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公开(公告)号：US20190088409A1
公开(公告)日：2019-03-21
申请号：US16127349
申请日：2018-09-11
发明人： Masahito MORITA , Kenji SUZUKI
摘要： Disclosed is a wiring board having at least one insulating layer and at least one wiring layer arranged to overlap the insulating layer. The insulating layer includes: an arrangement portion at which the wiring layer is arranged; and a side wall portion which surrounds at least a part of the wiring layer arranged at the arrangement portion in a plane direction. The side wall portion has a planar shape that restricts movement and rotation of the wiring layer in the plane direction.
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公开(公告)号：US20130219712A1
公开(公告)日：2013-08-29
申请号：US13778004
申请日：2013-02-26
发明人： Kenji SUZUKI
IPC分类号： H05K3/28
CPC分类号： H05K3/284 , H01L21/568 , H01L24/19 , H01L2224/04105 , H01L2224/2518 , H01L2224/73259 , H05K1/186 , H05K3/0097 , H05K3/4652 , H05K2203/1536 , Y10T29/49146
摘要： Embodiments disclosed herein include a method of manufacturing a multilayer wiring board that includes the steps of forming, on a support substrate, a laminate in which insulating layers and conductor layers are alternately laminated, accommodating a semiconductor chip in an opening of a prepreg which is formed on the surface of the laminate and that includes a sheet-like glass fiber impregnated with resin, and heating and pressurizing the surface of the prepreg in a state where the semiconductor chip is accommodated in the opening.
摘要翻译： 本文公开的实施例包括制造多层布线板的方法，其包括以下步骤：在支撑基板上形成层叠体，其中绝缘层和导体层交替层叠，将半导体芯片容纳在形成的预浸料坯的开口中 在层叠体的表面上，并且包括浸渍有树脂的片状玻璃纤维，并且在半导体芯片容纳在开口中的状态下对预浸料坯的表面进行加热加压。
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公开(公告)号：US20130112461A1
公开(公告)日：2013-05-09
申请号：US13669913
申请日：2012-11-06
发明人： Kenji SUZUKI , Yuma OTSUKA , Takakuni NASU
CPC分类号： H05K3/4638 , H05K3/4629 , H05K2201/09063
摘要： A ceramic substrate includes: a substrate body formed by laminating a plurality of ceramic layers and including a first and second opposing principal surfaces and a peripheral portion having a positioning portion; a first conductor pad formed on the first principal surface; a second conductor pad formed on the second principal surface and having a diameter smaller than that of the first conductor pad. The positioning portion includes first and second through holes that individually pass through respective ceramic layers and are connected to each other in an axial direction. The first through hole passes through the first principal surface. The second through hole passes through the second principal surface and has a cross-sectional area that is smaller than that of the first through hole. At least apart of a peripheral edge of a ceramic layer defining the second through hole is visible through the first through hole.
摘要翻译： 陶瓷基板包括：通过层叠多个陶瓷层并且包括第一和第二相对的主表面和具有定位部分的周边部分形成的基板主体; 形成在第一主表面上的第一导体焊盘; 第二导体焊盘，形成在所述第二主表面上并且具有小于所述第一导体焊盘的直径的直径。 定位部分包括分别穿过相应的陶瓷层并沿轴向彼此连接的第一和第二通孔。 第一通孔穿过第一主表面。 第二通孔穿过第二主表面并具有小于第一通孔的横截面面积。 限定第二通孔的陶瓷层的外围边缘的至少一部分通过第一通孔是可见的。
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公开(公告)号：US20190088408A1
公开(公告)日：2019-03-21
申请号：US16127313
申请日：2018-09-11
发明人： Masahito MORITA , Kenji SUZUKI
摘要： Disclosed is a wiring board having: a plurality of insulating layers including a first insulating layer, a second insulating layer opposed to the first insulating layer and at least one intermediate insulating layer located between the first insulating layer and the second insulating layer; at least two wiring layers each located between adjacent two of the insulating layers; and a side surface insulating part covering at least a side surface of the at least one intermediate insulating layer and facing side surfaces of the at least two wiring layers. Each of the first and second insulating layers has an extension portion formed on at least a part of a periphery thereof and extending outwardly of the at least one intermediate insulating layer in a plane direction. The side surface insulating part is arranged between the extension portions of the first and second insulating layers.
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公开(公告)号：US20150181722A1
公开(公告)日：2015-06-25
申请号：US14637655
申请日：2015-03-04
发明人： Kenji SUZUKI
CPC分类号： H05K3/306 , H01L2224/16225 , H01L2924/1461 , H01L2924/1531 , H05K1/0218 , H05K1/0222 , H05K1/185 , H05K3/0094 , H05K3/4602 , H05K2201/0187 , H05K2201/09536 , H05K2201/0959 , H05K2201/09981 , H05K2201/10712 , H05K2203/1394 , Y10T29/49133 , Y10T29/49135 , H01L2924/00
摘要： A method of manufacturing a component-built-in wiring substrate which exhibits excellent reliability, through improvement of adhesion between a resin filler and a core substrate, is provided. In some embodiments the method comprises a core substrate preparation step for preparing a core substrate, an accommodation-hole forming step for forming an accommodation hole in the core substrate, and a through-hole forming step for forming through-holes. In a plating-layer forming step, a plating layer is formed on an inner wall surface of the accommodation hole and plating layers are formed on the inner wall surfaces of the through-holes, which become through-hole conductors each having a hollow. In an accommodation step, a component is accommodated in the accommodation hole. In a resin charging step, a resin filler is filled into a gap between component side-surfaces and the inner wall surface of the accommodation hole and into the hollows.
摘要翻译： 提供了通过提高树脂填充剂和芯基板之间的粘附性而制造具有优异可靠性的组件内置布线基板的方法。 在一些实施例中，该方法包括用于制备芯基板的芯基板准备步骤，用于在芯基板中形成收纳孔的容纳孔形成步骤和用于形成通孔的通孔形成步骤。 在电镀层形成工序中，在容纳孔的内壁面上形成镀层，在形成有中空部的通孔导体的贯通孔的内壁面上形成镀覆层。 在调节步骤中，部件容纳在容纳孔中。 在树脂填充工序中，将树脂填料填充到部件侧面与容纳孔的内壁面之间的间隙中，并填充到中空部内。
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公开(公告)号：US20130220691A1
公开(公告)日：2013-08-29
申请号：US13774405
申请日：2013-02-22
发明人： Kenji SUZUKI
CPC分类号： H05K3/0094 , H05K1/116 , H05K3/427 , H05K3/429 , H05K3/4602 , H05K3/4682 , H05K2201/0394 , H05K2201/09563 , H05K2201/0959 , Y10T29/49165
摘要： Provided is a multilayer wiring substrate comprising a first build-up layer and a second build-up layer including at least one insulating layer and at least one conductor layer, and a supporting substrate that supports the first and second build-up layers on the upper surface and the lower surface thereof, respectively. The multilayer wiring substrate includes a through hole extending between the upper surface side and the lower surface side of the supporting substrate, the through hole including openings on an upper and a lower end side thereof, a through hole conductor which is formed on the inner circumferential surface of the through hole, a conductor layer which is formed as to cover the opening on the upper end side of the through hole, and a conductor layer which is formed in a periphery of the opening on the lower end side of the through hole without covering the opening.
摘要翻译： 提供了一种多层布线基板，其包括第一堆积层和包括至少一个绝缘层和至少一个导体层的第二堆积层，以及支撑基板，其在上部支撑第一和第二堆积层 表面及其下表面。 多层布线基板包括在支撑基板的上表面侧和下表面侧之间延伸的通孔，通孔在其上端和下端侧包括开口，通孔导体形成在内周 通孔的表面，形成为覆盖通孔的上端侧的开口的导体层，以及形成在通孔的下端侧的开口的周围的导体层，没有 覆盖开幕。
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公开(公告)号：US20190013641A1
公开(公告)日：2019-01-10
申请号：US16029738
申请日：2018-07-09
发明人： Masahito MORITA , Kenji SUZUKI
摘要： A light-emitting device mounting package includes a substrate, a lead pin supported on the substrate, and an insulating member having a facing front surface which faces the front surface of the substrate and a facing back surface. The substrate has a first through hole and the ceramic plate has a second through hole. The lead pin has a shaft portion which penetrates the first and second through holes, a head portion provided at one end of the shaft portion, and a collar portion which extends from the shaft portion in the radial direction. The lead pin is fixed, via the collar portion, to a region of the facing back surface of the ceramic plate around an opening of the second through hole, and the ceramic plate is fixed to a region of the front surface of the substrate around an opening of the first through hole.
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公开(公告)号：US20190013442A1
公开(公告)日：2019-01-10
申请号：US16029766
申请日：2018-07-09
发明人： Masahito MORITA , Kenji SUZUKI
摘要： A light-emitting device mounting package includes a substrate, a frame extending upward from the substrate and surrounding a mounting portion, a lead plate supported on the frame, and a ceramic plate having a facing front surface and a facing back surface on the opposite side. The frame has a first through hole through which the lead terminal extends. The ceramic plate has a second through hole, and a metalized layer formed on the facing front surface such that the metalized layer is spaced from an opening of the second through hole. The lead plate penetrates the first and second through holes and is fixed, via a collar portion, to a region of the facing back surface around an opening of the second through hole on the facing back surface side. The insulating member is fixed to a region around the first through hole via the metalized layer.
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公开(公告)号：US20130075141A1
公开(公告)日：2013-03-28
申请号：US13624310
申请日：2012-09-21
CPC分类号： H05K1/0246 , H05K1/0251 , H05K1/0306 , H05K1/167 , H05K3/242 , H05K2201/0317
摘要： A wiring substrate includes a substrate main body having a first main face and a second main face opposite the first main face; a resistor formed on the first main face; a plurality of first-main-face-side wiring layers which are each formed on the resistor and which each include a grounding metal layer formed of a metal having a resistance lower than that of the resistor and a conductor layer formed on the grounding metal layer; a second-main-face-side wiring layer formed on the second main face; and a via which is formed in the substrate main body and which establishes electrical connectivity between the first-main-face-side wiring layers and the second-main-face-side wiring layer. The wiring substrate further includes a conductive covering layer which covers an upper surface and substantially covers the side surfaces of each of the first-main-face-side wiring layers.
摘要翻译： 布线基板包括具有第一主面和与第一主面相对的第二主面的基板主体; 形成在所述第一主面上的电阻器; 多个第一主面侧布线层，分别形成在电阻器上，并且各自包括由电阻低于电阻器的电阻的金属形成的接地金属层和形成在接地金属层上的导体层 ; 形成在第二主面上的第二主面侧配线层; 以及形成在基板主体中并且建立第一主面侧布线层和第二主面侧布线层之间的电连通性的通孔。 布线基板还包括覆盖上表面并且基本上覆盖每个第一主面侧布线层的侧表面的导电覆盖层。
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公开(公告)号：US20190162778A1
公开(公告)日：2019-05-30
申请号：US16309066
申请日：2017-05-08
发明人： Junichirou KANEMATSU , Kenji SUZUKI
摘要： Provided is a multilayer wiring board for inspection of electronic components which has excellent reliability by improving the adhesiveness between a resin wiring portion and a ceramic wiring substrate. A multilayer wiring board 10 according to the present invention includes: a ceramic wiring substrate 20 having a substrate main surface 21 and a substrate rear surface 22; substrate-side conductive layers 32, 33 formed on the substrate main surface 21; and a resin wiring portion 40 stacked on the substrate main surface 21 so as to cover the substrate-side conductive layers 32, 33. Inspection pads 50, 51 for inspection of electronic components are formed on a front surface 49 of the resin wiring portion 40. End surfaces of the substrate-side conductive layers 33 are exposed from side surfaces 13 of the multilayer wiring board 10. An outer peripheral edge of a rear surface of the resin wiring portion 40 is in contact with the surfaces of the substrate-side conductive layers 33, and end surfaces of the resin wiring portion 40 and the end surfaces of the substrate-side conductive layers 33 are positioned closer to the center of the board than end surfaces 23 of the ceramic wiring substrate 20.
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