重量％（然而，在 Zn和Mn，其含量设定为小于0.5重量％），和/或至少一种选自Fe，Ni和Co的元素的量为0.03至0.6重量％，Ag为剩余量 一部分; 以及通过使用上述材料形成的电接触。 电弧电阻优良，耐磨性小，在小电流区域具有润滑性，适用于滑动接触和旋转滑动接触的材料。

公开(公告)号：US5171643A

公开(公告)日：1992-12-15

申请号：US556825

申请日：1990-07-23

申请人： Satoshi Suzuki ,  Nobuyuki Shibata ,  Ryotomo Shirakawa ,  Akira Matsuda

发明人： Satoshi Suzuki ,  Nobuyuki Shibata ,  Ryotomo Shirakawa ,  Akira Matsuda

IPC分类号： C22C1/10 ,  C22C5/06 ,  H01H1/023 ,  H01H1/0237 ,  H01H11/04 ,  H01R39/20

CPC分类号： H01H1/0237 ,  Y10T428/12486 ,  Y10T428/12882 ,  Y10T428/12896 ,  Y10T428/12903

摘要： An electric contact material comprising 0.01 to 2.0 weight % of Li, 0.01 weight % or more to less than 0.2 weight % of at least one rare earth metal and the remainder being Ag. The electric contact material may further comprise 0.1 to 1.0 weight % of at least one element selected from a group consisting of In, Sn, Zn, Mn, Pd, Sb, Cu, Mg, Pb, Cd, Cr and Bi, however, for Zn and Mn, the amount is less than 0.5 % by weight; and/or 0.03 to 0.6 weight % of at least one element selected from a group consisting of Fe, Ni and Co. The electric contact material is excellent in arc resistance, wear resistance and lubricity in a small current region and is suitable as a material for a slide contact and a rotary slide contact.

公开(公告)号：US20140128347A1

公开(公告)日：2014-05-08

申请号：US14123562

申请日：2012-06-01

申请人： Akira Matsuda ,  Mayumi Takahashi

发明人： Akira Matsuda ,  Mayumi Takahashi

IPC分类号： C12N15/113

CPC分类号： C12N15/113 ,  A61K31/7088 ,  A61K31/713 ,  C12N2310/113 ,  C12N2310/315 ,  C12N2310/3235 ,  C12N2310/351 ,  C12N2310/321 ,  C12N2310/3521

摘要： An oligonucleotide derivative comprises repeating structural units represented by the following general formula (wherein B represents adenine, guanine, cytosine, or uracil; X represents a sulfur atom or an oxygen atom; n represents an integer of 6 to 60; and B and X are independently represented in each of the repeating structural units), wherein X is a sulfur atom in at least one of the repeating structural units represented by the general formula:

摘要翻译： 寡核苷酸衍生物包含由以下通式表示的重复结构单元（其中B表示腺嘌呤，鸟嘌呤，胞嘧啶或尿嘧啶; X表示硫原子或氧原子; n表示6〜60的整数，B和X为 在每个重复结构单元中独立地表示），其中X是至少一个由以下通式表示的重复结构单元中的硫原子：

公开(公告)号：US20120176573A1

公开(公告)日：2012-07-12

申请号：US13497482

申请日：2010-10-13

申请人： Katsuaki Kuze ,  Kenji Kawai ,  Kazumoto Imai ,  Akihumi Yasui ,  Akira Matsuda ,  Masao Kochi

发明人： Katsuaki Kuze ,  Kenji Kawai ,  Kazumoto Imai ,  Akihumi Yasui ,  Akira Matsuda ,  Masao Kochi

IPC分类号： G02F1/1335 ,  G02B1/10 ,  B29D11/00 ,  G02B5/02

CPC分类号： G02B5/045 ,  G02B5/0231 ,  G02B5/0257 ,  G02B5/0273 ,  G02B6/0053 ,  G02F1/133504

摘要： To provide a viewing-angle-enhancing film which is set in a liquid crystal display device at a position nearer to an observer than the position of a liquid crystal layer in the device, and which attains, at a high level, the compatibility of being enhanced in viewing angle with a decrease in the darkening of images at the time of observing the screen from the front thereof. A viewing-angle-enhancing film which is set in a liquid crystal display device at a position nearer to an observer than the position of a liquid crystal layer in the device, and simultaneously satisfies the following requirements (1) to (3): (1) the film has a parallel ray transmittance of 5 to 90%; (2) the film has a diffusivity (A) of 1 to 20 degrees in its main diffusion direction; and (3) the film has a diffusivity ratio of 0.25 to 15% in the main diffusion direction.

摘要翻译： 为了提供一种视角增强膜，其设置在液晶显示装置中比装置中的液晶层的位置更靠近观察者的位置，并且高水平地实现了 在从其前方观察屏幕时图像的变暗减小而观看角度增强。 在液晶显示装置中，在比装置中的液晶层位置更靠近观察者的位置设置可视角增强膜，同时满足以下要求（1）〜（3）：（ 1）膜的平行光线透射率为5〜90％; （2）膜的主扩散方向的扩散度（A）为1〜20度; （3）膜的主扩散方向的扩散率为0.25〜15％。

公开(公告)号：US20070042212A1

公开(公告)日：2007-02-22

申请号：US11585881

申请日：2006-10-25

申请人： Takami Moteki ,  Yuuji Suzuki ,  Kazuhiro Hoshino ,  Kensaku Shinozaki ,  Akira Matsuda

发明人： Takami Moteki ,  Yuuji Suzuki ,  Kazuhiro Hoshino ,  Kensaku Shinozaki ,  Akira Matsuda

IPC分类号： B21C37/00 ,  C25B11/04

CPC分类号： C25D1/04 ,  C25D7/0614 ,  H05K1/0237 ,  H05K1/09 ,  H05K2201/0355 ,  Y10S428/935 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/1291

摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

摘要翻译： 铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上 铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。

公开(公告)号：US20050280498A1

公开(公告)日：2005-12-22

申请号：US11153609

申请日：2005-06-16

申请人： Yuuki Kikuchi ,  Akira Matsuda ,  Yuuji Suzuki ,  Sadao Matsumoto

发明人： Yuuki Kikuchi ,  Akira Matsuda ,  Yuuji Suzuki ,  Sadao Matsumoto

IPC分类号： C25D3/56 ,  C25D5/12 ,  C25D5/16 ,  C25D7/06 ,  H05K1/16 ,  H05K3/38 ,  H01C1/012

CPC分类号： C25D7/0614 ,  C25D3/562 ,  C25D5/12 ,  C25D5/16 ,  H05K1/167 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723

摘要： A conductive base material with resistance layer provided with roughened conductive base material on the surface of which the resistance layer is formed with uniform thickness distribution, and a resistance circuit board material using the same, wherein electrodeposited copper foil having granular crystals is roughening treated on at least one surface to obtain Rz of not more than 2.5 μm and the resistance layer of Ni alloy layer containing at least 8 to 18 wt % of P is formed on the roughening treated side.

摘要翻译： 具有电阻层的导电性基材在其表面上形成均匀厚度分布的电阻层的粗糙导电性基材，以及使用其的电阻电路基板材料，其中具有粒状结晶的电解铜箔在其上进行粗糙化处理 至少一个表面以获得不大于2.5μm的Rz，并且在粗糙化处理侧上形成含有至少8至18重量％的P的Ni合金层的电阻层。

公开(公告)号：US20050019599A1

公开(公告)日：2005-01-27

申请号：US10768704

申请日：2004-02-02

申请人： Takami Moteki ,  Yuuji Suzuki ,  Kazuhiro Hoshino ,  Kensaku Shinozaki ,  Akira Matsuda

发明人： Takami Moteki ,  Yuuji Suzuki ,  Kazuhiro Hoshino ,  Kensaku Shinozaki ,  Akira Matsuda

IPC分类号： C25D1/04 ,  C25D7/06 ,  H05K1/02 ,  H05K1/09 ,  B32B15/08 ,  B32B15/20

CPC分类号： C25D1/04 ,  C25D7/0614 ,  H05K1/0237 ,  H05K1/09 ,  H05K2201/0355 ,  Y10S428/935 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/1291

摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

摘要翻译： 铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上 铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。