-
公开(公告)号:US10851973B2
公开(公告)日:2020-12-01
申请号:US16145689
申请日:2018-09-28
Applicant: NICHIA CORPORATION
Inventor: Yohei Inayoshi , Masaaki Katsumata , Tomohiro Ikeda
IPC: F21V19/00 , G02F1/13357 , H05K1/00 , H01L33/62 , F21Y105/16 , F21Y115/10 , H01L25/075
Abstract: A light-emitting device includes a support board including a first base with flexibility and having a region where a first metal film is formed, a connection board disposed on an upper surface of the support board and including a second base on which a second metal film is formed, a light-emitting element mounted on the connection board, and a conductive member in contact with the first metal film and with the second metal film.
-
公开(公告)号:US11112094B2
公开(公告)日:2021-09-07
申请号:US17079519
申请日:2020-10-26
Applicant: NICHIA CORPORATION
Inventor: Yohei Inayoshi , Masaaki Katsumata , Tomohiro Ikeda
IPC: F21V19/00 , G02F1/13357 , H05K1/00 , H01L33/62 , F21Y105/16 , F21Y115/10 , H01L25/075
Abstract: A method of manufacturing a light-emitting device includes: providing a second base with a plurality of light-emitting elements, the second base having an upper surface on which a pattern of second metal films is formed, the plurality of light-emitting elements being provided on the pattern of second metal films; cutting the second base to singulate the second base into a plurality of connection boards on each of which respective one of the plurality of light-emitting elements is mounted; providing a support board including a first base, the first base being flexible, the first base including a pattern of first metal films; placing the plurality of connection boards on the support board; and forming, for each of the plurality of connection boards, a conductive member so as to be in contact with the pattern of second metal films on the connection board and with the pattern of first metal films.
-
公开(公告)号:US09893242B2
公开(公告)日:2018-02-13
申请号:US15277662
申请日:2016-09-27
Applicant: NICHIA CORPORATION
Inventor: Tomohiro Ikeda , Masaaki Katsumata , Yohei Inayoshi , Kazuhito Fukui
CPC classification number: H01L33/483 , H01L33/486 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16225
Abstract: A light emitting device is provided that can restrain deterioration of a mount substrate made of resin, the light emitting device including: a support member that is made of resin; a pair of wirings that are arranged on the support member; a light emitting element that is arranged to cross the pair of wirings and that has a pair of electrodes on one side running in parallel to the pair of wirings so as to be electrically connected; and a vaporproof member in a film shape that seamlessly covers an upper face of the support member, at least, in a region where the light emitting element is arranged between the pair of wirings in a plan view, wherein the vaporproof member has a higher vaporproof property than that of the support member.
-
公开(公告)号:US10461234B2
公开(公告)日:2019-10-29
申请号:US15699289
申请日:2017-09-08
Applicant: NICHIA CORPORATION
Inventor: Tomohiro Ikeda , Masaaki Katsumata , Yohei Inayoshi , Yosuke Nakayama , Yumiko Kameshima
Abstract: A method for manufacturing a metal-base substrate includes: preparing a film substrate by forming a wiring layer on a first surface of the film substrate; and sticking a metal plate on a second surface of the film substrate opposite from the first surface, with an adhesive layer being interposed between the metal plate and the film substrate.
-
公开(公告)号:US10317050B2
公开(公告)日:2019-06-11
申请号:US15901765
申请日:2018-02-21
Applicant: NICHIA CORPORATION
Inventor: Yasuo Fujikawa , Takuya Wasa , Tomohiro Ikeda , Yohei Inayoshi , Motokazu Yamada
IPC: F21V11/00 , F21V19/00 , H01L25/075 , G02F1/13357 , G02F1/1335 , F21Y113/00 , F21Y105/16 , F21Y103/10 , F21Y115/10 , H05K1/18
Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.
-
公开(公告)号:US11018288B2
公开(公告)日:2021-05-25
申请号:US16573402
申请日:2019-09-17
Applicant: NICHIA CORPORATION
Inventor: Tomohiro Ikeda , Masaaki Katsumata , Yohei Inayoshi , Yosuke Nakayama , Yumiko Kameshima
Abstract: A metal-base substrate includes a metal plate, an adhesive layer; and a film substrate. The adhesive layer is interposed between the metal plate and the film substrate. The film substrate has a wiring layer on a first surface opposite to a second surface on which the adhesive layer is arranged, with a through hole piercing through the film substrate in a thickness direction of the film substrate.
-
公开(公告)号:US10801704B2
公开(公告)日:2020-10-13
申请号:US16402129
申请日:2019-05-02
Applicant: NICHIA CORPORATION
Inventor: Yasuo Fujikawa , Takuya Wasa , Tomohiro Ikeda , Yohei Inayoshi , Motokazu Yamada
IPC: F21V11/00 , F21V19/00 , G02F1/13357 , H01L25/075 , F21Y113/00 , F21Y105/16 , F21Y103/10 , F21Y115/10 , H05K1/18
Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.
-
公开(公告)号:US09933140B2
公开(公告)日:2018-04-03
申请号:US15054588
申请日:2016-02-26
Applicant: NICHIA CORPORATION
Inventor: Yasuo Fujikawa , Takuya Wasa , Tomohiro Ikeda , Yohei Inayoshi , Motokazu Yamada
IPC: F21V11/00 , F21V19/00 , H01L25/075 , G02F1/1335 , F21Y113/00 , F21Y105/16 , F21Y103/10 , F21Y115/10 , H05K1/18
CPC classification number: F21V19/005 , F21Y2103/10 , F21Y2105/16 , F21Y2113/00 , F21Y2115/10 , G02F1/1336 , G02F1/133603 , G02F1/133605 , H01L25/0753 , H05K1/189 , H05K2201/10106
Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.
-
-
-
-
-
-
-