公开(公告)号：US4246427A

公开(公告)日：1981-01-20

申请号：US966999

申请日：1978-12-06

申请人： Naoki Andoh ,  Ituo Nishiwaki ,  Akira Iio ,  Masatoshi Arakawa

发明人： Naoki Andoh ,  Ituo Nishiwaki ,  Akira Iio ,  Masatoshi Arakawa

IPC分类号： B01J23/34 ,  B01J27/00 ,  B01J27/199 ,  C07B61/00 ,  C07C51/00 ,  C07C51/25 ,  C07C57/055 ,  C07C67/00

CPC分类号： B01J23/34 ,  B01J23/002 ,  B01J27/199 ,  C07C51/252 ,  B01J2523/00

摘要： Methacrylic acid is produced from methacrolein by gaseous phase oxidation in a very high selectivity, when methacrolein, molecular oxygen-containing gas and steam in a molar ratio of methacrolein:molecular oxygen:steam of 1:1-3:0-50 are subjected to reaction at a temperature in the range of 250.degree. to 400.degree. C., at a space velocity of 250 to 3,000 hr.sup.-1 (at 0.degree. C. and 1 atm.) with a novel catalyst having the following composition formula in atomic ratio:Mo.sub.a P.sub.b Zr.sub.c V.sub.d Mn.sub.e X.sub.f O.sub.gwherein X represents at least one member selected from the group consisting of potassium, rubidium, cesium and thallium, and a, b, c, d, e, f or g represents the number of atoms of Mo, P, Zr, V, Mn, X or O, respectively, and when a is 12, b is 0.5 to 5, c is 0.1 to 5, d is 0.05 to 3, e is 0.05 to 1.5, f is 0.1 to 3 and g is 40 to 60; and g is a number sufficient enough to satisfy the valencies of the respective catalyst component elements. Said catalyst has a high catalyst activity and a physical strength high enough for the catalyst to stand the severe conditions required for use on a commercial scale.

摘要翻译： 当甲基丙烯醛，含分子氧的气体和摩尔比为1：1-3：0-50的甲基丙烯醛：蒸汽的摩尔比为1：1-3：0-50的摩尔比时，甲基丙烯酸以非常高的选择性通过气相氧化由异丁烯醛生产。 在250〜3000hr -1的空间速度（0℃和1个大气压）下，在250〜400℃的温度下进行反应，得到具有以下组成式的原子比的新型催化剂 ：MoaPbZrcVdMneXfOg其中X表示选自钾，铷，铯和铊中的至少一种，a，b，c，d，e，f或g表示Mo，P，Zr，V的原子数 ，Mn，X或O，当a为12时，b为0.5〜5，c为0.1〜5，d为0.05〜3，e为0.05〜1.5，f为0.1〜3，g为40〜60 ; g是足以满足各催化剂成分元素的价态的数。 所述催化剂具有高的催化剂活性和足够高的物理强度，以使催化剂能够承受商业规模所需的苛刻条件。

公开(公告)号：US4036901A

公开(公告)日：1977-07-19

申请号：US625380

申请日：1975-10-24

申请人： Masato Kawakami ,  Naoki Andoh ,  Akira Iio ,  Haruo Yamanouchi

发明人： Masato Kawakami ,  Naoki Andoh ,  Akira Iio ,  Haruo Yamanouchi

IPC分类号： C07C5/367 ,  B01J23/00 ,  B01J23/31 ,  B01J23/887 ,  C07B61/00 ,  C07C1/00 ,  C07C5/48 ,  C07C15/46 ,  C07C67/00 ,  C07C15/00 ,  C07C15/10

CPC分类号： B01J23/8876 ,  B01J23/31 ,  C07C5/48

摘要： A process for producing styrene which comprises subjecting 4-vinylcyclohexene to gas phase catalytic oxidation with a molecular oxygen-containing gas, for example, air, characterized in that the oxidation is carried out by use of a catalyst composition represented by the general formula,Mo.sub.12 Bi.sub.0.1.sub.-10 Fe.sub.0.sub.-15 Co.sub.0.sub.-15 Pb.sub.0.sub.-15 X.sub.0.sub.-10 Y.sub.0.sub.-3 O.sub.nwherein X is at least one element selected from the group consisting of zirconium, cadmium, niobium, and antimony; Y is at least one element selected from the group consisting of lithium, sodium, potassium, rubidium, cesium and thallium; 1.ltoreq.Fe + Co + Pb.ltoreq.25; and n is the number of oxygen atoms sufficient to replenish the valences of other elements. According to the above-mentioned process, styrene can be produced in a high yield.

摘要翻译： 一种生产苯乙烯的方法，其包括用含有分子氧的气体例如空气对4-乙烯基环己烯进行气相催化氧化，其特征在于，使用由通式Mo12Bi0表示的催化剂组合物进行氧化 .1-10Fe0-15Co0-15Pb0-15X0-10Y0-3On其中X是选自锆，镉，铌和锑中的至少一种元素; Y是选自锂，钠，钾，铷，铯和铊中的至少一种元素; 1 25; 并且n是足以补充其它元素的化合价的氧原子数。 根据上述方法，可以高产率生产苯乙烯。

公开(公告)号：US4039583A

公开(公告)日：1977-08-02

申请号：US636887

申请日：1975-12-02

申请人： Masato Kawakami ,  Naoki Andoh ,  Akira Iio

发明人： Masato Kawakami ,  Naoki Andoh ,  Akira Iio

IPC分类号： C07C45/00 ,  B01J23/00 ,  B01J23/887 ,  C07B61/00 ,  C07C5/48 ,  C07C45/35 ,  C07C47/22 ,  C07C67/00 ,  C07C45/04 ,  C07C5/00

CPC分类号： C07C5/48 ,  B01J23/8876 ,  C07C45/35 ,  B01J2523/00

摘要： In a process for producing methacrolein by the gas phase catalytic reaction of isobutene with molecular oxygen in the presence of a catalyst consisting of Mo, Bi, Fe, Co, Sb and O, the catalyst is prepared by using as the Sb component, a mixture of a trivalent Sb compound and a pentavalent Sb compound. When said catalyst is used, the reaction can be continued over a long period of time without formation of complete oxidation products, i.e. CO and CO.sub.2, and, even when the starting isobutene contains n-butene, the reaction proceeds smoothly to make it possible to produce methacrolein and 1,3-butadiene simultaneously.

摘要翻译： 在由Mo，Bi，Fe，Co，Sb和O组成的催化剂存在下，通过异丁烯与分子氧的气相催化反应制备异丁烯醛的方法，通过使用Sb组分，混合物 的三价Sb化合物和五价Sb化合物。 当使用所述催化剂时，反应可以长时间持续，而不会形成完全氧化产物，即CO和CO 2，即使起始异丁烯含有正丁烯，反应也能顺利进行， 同时产生甲基丙烯醛和1,3-丁二烯。

公开(公告)号：US06454819B1

公开(公告)日：2002-09-24

申请号：US09484064

申请日：2000-01-18

申请人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Katsuya Okumura ,  Masayuki Motonari ,  Masayuki Hattori ,  Akira Iio

发明人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Katsuya Okumura ,  Masayuki Motonari ,  Masayuki Hattori ,  Akira Iio

IPC分类号： C09K314

CPC分类号： C09K3/1463 ,  C08G83/001 ,  C08J3/128 ,  C08K3/36 ,  C08K5/057 ,  C08K2201/013 ,  C09G1/02 ,  C09K3/1436 ,  H01L21/02024 ,  H01L21/31053 ,  H01L21/3212

摘要： A process for chemical mechanical polishing of a working film on a wafer, which entails conducting the chemical mechanical polishing with an aqueous dispersion containing water and composite particles, the composite particles containing polymer particles having at least one of a silicon compound portion or section and a metal compound portion or section formed directly or indirectly on the polymer particles.

摘要翻译： 一种用于化学机械抛光晶片上的工作薄膜的方法，该方法需要用含水和复合颗粒的水性分散体进行化学机械抛光，所述复合颗粒含有具有硅化合物部分或部分和 在聚合物颗粒上直接或间接形成的金属化合物部分或部分。

公开(公告)号：US06375545B1

公开(公告)日：2002-04-23

申请号：US09484252

申请日：2000-01-18

申请人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori ,  Masayuki Motonari

发明人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori ,  Masayuki Motonari

IPC分类号： B24B100

CPC分类号： H01L21/3212 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/31053 ,  Y10S977/775 ,  Y10S977/888

摘要： It is an object of the present invention to provide an aqueous dispersion and CMP slurry that can achieve polishing at an adequate rate without producing scratches in the polishing surfaces of wafer working films, and a polishing process for wafer surfaces and a process for manufacture of a semiconductor device using them. A CMP slurry and the like of the present invention contains polymer particles with a crosslinked structure and a mean particle size of 0.13-0.8 &mgr;m. The CMP slurry may contain no surfactant, and may contain the surfactant of not greater than 0.15 wt %. A CMP slurry and the like of another present invention contains polymer particles and inorganic particles of silica, aluminum and the like. A mean particle size of the polymer particles may be not greater than a mean particle size of the inorganic particles. And the mean particle size of the inorganic coagulated particles may be 0.1-1.0 &mgr;m, and may be smaller than the mean particle size of the polymer particles. The CMP slurry is used as a polishing agent and a working film of a silicon oxide film, an aluminum film, a tungsten film or a copper film formed on a wafer is polished. And a semiconductor device is manufactured by using the CMP slurry.

摘要翻译： 本发明的目的是提供一种水分散体和CMP浆料，其可以以足够的速率实现抛光，而不会在晶片工作薄膜的抛光表面中产生划痕，以及用于晶片表面的抛光工艺和制造 半导体器件使用它们。 本发明的CMP浆料等含有交联结构，平均粒径为0.13〜0.8μm的聚合物粒子。 CMP浆料可以不含表面活性剂，并且可以含有不大于0.15重量％的表面活性剂。 另一个本发明的CMP浆料等含有聚合物颗粒和二氧化硅，铝等的无机颗粒。 聚合物颗粒的平均粒径可以不大于无机颗粒的平均粒度。 无机凝结粒子的平均粒径可以为0.1〜1.0μm，并且可以小于聚合物粒子的平均粒径。 将CMP浆料用作抛光剂，并且研磨在晶片上形成的氧化硅膜，铝膜，钨膜或铜膜的工作膜。 并且通过使用CMP浆料制造半导体器件。

公开(公告)号：US5164469A

公开(公告)日：1992-11-17

申请号：US648237

申请日：1991-01-31

申请人： Kohei Goto ,  Zen Komiya ,  Noboru Yamahara ,  Akira Iio ,  Masao Hisatomi ,  Hiroshi Oka

发明人： Kohei Goto ,  Zen Komiya ,  Noboru Yamahara ,  Akira Iio ,  Masao Hisatomi ,  Hiroshi Oka

IPC分类号： C08G61/08 ,  C08L65/00

CPC分类号： C08L65/00 ,  C08G61/08

摘要： A transparent resin material consisting of a hydrogenation product of a (co)polymer obtained by subjecting at least one compound represented by general formula (I) or a combination of at least 5% by weight of said compound and 95% by weight or less of other copolymerizable cyclic olefin monomer to metathesis polymerization: ##STR1## wherein A and B are independently hydrogen atoms or C.sub.1-10 hydrocarbon groups; and X and Y are independently hydrogen atoms, C.sub.1-10 hydrocarbon groups, --C(CH.sub.2).sub.n COOR.sup.1 groups or --(CH.sub.2).sub.n OCOR.sup.1 groups [R.sup.1 is a C.sub.1-20 hydrocarbon group and n is 0 or an integer of 1-10] with the proviso that at least one of X and Y is selected from the above --(CH.sub.2).sub.n COOR.sup.1 and --(CH.sub.2).sub.n OCOR.sup.1 groups. Said transparent resin material is moldable and has sufficient optical properties, low hygroscopicity, good heat resistance and excellent adhesion to recording layer.

摘要翻译： 将由通式（I）表示的至少一种化合物或至少5重量％的所述化合物的组合和95重量％以下的化合物所得的（共）聚合物的氢化产物组成的透明树脂材料 其它可共聚的环烯烃单体进行复分解聚合反应：其中A和B独立地为氢原子或C 1-10烃基; 并且X和Y独立地是氢原子，C 1-10烃基，-C（CH 2）n COOR 1基团或 - （CH 2）nOCOR 1基团[R 1是C 1-20烃基，n是0或1-10的整数] 条件是X和Y中的至少一个选自上述 - （CH 2）n COOR 1和 - （CH 2）nOCOR 1基团。 所述透明树脂材料是可模塑的并且具有足够的光学性能，低吸湿性，良好的耐热性和对记录层的优异粘合性。

公开(公告)号：US06740590B1

公开(公告)日：2004-05-25

申请号：US09531163

申请日：2000-03-17

申请人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori

发明人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori

IPC分类号： H01L21302

CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1436 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/7684

摘要： The object of the present invention is to provide an aqueous dispersion that can give the required properties for a wide range of uses including electronic materials, magnetic materials, optical materials and polishing materials, and to provide an aqueous dispersion for chemical mechanical polishing (CMP slurry) that gives an adequate polishing rate without creating scratches in polishing surfaces. Another object of the present invention is, to provide a method for manufacture of semiconductor devices using a CMP slurry that can control progressive erosion due to scratches and the like during polishing and that can achieve efficient flattening of working films, and to provide a method for formation of embedded wiring. The aqueous dispersion or CMP slurry of the present invention contains polymer particles made of thermoplastic resins or the like, and inorganic particles made of alumina, silica or the like, wherein the zeta potentials of the polymer particles and inorganic particles are of opposite signs, and they are bonded by electrostatic force to form aggregates as composite particles. The aggregates are subjected to ultrasonic wave irradiation or shear stress with a homogenizer to give more uniformly dispersed composite particles.

摘要翻译： 本发明的目的是提供一种水性分散体，其可以为包括电子材料，磁性材料，光学材料和抛光材料在内的广泛用途提供所需的性能，并提供用于化学机械抛光的水性分散体（CMP浆料 ），其提供足够的抛光速率，而不会在抛光表面中产生划痕。 本发明的另一个目的是提供一种使用CMP浆料制造半导体器件的方法，所述CMP浆料可以在抛光期间控制由划痕等引起的逐渐侵蚀，并且可以实现工作膜的有效平坦化，并提供一种方法 形成嵌入式布线。 本发明的水性分散体或CMP浆料含有由热塑性树脂等构成的聚合物颗粒和由氧化铝，二氧化硅等制成的无机颗粒，其中聚合物颗粒和无机颗粒的ζ电位具有相反的标志， 它们通过静电力结合以形成作为复合颗粒的聚集体。 聚集体用均化器进行超声波照射或剪切应力，得到更均匀分散的复合颗粒。

公开(公告)号：US06409780B1

公开(公告)日：2002-06-25

申请号：US09482937

申请日：2000-01-14

申请人： Hiroyuki Yano ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori ,  Kiyonobu Kubota

发明人： Hiroyuki Yano ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori ,  Kiyonobu Kubota

IPC分类号： C09K314

CPC分类号： C09G1/02 ,  C09K3/1463

摘要： Water-laden solid matter is provided which is obtained by adding 40 to 300 weight parts of water to 100 weight parts of inorganic oxide particles synthesized by fumed process or metal evaporation oxidation process, slurry for polishing is provided which is manufactured by using the water-laden solid matter, and a method for manufacturing a semiconductor device using the above slurry. Said water-laden solid matter is within a range of 0.3 to 3 g/cm3 in bulk density and within a range of 0.5 to 100 mm&phgr; in average particle size when manufactured granular. Said slurry for polishing is manufactured from the water-laden solid matter, and the average particle size thereof after being dispersed in water is within a range of 0.05 to 1.0 &mgr;m.

摘要翻译： 提供含水固体物质，其通过向通过热解法或金属蒸发氧化法合成的100重量份的无机氧化物颗粒中加入40至300重量份的水而获得，提供了通过使用水 - 负载固体物质，以及使用上述浆料制造半导体器件的方法。 所述含水固体物质的体积密度为0.3〜3g / cm 3，制粒时的平均粒径为0.5〜100mmφ的范围。 用于抛光的所述浆料由含水固体物质制成，其在分散在水中的平均粒径在0.05-1.0μm的范围内。

公开(公告)号：US06068769A

公开(公告)日：2000-05-30

申请号：US135840

申请日：1998-08-18

申请人： Akira Iio ,  Masayuki Hattori ,  Masayuki Motonari

发明人： Akira Iio ,  Masayuki Hattori ,  Masayuki Motonari

IPC分类号： B01F3/12 ,  B01F7/00 ,  B01F7/30 ,  B24B37/04 ,  B24B57/02 ,  C09D17/00 ,  C09K3/14 ,  B01D24/00 ,  B01D37/00 ,  B03B1/00 ,  C04B33/00

CPC分类号： B24B37/04 ,  B01F3/1221 ,  B01F3/1271 ,  B01F7/30 ,  B24B57/02 ,  C09D17/004 ,  C09K3/1463 ,  B01F2215/0031 ,  B01F2215/005 ,  B01F7/00991

摘要： The present invention provides aqueous dispersion slurry of inorganic particles which is so stable as not to increase in viscosity, gel or sediment even if stored for a long time and therefore can be used as raw materials for, for example, cosmetics, paint, coating materials and lapping slurry for semiconductor wafers, and production method of such aqueous dispersion slurry. The aqueous dispersion slurry according to the present invention has the number of particles whose a particle diameter of 1.3 .mu.m or more is 180,000 or less per mL in terms of 30 wt % in concentration, and the average particle diameter thereof is in a range of 0.05-0.9 .mu.m. The number of particles having aparticle diameter of 1.3 .mu.m or more is counted by using Particle Sensor KS-60, which is a light extinction type sensor for detecting particles, and Particle Counter KL-11, which is a particle counter, both of which made by the same manufacturer, Rion Electro Corp. The average particle diameter is measured by using Laser Particle Analyzer System Par-III made by Otsuka Denshi Co., Ltd.

摘要翻译： 本发明提供无机颗粒的水性分散体浆料，其即使长时间贮存也非常稳定，不会增加粘度，凝胶或沉淀物，因此可用作例如化妆品，油漆，涂料的原料 和研磨用于半导体晶片的浆料，以及这种水分散浆料的制造方法。 本发明的水性分散体浆料的粒径为1.3μm以上的粒子数为30,000重量％以下，其浓度为30重量％，平均粒径为 0.05-0.9亩。 通过使用作为用于检测粒子的消光型传感器的粒子传感器KS-60和作为粒子计数器的粒子计数器KL-11，对具有1.3μm以上的粒径的粒子的数量进行计数 由同一制造商Rion Electro Corp.制造。平均粒径通过使用由Otsuka Denshi Co.，Ltd制造的激光粒子分析仪系统Par-III来测量。

公开(公告)号：US5053471A

公开(公告)日：1991-10-01

申请号：US613939

申请日：1990-11-13

申请人： Kohei Goto ,  Zen Komiya ,  Noboru Yamahara ,  Akira Iio

发明人： Kohei Goto ,  Zen Komiya ,  Noboru Yamahara ,  Akira Iio

IPC分类号： C08G61/08 ,  C08L65/00

CPC分类号： C08L65/00 ,  C08G61/08 ,  G11B7/2538

摘要： A transparent resin material consisting of a (co)polymer obtained by subjecting at least one compound represented by the general formula (I) or a combination of said compound and other copolymerizable monomer to metathesis polymerization, or a hydrogenation product of the (co)polymer: ##STR1## wherein A and B are independently hydrogen atoms or C.sub.1-10 hydrocarbon groups; X and Y are independently hydrogen atoms, C.sub.1-10 hydrocarbon groups, halogen atoms, halogen-substituted C.sub.1-10 hydrocarbon groups, --(CH.sub.2).sub.n COOR.sup.1, --(CH.sub.2).sub.n OCOR.sup.1, --(CH.sub.2).sub.n OR.sup.1, --(CH.sub.2).sub.n CN, --(CH.sub.2).sub.n CONR.sup.2 R.sup.3, --(CH.sub.2).sub.n COOZ, --(CH.sub.2).sub.n OCOZ, --(CH.sub.2).sub.n OZ or --(CH.sub.2).sub.n W [R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are independently C.sub.1-20 hydrocarbon groups, Z is a halogen-substituted hydrocarbon group, W is SiR.sub.p.sup.5 D.sub.3-p (R.sup.5 is a C.sub.1-10 hydrocarbon group, D is a halogen atom, --OCOR.sup.5 or --OR.sup.5, p is 0 or an integer of 1-3), n is 0 or an integer of 1-10] with the proviso that at least one of X and Y is selected from the above groups other than the hydrogen atom and the hydrocarbon groups, or X and Y may form together ##STR2## and m is 0 or 1. Said transparent resin material is moldable and has sufficient optical properties, low hygroscopicity, good heat resistance and excellent adhesion to recording layer.