公开(公告)号：US06544664B1

公开(公告)日：2003-04-08

申请号：US09577958

申请日：2000-05-24

申请人： Naotomi Takahashi ,  Yoichi Babasaki ,  Tsutomu Higuchi ,  Osamu Nakano ,  Hiroshi Watanabe ,  Masaru Takahashi ,  Makoto Dobashi

发明人： Naotomi Takahashi ,  Yoichi Babasaki ,  Tsutomu Higuchi ,  Osamu Nakano ,  Hiroshi Watanabe ,  Masaru Takahashi ,  Makoto Dobashi

IPC分类号： B32B1500

CPC分类号： H05K3/388 ,  C23C14/16 ,  Y10T428/12438 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/265

摘要： A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.

摘要翻译： 本文公开了一种用于制造印刷电路板的铜箔和包含铜箔的覆铜层压板，铜箔的特征在于，通过气相沉积在铜箔的至少一侧上形成金属铬层， 其特征在于，铜箔的一面由载体通过脱模层支撑，并且通过气相沉积在箔的另一侧上形成金属铬层。 铜箔对各种基板的粘附性（基板和铜箔之间的剥离强度），耐湿性，耐化学性和耐热性优异，因此铜箔可以适用于印刷电路板的制造。

公开(公告)号：US20190114273A1

公开(公告)日：2019-04-18

申请号：US16218600

申请日：2018-12-13

申请人： Hiroshi Watanabe

发明人： Hiroshi Watanabe

IPC分类号： G06F13/20 ,  G06F13/16 ,  H04L29/06 ,  H04L9/32 ,  H04L9/06 ,  H01L29/861 ,  H01L29/788 ,  H01L29/78 ,  H01L49/02 ,  H01L27/112 ,  H01L27/06 ,  H01L23/525 ,  H01L23/522 ,  H01L23/528 ,  G06F21/73 ,  G06F21/44 ,  G06F13/40

CPC分类号： G06F13/20 ,  G06F13/1673 ,  G06F13/4068 ,  G06F21/44 ,  G06F21/73 ,  H01L23/5226 ,  H01L23/5256 ,  H01L23/528 ,  H01L27/0629 ,  H01L27/11286 ,  H01L28/60 ,  H01L29/78 ,  H01L29/7883 ,  H01L29/861 ,  H04L9/0662 ,  H04L9/3278 ,  H04L63/083 ,  H04L63/0876

摘要： A method of using a chip identification device is jointly performed by a chip mass-produced by a semiconductor manufacturing process, a first chip manufacturer making the chip, and a chip user assembling a product by using the chip. The method includes inputting a first published passcode, published by the first chip manufacturer, inputting a second published passcode published by a second chip manufacturer, inputting the first published passcode to the chip by the chip user, reading an aggregate of electronic output signals as a read code, sending the read code to the first chip manufacturer to compare the first output code and the read code. The chip is regarded as a counterfeit if the comparison is consistent.

公开(公告)号：US09894095B2

公开(公告)日：2018-02-13

申请号：US15064693

申请日：2016-03-09

申请人： Hiroshi Watanabe

发明人： Hiroshi Watanabe

IPC分类号： H04L9/32 ,  H04L29/06 ,  G06F21/73 ,  G09C1/00 ,  G06F21/44 ,  G11C16/08 ,  G11C16/10 ,  G11C16/16 ,  G11C16/26 ,  G11C16/34 ,  H01L21/02 ,  H01L23/528

CPC分类号： H04L63/1441 ,  G06F21/44 ,  G06F21/73 ,  G06F2221/2129 ,  G09C1/00 ,  G11C16/08 ,  G11C16/10 ,  G11C16/16 ,  G11C16/26 ,  G11C16/34 ,  H01L21/02236 ,  H01L21/02255 ,  H01L23/528 ,  H04L9/3278 ,  H04L63/083 ,  H04L65/1073

摘要： A technology precluding attacks through peripheral devices thefts to a network of electronic appliance, by utilizing physical chip identification devices, is disclosed. The electronic appliance in the network are divided into the peripheral devices and stem servers managing registration information of the peripheral devices, wherein the stem servers serve as central control using software, and the peripheral devices are managed at device-level by having physical chip identification devices, thus the security of the whole network is efficiently reinforced.

公开(公告)号：US20180019925A1

公开(公告)日：2018-01-18

申请号：US15643672

申请日：2017-07-07

申请人： Hiroshi Watanabe

发明人： Hiroshi Watanabe ,  Te-Chang Tseng ,  Yukihiro Nagai ,  Riichiro Shirota

IPC分类号： H04L12/24 ,  H01L23/535 ,  H01L27/108 ,  H04L29/06

CPC分类号： H04L9/3278 ,  G06F7/588 ,  G06F21/44 ,  G06F21/602 ,  G06F21/70 ,  G06F21/73 ,  G06F21/86 ,  G11C7/24 ,  G11C11/1695 ,  G11C11/2295 ,  G11C13/0059 ,  G11C16/20 ,  G11C16/22 ,  G11C2029/4402 ,  G11C2213/79 ,  H01L23/535 ,  H01L27/10805 ,  H04L9/0861 ,  H04L9/0866 ,  H04L9/32 ,  H04L41/12 ,  H04L69/16 ,  H04L2209/12 ,  H04L2209/805

摘要： A network of electronic appliances includes a plurality of network units of electronic appliances. The network units include a first network unit and a plurality of second network units. The first network unit is connected to at least one of the second network units. Each of the network units includes a stem server and a plurality of peripheral devices connected to the stem server. The stem server includes at least one passcode and at least one list of a plurality of registration codes. Each list is associated to a respective passcode. Each registration code of one list associating to one passcode corresponds to a respective peripheral device. Each registration code is generated in response to a respective passcode using physical randomness of a respective peripheral device in correspondence to the passcode. An address of each identification cell is defined by several word lines and bit lines.

公开(公告)号：US20160277437A1

公开(公告)日：2016-09-22

申请号：US15064693

申请日：2016-03-09

申请人： Hiroshi Watanabe

发明人： Hiroshi Watanabe

IPC分类号： H04L29/06 ,  H01L21/02 ,  H01L23/528 ,  G11C16/34 ,  G11C16/08 ,  G11C16/26 ,  G11C16/10 ,  G06F21/44 ,  G11C16/16

CPC分类号： H04L63/1441 ,  G06F21/44 ,  G06F21/73 ,  G06F2221/2129 ,  G09C1/00 ,  G11C16/08 ,  G11C16/10 ,  G11C16/16 ,  G11C16/26 ,  G11C16/34 ,  H01L21/02236 ,  H01L21/02255 ,  H01L23/528 ,  H04L9/3278 ,  H04L63/083 ,  H04L65/1073

摘要： A technology precluding attacks through peripheral devices thefts to a network of electronic appliance, by utilizing physical chip identification devices, is disclosed. The electronic appliance in the network are divided into the peripheral devices and stem servers managing registration information of the peripheral devices, wherein the stem servers serve as central control using software, and the peripheral devices are managed at device-level by having physical chip identification devices, thus the security of the whole network is efficiently reinforced.

摘要翻译： 公开了一种通过利用物理芯片识别装置来防止外围设备窃取电子设备网络的技术的技术。 网络中的电子设备被分成管理外围设备的注册信息的外围设备和干服务器，其中，干服务器用作使用软件的中央控制，并且外围设备通过具有物理芯片识别设备 从而有效地加强了整个网络的安全性。

公开(公告)号：US20150001958A1

公开(公告)日：2015-01-01

申请号：US14377466

申请日：2012-02-09

申请人： Shigeru Abe ,  Yasuyoshi Kaneko ,  Hiroshi Watanabe ,  Tomio Yasuda

发明人： Shigeru Abe ,  Yasuyoshi Kaneko ,  Hiroshi Watanabe ,  Tomio Yasuda

IPC分类号： H02J5/00

CPC分类号： H02J50/12 ,  B60L15/007 ,  B60L50/16 ,  B60L53/12 ,  B60L53/22 ,  B60L53/34 ,  B60L53/36 ,  B60L2210/30 ,  B60L2210/40 ,  H02J7/022 ,  H02J7/025 ,  H02J50/10 ,  H02M3/33584 ,  H02M7/797 ,  Y02T10/645 ,  Y02T10/70 ,  Y02T10/7005 ,  Y02T10/7077 ,  Y02T10/7088 ,  Y02T10/7241 ,  Y02T10/92 ,  Y02T90/121 ,  Y02T90/122 ,  Y02T90/125 ,  Y02T90/127 ,  Y02T90/14

摘要： An example according to one embodiment includes a first coil and a second coil spaced apart therefrom. The system is supplied with power from a primary-side circuit to a secondary-side circuit and vice versa. The primary-side circuit includes the first coil. The secondary-side circuit includes the second coil. The primary-side circuit connects to a first converter that converts direct current into alternating current and vice versa. The first converter connects to second converter that converts direct current into alternating current and vice versa, and the second converter further connects to a commercial power supply. The secondary-side circuit connects to third converter that converts direct current into alternating current and vice versa, and the third converter further connects to direct current power supply of a moving body. Bidirectional power transfer is performed only by a switching operation of the first converter, the second converter, and the third converter.

摘要翻译： 根据一个实施例的示例包括第一线圈和与其间隔开的第二线圈。 该系统由初级侧电路供电到次级侧电路，反之亦然。 初级侧电路包括第一线圈。 次级侧电路包括第二线圈。 初级侧电路连接到将直流电转换为交流电的第一转换器，反之亦然。 第一转换器连接到将直流转换成交流电的第二转换器，反之亦然，并且第二转换器进一步连接到商用电源。 次级侧电路连接到将直流转换成交流电的第三转换器，反之亦然，第三转换器进一步连接到移动体的直流电源。 仅通过第一转换器，第二转换器和第三转换器的开关操作来执行双向功率传输。

公开(公告)号：US08611972B2

公开(公告)日：2013-12-17

申请号：US12838619

申请日：2010-07-19

申请人： Hirotake Sumi ,  Hiroshi Watanabe

发明人： Hirotake Sumi ,  Hiroshi Watanabe

IPC分类号： H04W88/02

CPC分类号： H01Q1/243 ,  H01Q1/48 ,  H01Q9/16 ,  H01Q9/42 ,  H04M1/0235

摘要： According to one embodiment, a mobile wireless apparatus includes: a first housing; and a second housing configured to be slidably connected to the first housing. The first housing includes: a conductor section; and a conducting member configured comprise a conductive material and to be connected to the conductor section. The second housing includes: a ground circuit; a power feed circuit; a slide member configured to comprise a conductive material, to be connected to the ground circuit, and to be slidably engaged with the first housing; and an unbalanced antenna configured to be connected to the power feed circuit. The conducting member is configured to make contact with the slide member when the first housing is opened with respect to the second housing.

摘要翻译： 根据一个实施例，移动无线设备包括：第一外壳; 以及构造成可滑动地连接到所述第一壳体的第二壳体。 第一壳体包括：导体部分; 并且导电构件构造成包括导电材料并连接到导体部分。 第二壳体包括：接地电路; 供电电路; 滑动构件，其构造成包括导电材料，以连接到接地电路，并且与第一壳体可滑动地接合; 以及被配置为连接到所述馈电电路的不平衡天线。 导电构件被构造成当第一壳体相对于第二壳体打开时与滑动构件接触。

公开(公告)号：US20130288467A1

公开(公告)日：2013-10-31

申请号：US13979564

申请日：2011-06-09

申请人： Yuji Ebiike ,  Takahiro Nakatani ,  Hiroshi Watanabe ,  Yoshio Fujii ,  Sunao Aya ,  Yoshiyuki Nakaki ,  Tsuyoshi Kawakami ,  Shuhei Nakata

发明人： Yuji Ebiike ,  Takahiro Nakatani ,  Hiroshi Watanabe ,  Yoshio Fujii ,  Sunao Aya ,  Yoshiyuki Nakaki ,  Tsuyoshi Kawakami ,  Shuhei Nakata

IPC分类号： H01L21/266

CPC分类号： H01L21/266 ,  H01L21/0465 ,  H01L23/544 ,  H01L29/0619 ,  H01L29/0661 ,  H01L29/1608 ,  H01L29/6606 ,  H01L29/66068 ,  H01L29/872 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device capable of suppressing generation of a high electric field and preventing a dielectric breakdown from occurring, and a method of manufacturing the same. The method of manufacturing a semiconductor device includes (a) preparing an n+ substrate to be a ground constituted by a silicon carbide semiconductor of a first conductivity type, (b) forming a recess structure surrounding an element region on the n+ substrate by using a resist pattern, and (c) forming a guard ring injection layer to be an impurity layer of a second conductivity type in a recess bottom surface and a recess side surface in the recess structure by impurity injection through the resist pattern, and a corner portion of the recess structure is covered with the impurity layer.

摘要翻译： 能够抑制高电场的产生和防止发生电介质击穿的半导体装置及其制造方法。 制造半导体器件的方法包括：（a）制备作为由第一导电类型的碳化硅半导体构成的接地的n +衬底，（b）通过使用抗蚀剂形成围绕n +衬底上的元件区域的凹陷结构 图案，以及（c）通过通过抗蚀剂图案的杂质注入，在凹陷结构的凹槽底表面和凹陷侧表面中形成作为第二导电类型的杂质层的保护环注入层，以及 凹陷结构被杂质层覆盖。

公开(公告)号：US08554491B2

公开(公告)日：2013-10-08

申请号：US13314534

申请日：2011-12-08

申请人： Toshiaki Hisada ,  Hiroshi Kurokawa ,  Nobuhiko Oshida ,  Masafumi Yamamoto ,  Takumi Washio ,  Jun-ichi Okada ,  Hiroshi Watanabe ,  Seiryo Sugiura

发明人： Toshiaki Hisada ,  Hiroshi Kurokawa ,  Nobuhiko Oshida ,  Masafumi Yamamoto ,  Takumi Washio ,  Jun-ichi Okada ,  Hiroshi Watanabe ,  Seiryo Sugiura

IPC分类号： G01N33/50

CPC分类号： G06F19/3437 ,  G06F19/00 ,  G06T11/206 ,  G16H50/50

摘要： A modeling device is disclosed that easily projects characteristic information obtained from an object onto a differently-shaped object, even if the object, from which the characteristic information is obtained, has a complex shape. A modeling device in one embodiment of the present invention includes a virtually electrifying section to calculate an electric potential at a spot in a heart at the time when a predetermined voltage is applied to the heart, and a projecting section to project a fiber orientation onto a heart model created on the basis of shape information that is input to the input section. The projecting section specifies a spot to be a target of projection on the basis of the electric potential obtained by the virtually electrifying section. Use of the electric potential in specifying the spot makes it possible to easily project the fiber orientation onto any heart having complex and various shapes.

摘要翻译： 公开了一种建模装置，即使获得特征信息的对象具有复杂形状，也容易将从对象获得的特征信息投射到不同形状的对象上。 在本发明的一个实施例中的建模装置包括：虚拟带电部分，用于在将预定电压施加到心脏时计算心脏中的点处的电位;以及突出部分，用于将纤维取向投影到 基于输入到输入部分的形状信息创建的心脏模型。 投影部根据实际充电部所得到的电位来指定作为投影对象的点。 在指定斑点时使用电位使得可以容易地将纤维取向投射到具有复杂和各种形状的任何心脏上。

公开(公告)号：US08531140B2

公开(公告)日：2013-09-10

申请号：US13747574

申请日：2013-01-23

申请人： Satoshi Ibori ,  Yoshihiro Uchino ,  Hiroshi Watanabe ,  Masahiro Hiraga

发明人： Satoshi Ibori ,  Yoshihiro Uchino ,  Hiroshi Watanabe ,  Masahiro Hiraga

IPC分类号： H02P3/00

CPC分类号： H02P3/22 ,  H02M1/32 ,  H02M5/458 ,  H02P3/14

摘要： The performance of a power transducer is improved while efficiently using a power semiconductor also by managing the permissible duty factor of the power semiconductor in the regenerative braking circuit provided in the power transducer. The user is allowed to set, through an operation panel provided on the power transducer, the resistance value of the regenerative braking resistor for thermally consuming the rotational energy generated during motor deceleration. The power transducer performs the steps of: calculating the current which flows in the regenerative braking circuit from the resistance value setting; obtaining the generation loss of the power semiconductor in the regenerative braking circuit with the calculated current value; and determining the permissible duty factor of the power semiconductor from the obtained generation loss.

摘要翻译： 功率传感器的性能得到改善，同时通过管理设置在功率传感器中的再生制动电路中的功率半导体的允许占空比来有效地使用功率半导体。 允许用户通过设置在功率传感器上的操作面板设置再生制动电阻器的电阻值，用于热消耗电动机减速期间产生的旋转能量。 功率传感器执行以下步骤：从电阻值设定计算在再生制动电路中流动的电流; 以所计算的电流值获得再生制动电路中的功率半导体的发电损失; 以及从所获得的发电损失确定功率半导体的允许占空比。