摘要:
Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
摘要:
Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
摘要:
A system with a first analytical testing device configured collect a first and second signal associated with a characteristic parameter of a sample material, wherein the characteristic parameter is capable of enabling evaluation of ethanol production yield for plant material corresponding to the sample material. A drying unit is configured to drive the sample material to a substantially standard moisture level. A fermentation unit is configured to ferment the sample material. A second analytical testing device is configured to collect a reference measurement associated with the characteristic parameter. The reference measurement is capable of being correlated to the first and second signals for building a calibration model used to evaluate ethanol production yield of plant material corresponding in composition to the sample material. Associated methods are also provided.
摘要:
A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex with the phosphorous residue from the electroless nickel plating process that is mixable with the Pb/Sn solder. The phosphorous containing compound or complex prevents degradation of the solder/under bump metallization bond associated with phosphorus residue. The interfacial solder/under bump metallization bond is thereby strengthened. This results in fewer fractured solder bonds and greater package reliability.
摘要:
A flat panel wall mount for mounting a flat panel to a wall has a wall bracket connecting with a mounting bracket. The wall bracket has a wall bracket left section and a wall bracket right section. The wall bracket left section connects to the wall bracket right section by connectors such as bolts and nuts. A wall bracket left section bottom joining tab is formed on the wall bracket and a wall bracket right section bottom joining tab is formed on the wall bracket. The wall bracket left section bottom joining tab connects to the wall bracket right section bottom joining tab. The wall bracket left section bottom joining tab is parallel to the wall bracket right section bottom joining tab.
摘要:
A flat panel wall mount for mounting a flat panel to a wall has a wall bracket connecting with a mounting bracket. The wall bracket has a wall bracket left section and a wall bracket right section. The wall bracket left section connects to the wall bracket right section by connectors such as bolts and nuts. A wall bracket left section bottom joining tab is formed on the wall bracket and a wall bracket right section bottom joining tab is formed on the wall bracket. The wall bracket left section bottom joining tab connects to the wall bracket right section bottom joining tab. The wall bracket left section bottom joining tab is parallel to the wall bracket right section bottom joining tab.
摘要:
Described herein are novel thermally reactive near-infrared absorbing acetal copolymers that undergo chemical and physical changes upon exposure to near-infrared radiation. Also described are the methods of preparation of the novel acetal copolymers starting either with vinyl-alcohol polymers or with acetal copolymers. Also described are the methods of use of the new near-infrared absorbing acetal copolymers in coatings used in lithographic offset printing plates that can be directly imaged with near-infrared laser imaging devices in computer-to-plate and digital offset printing technologies. The novel acetal copolymers are also useful in photoresist applications, rapid prototyping of printed circuit boards and chemical sensor development.
摘要:
Described herein are a method for recording luminescent compositions, comprising a) providing a luminescent composition which comprises at least a first and second luminescent compound, wherein the first luminescent compound is a donor compound having a peak luminescent emission spectrum at a given wavelength, wherein the second luminescent compound is an acceptor compound having a peak absorption spectrum at a longer wavelength than the given wavelength, and wherein the emission spectrum of the donor compound at least partially overlaps the absorption spectrum of the acceptor compound; b) combining the composition with a substrate, so that at least a portion of the composition is available for exposure to a photon source; and c) embedding information at predetermined sites in the combined composition by localized exposure to a photon source, the embedding resulting in an information pattern when exposed to a luminescence deciphering device, and uses of said information pattern.
摘要:
A pull up bar has a main bar formed as a main bar right member, a main bar left member, and a main bar middle member. The main bar is formed of metal tubular construction. A door support includes a door support left leg that has a door support left leg bend and a door support right leg that has a door support right leg bend. A main block connects between the door support left leg and a door support right leg. The main block is substantially parallel to the main bar. An angled bar has an angled bar right section and an angled bar left section. The angled bar right section is connected to the door support right leg, and the main bar right member is connected to the angled bar right section.
摘要:
A method for forming the crosslinkable thermal interface materials disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the crosslinked rubber-resin mixture. The contemplated thermal interface material can be provided as a dispensable liquid paste, a gel, a tape, or a film. Applications of the contemplated thermal interface materials described herein comprise incorporating the materials into a layered material, an electronic component or a finished electronic product.