公开(公告)号：US11923488B2

公开(公告)日：2024-03-05

申请号：US17351928

申请日：2021-06-18

Applicant: NICHIA CORPORATION

Inventor： Naoki Musashi ,  Takayoshi Wakaki

IPC: H01L33/58 ,  H01L33/54 ,  H01L33/56 ,  H01L25/075 ,  H01L33/44 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L33/54 ,  H01L33/56 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/486 ,  H01L33/505 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0083 ,  H01L2933/0091

Abstract: A light emitting device includes: a light emitting element having a top surface; and a light-transmissive member covering at least the top surface of the light emitting element, the light-transmissive member having a principal surface located above the top surface of the light emitting element. The principal surface of the light-transmissive member comprises a plurality of concave portions.

公开(公告)号：US11088305B2

公开(公告)日：2021-08-10

申请号：US16282286

申请日：2019-02-21

Applicant: NICHIA CORPORATION

Inventor： Naoki Musashi ,  Takayoshi Wakaki

IPC: H01L33/58 ,  H01L33/54 ,  H01L33/56 ,  H01L25/075 ,  H01L33/50 ,  H01L33/62 ,  H01L33/48 ,  H01L33/44

Abstract: A method for forming a light-transmissive member includes: a step (A) including locating a cured resin body having a principal surface and containing a silicone resin, and a die including a plurality of convex portions, such that the principal surface and the plurality of convex portions face each other, and pressing the die onto the principal surface of the resin body in a heated state to form a plurality of concave portions at the principal surface; and a step (B) including, after the step (A), irradiating the principal surface of the resin body with ultraviolet rays.

公开(公告)号：US10831099B2

公开(公告)日：2020-11-10

申请号：US16744659

申请日：2020-01-16

Applicant: NICHIA CORPORATION

Inventor： Naoki Musashi

IPC: G03F7/00 ,  C03C15/00 ,  G03F7/32 ,  G03F7/36 ,  H01L33/58

Abstract: A method for manufacturing an optical member includes: forming a mask pattern on a glass member, the mask pattern comprising oxygen and indium; performing dry etching on the glass member using the mask pattern as a mask, while using an etching gas comprising fluorine; after performing the dry etching, performing wet etching on the glass member using the mask pattern as a mask, while using an etching solution comprising fluorine; and after alternately repeating performing the dry etching and the wet etching a plurality of times, removing the mask pattern.

公开(公告)号：US11043610B2

公开(公告)日：2021-06-22

申请号：US16537270

申请日：2019-08-09

Applicant: NICHIA CORPORATION

Inventor： Naoki Musashi

IPC: H01L33/08 ,  H01L51/42

Abstract: A light-emitting device includes a light-emitting element which emits ultraviolet light, and a fluorescent layer provided on the light-emitting element. The fluorescent layer includes fluorescent particles. The fluorescent particles are excited by the ultraviolet light emitted by the light-emitting element and the excited fluorescent particles emit ultraviolet light of a wavelength longer than the ultraviolet light emitted by the light-emitting element.

公开(公告)号：US11626536B2

公开(公告)日：2023-04-11

申请号：US17232788

申请日：2021-04-16

Applicant: NICHIA CORPORATION

Inventor： Naoki Musashi

IPC: H01L33/08 ,  H01L51/42

Abstract: A light-emitting device includes a light-emitting element which emits ultraviolet light, and a fluorescent layer provided on the light-emitting element. The fluorescent layer includes fluorescent particles. The fluorescent particles are excited by the ultraviolet light emitted by the light-emitting element and the excited fluorescent particles emit ultraviolet light of a wavelength longer than the ultraviolet light emitted by the light-emitting element.

公开(公告)号：US10978625B2

公开(公告)日：2021-04-13

申请号：US16422653

申请日：2019-05-24

Applicant: NICHIA CORPORATION

Inventor： Naoki Musashi ,  Takayoshi Wakaki

IPC: H01L33/56 ,  H01L33/52 ,  G03F7/20

Abstract: A method for forming a light-transmissive member includes irradiating a principal surface of a cured resin body containing a silicone resin with ultraviolet rays through a photomask comprising one or more light-blocking regions and one or more light-transmissive regions, so as to cause a height of one or more first regions of the principal surface, which correspond to the one or more light-blocking regions of the photomask, to be different than a height of one or more second regions of the principal surface, which correspond to the one or more light-transmissive regions of the photomask.

公开(公告)号：US10305010B2

公开(公告)日：2019-05-28

申请号：US15949975

申请日：2018-04-10

Applicant: NICHIA CORPORATION

Inventor： Naoki Musashi

IPC: H01L33/48 ,  H01L33/62

Abstract: A light emitting device includes a support substrate; a conductive wiring located on an upper surface of the support substrate; a light emitting element disposed on an upper surface of the conductive wiring via a bonding member interposed therebetween; and a frame body located on an upper surface of the support substrate. The frame body has a plurality of recessed portions on an inner lateral surface surrounding the light emitting element in a top view of the light emitting device. The conductive wiring includes an underlying portion located directly under the light emitting element, and at least two extended portions extending from the underlying portion to a location inside of at least two respective ones of the recessed portions in a top view of the light emitting device.

公开(公告)号：US10153392B2

公开(公告)日：2018-12-11

申请号：US15703480

申请日：2017-09-13

Applicant: NICHIA CORPORATION

Inventor： Naoki Musashi

IPC: H01L33/00 ,  B32B43/00 ,  B23K26/08 ,  B23K26/53 ,  B23K101/40 ,  H01L33/32 ,  H01L33/40 ,  H01L33/44

Abstract: A method of manufacturing a light emitting element includes: providing a wafer including a substrate and a semiconductor layered body formed at an upper surface of the substrate; irradiating the wafer with laser light by performing first and second patterns of scanning; and separating the substrate from the semiconductor layered body. In the first pattern of scanning, the wafer is irradiated with the laser light outwardly from an inner side of the wafer or inwardly from an outer side of the wafer, so that a region irradiated with the laser light enlarges. In the second pattern of scanning, the wafer is irradiated with the laser light so that the laser light intersects with a circumferential edge of the wafer at a plurality of portions.

公开(公告)号：US09966520B2

公开(公告)日：2018-05-08

申请号：US15363773

申请日：2016-11-29

Applicant: NICHIA CORPORATION

Inventor： Naoki Musashi

IPC: H01L29/22 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L33/486

Abstract: A light emitting device includes a support substrate; a conductive wiring located on an upper surface of the support substrate; a light emitting element disposed on an upper surface of the conductive wiring via a bonding member interposed therebetween; and a frame body located on an upper surface of the support substrate. The frame body has a plurality of recessed portions on an inner lateral surface surrounding the light emitting element in a top view of the light emitting device. The conductive wiring includes an underlying portion located directly under the light emitting element, and at least two extended portions extending from the underlying portion to a location inside of at least two respective ones of the recessed portions in a top view of the light emitting device.