公开(公告)号：US08583043B2

公开(公告)日：2013-11-12

申请号：US13094928

申请日：2011-04-27

申请人： Noboru Kato ,  Nobuo Ikemoto ,  Yuya Dokai ,  Koji Shiroki

发明人： Noboru Kato ,  Nobuo Ikemoto ,  Yuya Dokai ,  Koji Shiroki

IPC分类号： H04B7/00

CPC分类号： H01Q9/285 ,  G06K19/07718 ,  G06K19/07735 ,  G06K19/07749 ,  H01L23/60 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q9/24 ,  H01L2924/00

摘要： A high-frequency device includes a wireless IC chip and a board which is coupled to the wireless IC chip and electrically connected to radiator plates, and an inductor and/or a capacitance are provided as a static electricity countermeasure element in the board. The inductor is connected in parallel between the wireless IC chip and the radiator plates, and its impedance at the frequency of static electricity is less than an impedance of the wireless IC chip.

摘要翻译： 高频器件包括无线IC芯片和耦合到无线IC芯片并电连接到散热器板的板，并且在板中提供电感器和/或电容作为静电对抗元件。 电感器并联在无线IC芯片和散热板之间，其静电频率下的阻抗小于无线IC芯片的阻抗。

公开(公告)号：US08360325B2

公开(公告)日：2013-01-29

申请号：US12861945

申请日：2010-08-24

申请人： Takeshi Kataya ,  Noboru Kato ,  Satoshi Ishino ,  Nobuo Ikemoto ,  Ikuhei Kimura ,  Koji Shiroki ,  Yuya Dokai

发明人： Takeshi Kataya ,  Noboru Kato ,  Satoshi Ishino ,  Nobuo Ikemoto ,  Ikuhei Kimura ,  Koji Shiroki ,  Yuya Dokai

IPC分类号： G06K19/06 ,  G06K19/00 ,  H01Q1/38 ,  H01Q9/28

CPC分类号： H01Q9/40 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/285 ,  H05K1/16 ,  Y10T29/49016

摘要： A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.

摘要翻译： 获得无线IC器件和电子设备，其可以在不提供专用天线的情况下实现小型化并且提高散热器板（电极）的增益。 提供了一种无线IC器件，其中在设置在印刷布线电路板上的接地电极中设置环形电极，并且其中处理发送/接收信号的无线IC芯片或电磁耦合模块耦合到环路 电极。 接地电极通过环形电极耦合到无线IC芯片或电磁耦合模块，并且发送或接收高频信号。 接地电极形成有用于调节其谐振频率的狭缝。

公开(公告)号：US09135550B2

公开(公告)日：2015-09-15

申请号：US12797824

申请日：2010-06-10

申请人： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

发明人： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

IPC分类号： G06K19/077

CPC分类号： G06K19/07749 ,  G06K19/07758 ,  G06K19/07786

摘要： A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.

摘要翻译： 无线IC器件包括安装无线IC芯片的辐射板，无线IC芯片和馈电电路板。 馈电电路板包括具有电感元件的谐振电路，并且谐振电路与辐射板电磁耦合。 无线IC芯片插在散热板和馈电电路板之间。

公开(公告)号：US09460376B2

公开(公告)日：2016-10-04

申请号：US12688072

申请日：2010-01-15

申请人： Noboru Kato ,  Satoshi Ishino ,  Takeshi Kataya ,  Ikuhei Kimura ,  Nobuo Ikemoto ,  Yuya Dokai

发明人： Noboru Kato ,  Satoshi Ishino ,  Takeshi Kataya ,  Ikuhei Kimura ,  Nobuo Ikemoto ,  Yuya Dokai

IPC分类号： H01Q1/22 ,  H01Q1/24 ,  G06K19/06 ,  G06K19/077 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q13/10 ,  H05K1/14 ,  H05K1/02 ,  H05K1/16

CPC分类号： G06K19/07749 ,  G06K19/06187 ,  G06K19/0723 ,  G06K19/07756 ,  G06K19/07773 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  G06K19/07786 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q13/10 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/16 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2924/00014 ,  H01L2924/00

摘要： A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

摘要翻译： 无线IC器件包括：电磁耦合模块，包括布置成处理发送和接收信号的无线IC芯片和包括电感元件的馈电电路板。 馈电电路板包括电磁耦合到馈电电路的外部电极，并且外部电极电连接到屏蔽壳体或布线电缆。 屏蔽壳或接线电缆用作辐射板。 无线IC芯片由屏蔽壳或布线接收到的信号进行操作，来自无线IC芯片的应答信号从屏蔽壳或布线电缆向外部辐射。 金属部件用作辐射板，并且金属部件可以是布置在印刷线路板上的接地电极。

公开(公告)号：US08400307B2

公开(公告)日：2013-03-19

申请号：US12959454

申请日：2010-12-03

申请人： Takeshi Kataya ,  Noboru Kato ,  Satoshi Ishino ,  Nobuo Ikemoto ,  Ikuhei Kimura ,  Yuya Dokai

发明人： Takeshi Kataya ,  Noboru Kato ,  Satoshi Ishino ,  Nobuo Ikemoto ,  Ikuhei Kimura ,  Yuya Dokai

IPC分类号： G08B13/14 ,  H04Q5/22 ,  H01L27/08 ,  H01Q1/38 ,  H01Q21/00

CPC分类号： G06K19/07749 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q7/00 ,  H04Q2213/13095 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/141 ,  H05K1/16 ,  H05K2201/10098

摘要： A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.

摘要翻译： 射频IC器件包括布置成处理发送/接收信号的射频IC芯片，安装射频IC芯片的印刷电路板，布置在电路板上的电极和布置在电路板上的环形电极 电路板，使得环形电极电连接到射频IC芯片，并通过电磁耦合耦合到电极。 电极通过环形电极耦合到射频IC芯片，以便发送或接收高频信号。 包括谐振电路和/或匹配电路的电源电路板可以设置在射频IC芯片和环形电极之间。

公开(公告)号：US08081121B2

公开(公告)日：2011-12-20

申请号：US12401767

申请日：2009-03-11

申请人： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

发明人： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

IPC分类号： H01Q1/38

CPC分类号： H04B5/0012 ,  G06K7/10178 ,  G06K19/04 ,  G06K19/07749

摘要： An article having an electromagnetic coupling module attached thereto includes an electromagnetic coupling module and a PET bottle having the electromagnetic coupling module bonded thereto. The electromagnetic coupling module includes a wireless IC chip arranged to process transmission and reception signals and the feed circuit board having the wireless IC chip mounted thereon. The feed circuit board includes a feed circuit including a resonant circuit having a predetermined resonant frequency. The feed circuit performs characteristic impedance matching between the PET bottle and the wireless IC chip. The PET bottle functions as a radiator arranged to radiate a transmission signal supplied from the feed circuit using electromagnetic field coupling and to supply a received reception signal to the feed circuit using electromagnetic field coupling.

摘要翻译： 具有附接有电磁耦合模块的物品包括电磁耦合模块和具有与其结合的电磁耦合模块的PET瓶。 电磁耦合模块包括布置成处理发送和接收信号的无线IC芯片以及安装有无线IC芯片的馈电电路板。 馈电电路板包括具有预定谐振频率的谐振电路的馈电电路。 馈电电路执行PET瓶和无线IC芯片之间的特征阻抗匹配。 PET瓶用作散热器，其布置成使用电磁场耦合辐射从馈电电路提供的传输信号，并使用电磁场耦合将接收到的接收信号提供给馈电电路。

公开(公告)号：US08413907B2

公开(公告)日：2013-04-09

申请号：US13468058

申请日：2012-05-10

申请人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

发明人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

IPC分类号： G06K19/06

CPC分类号： H01Q1/243 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/28 ,  H03H7/38 ,  H03H2007/386 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/165 ,  H05K2201/10098 ,  H01L2924/00012

摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

摘要翻译： 小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线 处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。 馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。 馈电电极并且电磁耦合到辐射板并提供给印刷线路板。 无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US20090262041A1

公开(公告)日：2009-10-22

申请号：US12496709

申请日：2009-07-02

申请人： Nobuo Ikemoto ,  Yuya Dokai ,  Noboru Kato

发明人： Nobuo Ikemoto ,  Yuya Dokai ,  Noboru Kato

IPC分类号： H01Q1/50

CPC分类号： G06K19/0723 ,  G06K19/073 ,  G06K19/07749 ,  G06K19/07756 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01Q1/2225 ,  H01Q1/40 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/20 ,  H04B5/0012

摘要： An electromagnetic coupling module includes a wireless IC chip and a functional substrate. The electromagnetic coupling module is mounted on a radiation plate, preferably using an adhesive, for example. On the upper surface of a base material of the radiation plate, two long radiation electrodes are provided. On the undersurface of the functional substrate, capacitive coupling electrodes that individually face inner ends of the radiation electrodes are provided. A matching circuit arranged to perform the impedance matching between the wireless IC chip and each of the radiation electrodes includes the capacitive coupling electrodes. As a result, it is possible to reduce the size, facilitate the design, and reduce the cost of a wireless IC device.

摘要翻译： 电磁耦合模块包括无线IC芯片和功能基板。 电磁耦合模块例如安装在辐射板上，优选使用粘合剂。 在辐射板的基材的上表面上设置两个长的辐射电极。 在功能基板的下表面上，设置分别面对辐射电极内端的电容耦合电极。 布置成执行无线IC芯片和每个辐射电极之间的阻抗匹配的匹配电路包括电容耦合电极。 结果，可以减小无线IC器件的尺寸，便于设计和降低成本。

公开(公告)号：US08632014B2

公开(公告)日：2014-01-21

申请号：US12510347

申请日：2009-07-28

申请人： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

发明人： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/07758 ,  G06K19/07786

摘要： A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.

摘要翻译： 无线IC器件包括安装无线IC芯片的辐射板，无线IC芯片和馈电电路板。 馈电电路板包括具有电感元件的谐振电路，并且谐振电路与辐射板电磁耦合。 无线IC芯片插在散热板和馈电电路板之间。

公开(公告)号：US08191791B2

公开(公告)日：2012-06-05

申请号：US13022695

申请日：2011-02-08

申请人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

发明人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

IPC分类号： G06K19/06

CPC分类号： H01Q1/243 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/28 ,  H03H7/38 ,  H03H2007/386 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/165 ,  H05K2201/10098 ,  H01L2924/00012

摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

摘要翻译： 小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线 处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。 馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。 馈电电极并且电磁耦合到辐射板并提供给印刷线路板。 无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。