公开(公告)号：US11018288B2

公开(公告)日：2021-05-25

申请号：US16573402

申请日：2019-09-17

Applicant: NICHIA CORPORATION

Inventor： Tomohiro Ikeda ,  Masaaki Katsumata ,  Yohei Inayoshi ,  Yosuke Nakayama ,  Yumiko Kameshima

IPC: H01L23/48 ,  H01L33/64 ,  H01L25/075 ,  H05K3/00 ,  H05K1/18 ,  H01L33/62

Abstract: A metal-base substrate includes a metal plate, an adhesive layer; and a film substrate. The adhesive layer is interposed between the metal plate and the film substrate. The film substrate has a wiring layer on a first surface opposite to a second surface on which the adhesive layer is arranged, with a through hole piercing through the film substrate in a thickness direction of the film substrate.

公开(公告)号：US11611014B2

公开(公告)日：2023-03-21

申请号：US17580193

申请日：2022-01-20

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Koji Taguchi ,  Yumiko Kameshima ,  Masaaki Katsumata

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/24 ,  H01L33/62

Abstract: A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.

公开(公告)号：US12302494B2

公开(公告)日：2025-05-13

申请号：US17715033

申请日：2022-04-07

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Yumiko Kameshima ,  Koji Taguchi ,  Masaaki Katsumata

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/32

Abstract: A lighting device includes a light emitting element having element electrodes; a light guide member to receive incoming light from the light emitting element and to emit light spreading along a plane; and a substrate including a base substitute. Conductors are formed on a first surface of the base substrate. An adhesive member is formed on a second surface of the base substrate, and through-holes penetrating the substrate in a thickness direction of the substrate. The substrate is provided on the light emitting element via the adhesive member of the substrate such that a surface of the light emitting element is exposed through each of the through-holes to define a bottomed hole. Each of the element electrodes is connected to each of the conductors via a filler filling the bottomed hole. The filler has a lower surface than a surface carrying the conductors of the substrate in a cross-sectional view.

公开(公告)号：US11420431B2

公开(公告)日：2022-08-23

申请号：US17101589

申请日：2020-11-23

Applicant: NICHIA CORPORATION

Inventor： Yumiko Kameshima

IPC: B32B37/00 ,  H05K3/00 ,  B32B37/10 ,  H05K1/02

Abstract: An adhering jig includes a mounting plate having an upper surface, and a plurality of aligning parts incorporated in the mounting plate. A plurality of first holes are formed in the upper surface, and a plurality of first pins are engaged in the plurality of first holes, each having a base end and an upper end, and configured to be movable in a direction normal to the upper surface. A plurality of first adjusting members are located inward with respect to the upper surface. The plurality of first adjusting members are configured to support the plurality of first pins and to adjust movements thereof. The plurality of first adjusting members are, when the plurality of first pins are pressed in the first holes, configured to exert opposite force to the force applied through the plurality of first pins.

公开(公告)号：US12002907B2

公开(公告)日：2024-06-04

申请号：US17280047

申请日：2019-09-27

Applicant: NICHIA CORPORATION

Inventor： Yumiko Kameshima ,  Eiko Minato ,  Koji Taguchi ,  Masaaki Katsumata

IPC: H01L33/54 ,  H01L23/00 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L33/54 ,  H01L24/96 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L33/56 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/73217 ,  H01L2224/96 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A light emitting module includes: a base board; and a plurality of divisional planar light emitters disposed adjacent to each other on one surface of the base board. The base board includes: a plurality of conductive parts, a flexible base part joined to the conductive parts, and an insulating base part joined to the flexible base part. Each of the plurality of divisional planar light emitters includes: a plurality of wiring parts electrically connected with corresponding ones of the conductive parts of the base board, a plurality of light emitting elements each disposed on corresponding ones of the wiring parts, and a sealing part sealing the plurality of light emitting elements and facing the insulating base part.

公开(公告)号：US11363715B2

公开(公告)日：2022-06-14

申请号：US16583270

申请日：2019-09-26

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Yumiko Kameshima ,  Koji Taguchi ,  Masaaki Katsumata

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/02

Abstract: A lighting device including a light-emitter including light emitting elements, and a support having a first surface that carries a wiring line electrically connecting element electrodes of the light emitting elements and a light emitting surface, and a substrate including a base substrate, a conductor formed on a first surface of the base substrate, an adhesive member formed on a second surface of the base substrate, and a through-hole penetrating the substrate. A space is formed between the substrate and the light-emitter to communicate with a bottomed hole formed in a location of the through-hole as a result of adhering an adhesive surface of the adhesive member to a surface of the light-emitter having the wiring line formed thereon. The wiring line is connected to the conductor via a filler filling the bottomed hole, and the space is located outside an opening of the bottomed hole.

公开(公告)号：US11324117B2

公开(公告)日：2022-05-03

申请号：US16583270

申请日：2019-09-26

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Yumiko Kameshima ,  Koji Taguchi ,  Masaaki Katsumata

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/02

Abstract: A lighting device including a light-emitter including light emitting elements, and a support having a first surface that carries a wiring line electrically connecting element electrodes of the light emitting elements and a light emitting surface, and a substrate including a base substrate, a conductor formed on a first surface of the base substrate, an adhesive member formed on a second surface of the base substrate, and a through-hole penetrating the substrate. A space is formed between the substrate and the light-emitter to communicate with a bottomed hole formed in a location of the through-hole as a result of adhering an adhesive surface of the adhesive member to a surface of the light-emitter having the wiring line formed thereon. The wiring line is connected to the conductor via a filler filling the bottomed hole, and the space is located outside an opening of the bottomed hole.

公开(公告)号：US11605619B2

公开(公告)日：2023-03-14

申请号：US17186918

申请日：2021-02-26

Applicant: NICHIA CORPORATION

Inventor： Koji Taguchi ,  Yumiko Kameshima ,  Masaaki Katsumata

IPC: H01L25/13 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/58

Abstract: A surface-emitting light source includes a plurality of light-emitting modules each including an array of a plurality of light sources and a wiring board disposed on an array of the plurality of light-emitting modules with an adhesive interposed therebetween. The plurality of light-emitting modules to be disposed on the wiring board are arranged such that a space is left between adjacent ones of the light-emitting modules. The adhesive contains a thermosetting resin and includes a penetrating portion inside the space. The penetrating portion includes a gap detached from a lateral surface of the light-emitting modules.

公开(公告)号：US11264533B2

公开(公告)日：2022-03-01

申请号：US16857959

申请日：2020-04-24

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Koji Taguchi ,  Yumiko Kameshima ,  Masaaki Katsumata

IPC: H01L33/24 ,  H01L33/00 ,  H01L25/075 ,  H01L33/62

Abstract: A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.

公开(公告)号：US10461234B2

公开(公告)日：2019-10-29

申请号：US15699289

申请日：2017-09-08

Applicant: NICHIA CORPORATION

Inventor： Tomohiro Ikeda ,  Masaaki Katsumata ,  Yohei Inayoshi ,  Yosuke Nakayama ,  Yumiko Kameshima

IPC: H01L21/02 ,  H01L33/64 ,  H01L25/075 ,  H01L33/62 ,  H05K1/18 ,  H05K3/00

Abstract: A method for manufacturing a metal-base substrate includes: preparing a film substrate by forming a wiring layer on a first surface of the film substrate; and sticking a metal plate on a second surface of the film substrate opposite from the first surface, with an adhesive layer being interposed between the metal plate and the film substrate.