公开(公告)号：US09105754B2

公开(公告)日：2015-08-11

申请号：US13929612

申请日：2013-06-27

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichiro Shishido ,  Sadahito Misumi ,  Kenji Onishi

IPC: H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/03

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/42 ,  H01L24/45 ,  H01L24/48 ,  H01L25/03 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20754 ,  H01L2924/00012

Abstract: Provided is an adhesive film that enables manufacturing of a high quality semiconductor device with good yield ratio, and related methods of manufacturing a semiconductor device, and semiconductor devices. Provided is an adhesive film for embedding a first semiconductor element fixed to an adherend and fixing a second semiconductor element that is different from the first semiconductor element to the adherend, wherein the adhesive film has a thickness T that is larger than a thickness T1 of the first semiconductor element, and the adherend and the first semiconductor element are connected by wire bonding and a difference between the thickness T and the thickness T1 is 40 μm or more and 260 μm or less, or the adherend and the first semiconductor element are connected by flip-chip bonding and a difference between the thickness T and the thickness T1 is 10 μm or more and 200 μm or less.

Abstract translation: 提供了能够制造具有良好屈服比的高质量半导体器件的粘合膜以及半导体器件的制造方法以及半导体器件。 提供一种用于嵌入固定在被粘物上的第一半导体元件和固定与第一半导体元件不同的第二半导体元件到粘合体上的粘合膜，其中粘合膜的厚度T大于 第一半导体元件，被粘物和第一半导体元件通过引线接合连接，厚度T与厚度T1之间的差为40μm以上且260μm以下，或被粘附体和第一半导体元件通过 倒装芯片接合和厚度T与厚度T1之间的差为10μm以上且200μm以下。

公开(公告)号：US12060263B2

公开(公告)日：2024-08-13

申请号：US17801070

申请日：2021-08-05

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroki Kigami ,  Kenji Onishi

IPC: C09J7/35 ,  B81B7/00 ,  C09J133/08

CPC classification number: B81B7/0029 ,  C09J7/35 ,  C09J133/08 ,  C09J2203/326 ,  C09J2301/304 ,  C09J2301/312 ,  H01L2924/1461 ,  Y10T428/2891

Abstract: A provided protective cover member is a protective cover member configured to be placed on a face of an object, the face having an opening. The protective cover member includes a laminate, and the laminate includes: a protective membrane having a shape configured to cover the opening when the member is placed on the face; and an adhesive agent layer. The adhesive agent layer includes a thermosetting adhesive layer including a thermosetting resin composition. The thermosetting resin composition has a storage modulus of 1×105 Pa or more at 130 to 170° C. The above protective cover member is suitable for reducing deformation thereof and/or peeling thereof from a placement face in a high-temperature treatment such as reflow soldering.

公开(公告)号：US20140001654A1

公开(公告)日：2014-01-02

申请号：US13929612

申请日：2013-06-27

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichiro Shishido ,  Sadahito Misumi ,  Kenji Onishi

IPC: H01L23/00

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/42 ,  H01L24/45 ,  H01L24/48 ,  H01L25/03 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20754 ,  H01L2924/00012

Abstract: The present invention aims to provide an adhesive film that enables manufacturing of a high quality semiconductor device with good yield ratio, a method of manufacturing a semiconductor device using the same, and a semiconductor device obtained by the manufacturing method. This object is achieved by an adhesive film for embedding a first semiconductor element fixed to an adherend and fixing a second semiconductor element that is different from the first semiconductor element to the adherend, wherein the adhesive film has a thickness T that is larger than a thickness T1 of the first semiconductor element, and the adherend and the first semiconductor element are connected by wire bonding and a difference between the thickness T and the thickness T1 is 40 μm or more and 260 μm or less, or the adherend and the first semiconductor element are connected by flip-chip bonding and a difference between the thickness T and the thickness T1 is 10 μm or more and 200 μm or less.

Abstract translation: 本发明旨在提供一种能够制造具有良好屈服比的高质量半导体器件的粘合膜，使用该粘合膜的半导体器件的制造方法以及通过该制造方法获得的半导体器件。 该目的通过一种用于嵌入固定到被粘物上的第一半导体元件和将与第一半导体元件不同的第二半导体元件固定到被粘物的粘合膜来实现，其中粘合剂膜的厚度T大于厚度 第一半导体元件的T1，被粘体和第一半导体元件通过引线接合连接，厚度T与厚度T1之间的差为40μm以上且260μm以下，或者被粘体和第一半导体元件 通过倒装芯片接合连接，厚度T与厚度T1之间的差为10μm以上且200μm以下。