摘要:
An endoscope system is provided, including an endoscope having a flexible inserting tube to be inserted into a human body and a plurality of bending sensors distributed over the flexible inserting tube along the longitudinal direction thereof. Each of the bending sensors detects the local bending state of the flexible inserting tube at the location the bending sensor are provided. A computer adapted to receive data on the local bending state from each of the plurality of bending sensors is also provided. The computer generates a graphical image representing the geometrical configuration of the flexible inserting tube from the data on the local bending states. A monitor connected to the computer to display the graphical image generated by the computer.
摘要:
A solid-state imaging device includes: a first photodiode made up of a first first-electroconductive-type semiconductor region formed on a first principal face side of a semiconductor substrate, and a first second-electroconductive-type semiconductor region formed within the semiconductor substrate adjacent to the first first-electroconductive-type semiconductor region; a second photodiode made up of a second first-electroconductive-type semiconductor region formed on a second principal face side of the semiconductor substrate, and a second second-electroconductive-type semiconductor region formed within the semiconductor substrate adjacent to the second first-electroconductive-type semiconductor region; and a gate electrode formed on the first principal face side of the semiconductor substrate; with impurity concentration of a connection face between the second first-electroconductive-type semiconductor region and the second second-electroconductive-type semiconductor region being equal to or greater than impurity concentration of a connection face of an opposite layer of the second first-electroconductive-type semiconductor region of the second second-electroconductive-type semiconductor region.
摘要:
The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate 12 and multiple photoelectric converters 40 that are formed on the substrate 12, an insulating film 21 forms an embedded element separating unit 19. The element separating unit 19 is configured of an insulating film 20 having a fixed charge that is formed so as to coat the inner wall face of a groove portion 30, within the groove portion 30 which is formed in the depth direction from the light input side of the substrate 12.
摘要:
A solid-state imaging device includes: a first photodiode made up of a first first-electroconductive-type semiconductor region formed on a first principal face side of a semiconductor substrate, and a first second-electroconductive-type semiconductor region formed within the semiconductor substrate adjacent to the first first-electroconductive-type semiconductor region; a second photodiode made up of a second first-electroconductive-type semiconductor region formed on a second principal face side of the semiconductor substrate, and a second second-electroconductive-type semiconductor region formed within the semiconductor substrate adjacent to the second first-electroconductive-type semiconductor region; and a gate electrode formed on the first principal face side of the semiconductor substrate; with impurity concentration of a connection face between the second first-electroconductive-type semiconductor region and the second second-electroconductive-type semiconductor region being equal to or greater than impurity concentration of a connection face of an opposite layer of the second first-electroconductive-type semiconductor region of the second second-electroconductive-type semiconductor region.
摘要:
A seat belt connector assembly is provided with a seat belt anchor adapted to be coupled to a passenger seat and a cover for accommodating an upper part of the seat belt anchor. The seat belt anchor and the cover, which are relatively movable, are each formed with a seat-belt insertion hole permitting a seat belt to pass therethrough, and are formed with a mark and a through hole, respectively. When the desired relative position permitting the desired tension force to be applied to the seat belt is established between the seat belt anchor and the cover, the mark is made visible through the through hole.
摘要:
An electronic endoscope system including a scope unit for capturing an image of an object illuminated by light using an image sensor and an image processing unit that processes the captured image to generate a video signal, is provided with a first illuminating system that illuminates the object with white light, and a second illuminating system that illuminates the object with light having a special wavelength. At least one operable switch that is operated for switching the Illumination system between the first and second systems is provided, and a switching system that switches the illuminating system between the first and second illuminating systems in response to operation of the operable switch. In such a system, the operable switch is provided at a portion accessible to an operator who is operating the scope unit.
摘要:
A film pressure sensor to be interposed between a cover of an automotive seating equipment and a seat cushion material thereof and used suitably for measuring pressure to be applied to the seating equipment. A temperature sensing area (25) for sensing the temperature of a pressure sensing area (23) is formed on an insulating film (21a or 21b) of the film pressure sensor (20) using a substance whose electrical resistance changes depending on the temperature. Errors in pressure measurement to be caused by change in the temperature can be reduced or removed by utilizing the temperature determined by the temperature sensing area (25).
摘要:
A solid-state image pickup device includes: a silicon layer; a pixel portion formed in the silicon layer for processing and outputting signal charges obtained by carrying out photoelectric conversion for incident lights; an alignment mark formed in a periphery of the pixel portion and in the silicon layer; and a contact portion through which a first electrode within a wiring layer formed on a first surface of the silicon layer, and a second electrode formed on a second surface opposite to the first surface of the silicon layer through an insulating film are connected, wherein the alignment mark and the contact portion are formed from conductive layers made of the same conductive material and formed within respective holes each extending completely through the silicon layer through respective insulating layers made of the same material.
摘要:
In an apparatus for estimating a temperature of a heating element such as IGBT mounted on an electronic printed circuit board, a first temperature and a second temperature at positions away from the heating element are detected, and it is determined whether a cooling device is operative. The temperature of the heating element is estimated based on the first and second temperatures using a first equation when the cooling device is inoperative, whereas it is estimated using a second equation when the cooling device is operative, thereby enabling to accurately estimate the temperature of the heating element equipped with the cooling device.
摘要:
A solid-state imaging device includes a plurality of photoelectric conversion portions each provided in a semiconductor substrate and receives incident light through a light sensing surface, and a pixel separation portion provided to electrically separate a plurality of pixels. At least a pinning layer and a light shielding layer are provided in an inner portion of a trench provided on a side portion of each of the photoelectric conversion portions in an incident surface side, the trench includes a first trench and a second trench formed to be wider than the first trench in a portion shallower than the first trench, the pinning layer is formed in an inner portion of the first trench to cover an inside surface of the second trench, and the light shielding layer is formed to bury an inner portion of the second trench at least via the pinning layer.