Abstract:
A method for manufacturing a semiconductor device includes forming at least one stripe-shaped protection film over a multilayer film in a scribe region of a semiconductor substrate having a plurality of semiconductor element regions formed therein, the protection film having a thickness larger in a center portion thereof than at an end surface thereof and being made of a member which transmits a laser beam, and removing the multilayer film in the scribe region by irradiating the protection film with a laser beam.
Abstract:
An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic component is aligned to the predetermined position of the IC socket using an electronic component attaching tool, the contact pin including a pair of end portions on an upper surface of the fixed part; a movable part that is movable to the fixed part when the movable part is pushed down to apply a force to the contact pin of the fixed part so as to separate the pair of end portions of the contact pin from each other; and a standard part that is formed on the movable part and engages with the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to the predetermined position of the IC socket using the electronic attaching tool, the standard part having a shape which does not substantially depend on an external shape of the electronic component.
Abstract:
A contactor has a film substrate of an insulating material and plural wiring patterns on the substrate. A first end of each wiring pattern extends out from a first edge of the substrate as a first contact terminal and a second end of each wiring pattern extends out from a second edge of the substrate as a second contact terminal, and a part of the contactor located between the first end and second end can be deformed resiliently.
Abstract:
L-aspartic acid is produced by repeating the following respective steps: (1) a reaction step of producing ammonium L-aspartate from an aqueous solution containing monoammonium maleate in accordance with an isomerization reaction and an enzyme reaction caused by aspartase in the presence of ammonia; (2) an ammonia-eliminating step of converting substantially all produced ammonium L-aspartate into monoammonium salt by distilling or stripping a reaction solution obtained in the step (1); (3) a crystallization step of crystallizing L-aspartic acid and producing monoammonium maleate from a solution obtained in the step (2) by adding maleic acid, maleic anhydride or both; (4) a solid-liquid separation step of separating L-aspartic acid crystals precipitated in the step (3) from a mother liquor containing monoammonium maleate; and (5) a recycle step of supplying the mother liquor containing monoammonium maleate obtained in the step (4) to the step (1) to be used as a raw material for the reaction.
Abstract:
A game machine includes a predetermined number of playing balls; a game board provided with a playfield on which the playing balls cascade downward; a launching device configured to launch the playing balls toward the playfield; a supply part configured to supply the playing balls to the launching device; a collecting part configured to collect the playing balls supplied from the supply part to the launching device and launched to the playfield; and a guide part configured to guide the playing balls collected by the collecting part to return to the supply part without discharging the playing balls outside the game machine. The predetermined number of playing balls circulate through the game board, the collecting part, the guide part and the supply part, and can be repeatedly used.
Abstract:
A game machine includes a game board provided with a playfield on which a playing ball cascades downward, a ball receiving hole detection part configured to detect whether or not the playing ball enters a ball receiving hole provided in the playfield, a win determination part configured to determine, when the ball receiving hole detection part detects the playing ball, whether or not a special win is acquired, a game value to be provided for the special win not being determined at a time of provision of the game value, a decision part configured to decide, when the win determination part determines that the special win is acquired, a predetermined game value provided by the special win, and a game value providing part configured to provide the predetermined game value decided by the decision part.
Abstract:
To provide an image pickup apparatus with excellent optical characteristics as well as high reliability and a method of manufacturing the same, capable of efficiently manufacturing the image pickup apparatus in large quantities. The image pickup apparatus of the present invention includes a support board 10, an image pickup device 20 mounted on the support board 10, and a lens component 30 provided on the light receiving region of the image pickup device 20, wherein the lens component 30 has a protrusion part 33 provided around the lens part 31, and the height of the protrusion part 33 from the surface of image pickup device 20 is greater than that of the top 31A of lens part 31 from the surface of the image pickup device 20.
Abstract:
A semiconductor device includes a semiconductor element, a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, a sealing member sealing an edge surface of the transparent member and an edge part of the semiconductor element, and a shock-absorbing member provided between the edge surface of the transparent member and the sealing member and easing a stress which the transparent member receives from the sealing member or the semiconductor element.
Abstract:
A semiconductor device includes a semiconductor element, a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, a sealing member sealing an edge surface of the transparent member and an edge part of the semiconductor element, and a shock-absorbing member provided between the edge surface of the transparent member and the sealing member and easing a stress which the transparent member receives from the sealing member or the semiconductor element.
Abstract:
A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.